Gas enclosure systems and methods utilizing an auxiliary enclosure

ABSTRACT

The present teachings disclose various embodiments of a gas enclosure system can have a gas enclosure that can include a printing system enclosure and an auxiliary enclosure. In various embodiments of a gas enclosure system of the present teachings, a printing system enclosure can be isolated from an auxiliary enclosure. Various systems and methods of the present teachings can provide for the ongoing management of a printing system by utilizing various embodiments of isolatable enclosures. For example, various measurement and maintenance process steps for the management of a printhead assembly can be performed in an auxiliary enclosure, which can be isolated from a printing system enclosure of a gas enclosure system, thereby preventing or minimizing interruption of a printing process.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. application Ser.No. 14/205,340, filed Mar. 11, 2014. U.S. application Ser. No.14/205,340 is a continuation-in-part of U.S. application Ser. No.13/802,304, filed Mar. 13, 2013, and issued Jun. 2, 2015, as U.S. Pat.No. 9,048,344. U.S. Pat. No. 9,048,344 is a continuation-in-part of U.S.application Ser. No. 13/720,830, filed Dec. 19, 2012; and issued Dec. 2,2014 as U.S. Pat. No. 8,899,171. U.S. Pat. No. 8,899,171 claims thebenefit of U.S. Provisional Application No. 61/579,233, filed Dec. 22,2011. U.S. Pat. No. 8,899,171 is a continuation-in-part of U.S.application Ser. No. 12/652,040, filed Jan. 5, 2010 and issued Feb. 26,2013 as U.S. Pat. No. 8,383,202, which is a continuation-in-part to U.S.application Ser. No. 12/139,391, filed on Jun. 13, 2008, and publishedDec. 18, 2008, as US 2008/0311307. U.S. application Ser. No. 12/652,040also claims the benefit of U.S. Provisional Application No. 61/142,575,filed Jan. 5, 2009. All cross-referenced applications listed herein areincorporated by reference in their entirety.

FIELD

The present teachings relate to various embodiments of a gas enclosuresystem that have an inert, substantially particle-free environment forfabrication of OLED panels on a variety of substrates sizes andsubstrate materials.

OVERVIEW

Interest in the potential of OLED display technology has been driven byOLED display technology attributes that include demonstration of displaypanels that have highly saturated colors, are high-contrast, ultrathin,fast-responding, and energy efficient. Additionally, a variety ofsubstrate materials, including flexible polymeric materials, can be usedin the fabrication of OLED display technology. Though the demonstrationof displays for small screen applications, primarily for cell phones,has served to emphasize the potential of the technology, challengesremain in scaling the fabrication to larger formats. For example,high-volume manufacture of OLED displays on substrates larger than Gen5.5 substrates, which have dimensions of about 130 cm×150 cm, has provenchallenging.

An organic light-emitting diode (OLED) device may be manufactured by theprinting of various organic thin films, as well as other materials, on asubstrate using an OLED printing system. Such organic materials can besusceptible to damage by oxidation and other chemical processes. Housingan OLED printing system in a fashion that can be scaled for varioussubstrate sizes and can be done in an inert, substantially particle-freeprinting environment can present a variety of challenges. Manufacturingtools for large-format substrate printing require substantially largefacilities for housing. Accordingly, maintaining a large facility underan inert atmosphere, which can require gas purification to removereactive atmospheric species, such as water vapor and oxygen, as well asorganic solvent vapors, as well as maintaining a substantiallyparticle-free printing environment, presents significant engineeringchallenges. For example, providing a large facility that is essentiallyhermetically sealed can present engineering challenges. Additionally,various bundles of cabling, wiring, and tubing feeding into and out ofan OLED printing system for operating the printing system can createsignificant dead volume in which reactive gaseous species can beoccluded. Such bundles of cabling, wiring, and tubing can thereforepresent challenges for effectively bringing a gas enclosure intospecification with respect to levels of reactive atmosphericconstituents, such as oxygen and water vapor, as well as organic vapors.Moreover, such bundles of cabling, wiring, and tubing used in theoperation of a printing system can be an ongoing source of particulatematter. As such, providing and maintaining a substantially inert andparticle-free environment in an entire enclosed gas enclosure systemprovides additional challenges not presented for processes that can bedone, for example, in atmospheric conditions under open air, high flowlaminar flow filtration hoods.

In that regard, challenges exist in scaling OLED printing from Gen 3.5to Gen 8.5 and greater, while at the same time providing for a robustenclosure system that can contain an OLED printing system in an inert,substantially particle-free gas enclosure environment with minimaldowntime. Accordingly, there exists a need for various embodiments of agas enclosure system that can house an OLED printing system, in aninert, substantially particle-free environment, and that can be readilyscaled to provide for fabrication of OLED panels on a variety ofsubstrates sizes and substrate materials, while also providing forconducting various measurement and maintenance procedures with minimaldowntime.

BRIEF DESCRIPTION OF THE DRAWINGS

A better understanding of the features and advantages of the presentdisclosure will be obtained by reference to the accompanying drawings,which are intended to illustrate, not limit, the present teachings.

FIG. 1 is a schematic of a gas enclosure system in accordance withvarious embodiments of the present teachings.

FIG. 2 is left, front perspective view of a gas enclosure system inaccordance with various embodiments of the present teachings.

FIG. 3 is right, front perspective view of a gas enclosure assembly inaccordance with various embodiments of the present teachings.

FIG. 4 depicts an exploded view of a gas enclosure assembly inaccordance with various embodiments of the present teachings.

FIG. 5 is an exploded front perspective view of a frame member assemblydepicting various panel frame sections, and section panels in accordancewith various embodiments of the present teachings.

FIG. 6A, FIG. 6B and FIG. 6C are top schematic views of variousembodiments of gasket seals for forming joints.

FIG. 7A and FIG. 7B are various perspective views that depict sealing offrame members according to various embodiments of a gas enclosureassembly of the present teachings.

FIG. 8A and FIG. 8B are various views relating to sealing of a sectionpanel for receiving a readily-removable service window according tovarious embodiments of a gas enclosure assembly of the presentteachings.

FIG. 9A and FIG. 9B are enlarged perspective section views relating tosealing of a section panel for receiving an inset panel or window panelaccording to various embodiments of the present teachings.

FIG. 10 is a view of a ceiling including a lighting system for variousembodiments of a gas enclosure system in accordance with the presentteachings.

FIG. 11 is a graph depicting a LED light spectrum of a lighting systemfor various embodiments of a gas enclosure in accordance with thepresent teachings.

FIG. 12 is a phantom front perspective view of a gas enclosure assembly,which depicts ductwork installed in the interior of a gas enclosureassembly in accordance with various embodiments of the presentteachings.

FIG. 13 is a phantom top perspective view of a gas enclosure assembly,which depicts ductwork installed in the interior of a gas enclosureassembly in accordance with various embodiments of the presentteachings.

FIG. 14 is a phantom bottom perspective view of a gas enclosureassembly, which depicts ductwork installed in the interior of a gasenclosure assembly in accordance with various embodiments of the presentteachings.

FIG. 15 is a schematic of a gas enclosure system in accordance withvarious embodiments of the present teachings.

FIG. 16 is a schematic of a gas enclosure system in accordance withvarious embodiments of the present teachings.

FIG. 17 is a schematic of a gas enclosure system in accordance withvarious embodiments of the present teachings.

FIG. 18 is a schematic of a gas enclosure system in accordance withvarious embodiments of the present teachings.

FIG. 19 is a front perspective view of view of a gas enclosure assemblyin accordance with various embodiments of the present teachings.

FIG. 20A depicts an exploded view of various embodiments of a gasenclosure assembly as depicted in FIG. 19 and related printing system inaccordance with various embodiments of the present teachings. FIG. 20Bdepicts an expanded iso perspective view of the printing system depictedin FIG. 20A.

FIG. 21 depicts a perspective view of a floatation table according tovarious embodiments of the present teachings.

FIG. 22A is a schematic cross-sectional view of a gas enclosure systemaccording to various embodiments of the present teachings.

FIG. 22B and FIG. 22C are schematic cross-sectional views of a gasenclosure system depicting the successive movement of a printheadassembly moving into position for maintenance in accordance with variousembodiments of the present teachings.

FIG. 22D through FIG. 22F are schematic cross-sectional views of a gasenclosure system according to various embodiments of the presentteachings.

FIG. 23 depicts a perspective view of a maintenance station mounted inan auxiliary enclosure of a gas enclosure assembly in accordance withvarious embodiments of the present teachings.

FIG. 24A and FIG. 24B depict various embodiments of systems and methodsaccording to the present teachings.

FIG. 25 is a perspective view of an auxiliary enclosure of a gasenclosure assembly in accordance with various embodiments of the presentteachings.

FIG. 26A is a front perspective view of an OLED printing tool, accordingto various embodiments of systems and methods of the present teachings.

FIG. 26B is a first phantom perspective view of an OLED printing tool asshown in FIG. 26A, according to various embodiments of systems andmethods of the present teachings.

FIG. 26C is a second phantom perspective view of an OLED printing toolas shown in FIG. 26A, according to various embodiments of systems andmethods of the present teachings.

FIG. 27 is an iso perspective view of a printing system according tovarious embodiments of a printing system of the present teachings.

FIG. 28A is a front perspective view of an OLED printing tool, accordingto various embodiments of systems and methods of the present teachings.

FIG. 28B is a schematic plan view of an OLED printing tool, according tovarious embodiments of systems and methods of the present teachings asdepicted in FIG. 28A.

FIG. 28C is a schematic plan view of an OLED printing tool, according tovarious embodiments of systems and methods related to FIG. 28A,according to the present teachings.

FIG. 29A, FIG. 29B, and FIG. 29C are schematic plan views of variousembodiments of a gas enclosure system of the present teachings with anauxiliary enclosure.

FIG. 30A, FIG. 30B, and FIG. 30C are schematic plan views of variousembodiments of a gas enclosure system of the present teachings with anauxiliary enclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The present teachings disclose various embodiments of systems andmethods that can have a gas enclosure that can include a gas enclosureassembly for housing a printing system, i.e. a printing systemenclosure, which can define a first volume or working volume and anauxiliary enclosure defining a second volume. According to the presentteachings, various embodiments of a gas enclosure can have an openingallowing access between a printing system enclosure and an auxiliaryenclosure and an opening allowing access between an auxiliary enclosureand the exterior of a gas enclosure. In various embodiments of a gasenclosure, an opening can be sealably closed. Various embodiments of agas enclosure of the present teaching can have an opening and an openingthat can be sealably closed. According to the present teachings, anauxiliary enclosure can be isolated from a printing system enclosure,for example, by sealably closing an opening allowing access between theprinting system enclosure and the auxiliary enclosure.

Isolating an auxiliary enclosure from a printing system enclosure canallow various procedures related to the management of various componentsof a printhead assembly to be done with minimal or no interruption of aprinting process. A printing system can include various embodiments of aprinthead management system, which can be used for conducting variousmeasurement and maintenance procedures associated with a printheadassembly. A printhead management system can be comprised of severalsubsystems which allow for such measurement tasks, such as the checkingfor nozzle firing, as well as the measurement of drop volume, velocityand trajectory from every nozzle in a printhead, and maintenance tasks,such as wiping or blotting a nozzle surface of excess ink, priming andpurging a printhead by ejecting ink from an ink supply through theprinthead and into a waste basin, and replacement of a printhead or aprinthead device.

Accordingly, each subsystem can have various parts that are consumableby nature, and require replacement, such as replacing blotter paper,ink, and waste reservoirs. Various consumable parts can be packaged forready insertion, for example, in a fully automated mode using a handler.As a non-limiting example, blotter paper can be packaged in a cartridgeformat, which can be readily inserted for use into a blotting module. Byway of another non-limiting example ink can be packaged in a replaceablereservoir, as well as a cartridge format for use in a printing system.Various embodiments of a waste reservoir can be packaged in a cartridgeformat, which can be readily inserted for use into a purge basin module.Additionally, parts of various components of a printing system subjectto ongoing use can require periodic replacement. For example, eachprinthead assembly can include between about 1 to about 60 printheaddevices, where each printhead device can have between about 1 to about30 printheads in each printhead device. As such, various embodiments ofa printing system of the present teachings can have between about 1 toabout 1800 printheads. During a printing process, expedient managementof a printhead assembly, for example, but not limited by, an exchange ofa printhead device or printhead, can be desirable. A printheadreplacement module can have parts, such as a printhead device orprinthead, which can be readily inserted for use into a printheadassembly. A measurement system used for checking for nozzle firing, aswell as the measurement based on optical detection of drop volume,velocity and trajectory from every nozzle can have a source and adetector, which can require periodic replacement after use. Varioushigh-usage parts can be packaged for ready insertion, for example, in afully automated mode using a handler. In that regard, various processsteps related to the ongoing management of a printing system can beperformed in an auxiliary enclosure, which can be separated from aprinting system enclosure. All steps associated with a printheadmanagement procedure can be done to eliminate or minimize the exposureof a printing system enclosure to contamination, such as air and watervapor and various organic vapors, as well as particulate contamination.According to various systems and methods of the present teachings, aprinting system enclosure may be introduced to a level of contaminationthat is sufficiently low that a purification system can remove thecontamination before it can affect a printing process.

Furthermore, given the relatively small volume of an auxiliaryenclosure, recovery of an auxiliary enclosure can take significantlyless time than recovery of an entire printing system enclosure. Forvarious embodiments of systems and methods of the present teachings, anauxiliary enclosure can be less than or equal to about 1% of theenclosure volume of a gas enclosure system. In various embodiments ofsystems and methods of the present teachings, an auxiliary enclosure canbe can be less than or equal to about 2% of the enclosure volume of agas enclosure system. For various embodiments of systems and methods ofthe present teachings, an auxiliary enclosure can be less than or equalto about 5% of the enclosure volume of a gas enclosure system. Invarious embodiments of systems and methods of the present teachings, anauxiliary enclosure can be less than or equal to about 10% of theenclosure volume of a gas enclosure system. In various embodiments ofsystems and methods of the present teachings, an auxiliary enclosure canbe less than or equal to about 20% of the enclosure volume of a gasenclosure system.

Various embodiments of a gas enclosure system including a first volumedefined by a printing system enclosure and a second volume defined by anauxiliary enclosure can include environmental control of variousenvironmental parameters, such as lighting, gas circulation andfiltration, gas purification, and thermal control of the environmentmaintained in a gas enclosure system. Various embodiments of a gasenclosure system can have a uniform controlled environment for both aprinting system enclosure defining a first volume and an auxiliaryenclosure defining a second volume. Such a uniform controlledenvironment for a gas enclosure system can provide, for example, aninert gas environment, as well as a substantially particle-freeenvironment for processes requiring such an environment. Alternatively,various embodiments of a gas enclosure system can provide for acontrolled environment in a printing system enclosure of a gas enclosuresystem that can be maintained under conditions that are different thanthe controlled environment maintained for an auxiliary enclosure.

As previously mentioned, various embodiments of a gas enclosure can havea sealable opening or passageway allowing access between a printingsystem enclosure and an auxiliary enclosure, as well as an openingallowing access between an auxiliary enclosure and the exterior of a gasenclosure. Accordingly, various embodiments of an auxiliary enclosurecan be isolated from a printing system enclosure of a gas enclosuresystem, so that each volume is a separately-functioning section.Furthermore, while a printing system enclosure is isolated from anauxiliary enclosure, an opening between an auxiliary enclosure and theexterior of a gas enclosure can be opened to ambient or non-inert airwithout contaminating a printing system enclosure.

For various embodiments of a gas enclosure system, a sealable opening orpassageway can include, by way of non-limiting examples, an enclosurepanel opening or passageway, a door or a window. According to systemsand methods of the present teachings, a sealable opening or passagewaycan allow access between two volumes or compartments, such as twoenclosures or an enclosure and the exterior environment of a gasenclosure. According to the present teachings, when a sealable openingis sealably closed, isolation of at least one volume or compartment canresult. For example, in various embodiments of the present teachings, aprinting system enclosure can be isolated from an auxiliary enclosure byusing a structural closure to sealably close an opening or passagewayallowing access between a printing system enclosure and an auxiliaryenclosure. Similarly, an auxiliary enclosure can be isolated from theexterior of a gas enclosure assembly by using a structural closure tosealably close an opening or passageway allowing access between anauxiliary enclosure and the environment external to an auxiliaryenclosure. As will be discussed in more detail subsequently, astructural closure can include a variety of sealable coverings for anopening or passageway; such opening or passageway including non-limitingexamples of an enclosure panel opening or passageway, a door or awindow. According to systems and methods of the present teachings, agate can be any structural closure that can be used to reversibly coveror reversibly sealably close any opening or passageway using pneumatic,hydraulic, electrical, or manual actuation.

Moreover, the use of dynamic closure can effectively sealably close anopening or passageway and thereby effectively prevent an enclosure fromcontamination by reactive gases, such as oxygen, water vapor, as well asorganic vapors. For example, in various embodiments of the presentteachings, a printing system enclosure can be isolated from an auxiliaryenclosure by using a dynamic closure to effectively sealably close anopening or passageway allowing access between a printing systemenclosure and an auxiliary enclosure. Similarly, an auxiliary enclosurecan be isolated from the exterior of a gas enclosure assembly by using adynamic closure to effectively sealably close an opening or passagewayallowing access between an auxiliary enclosure and the environmentexternal to an auxiliary enclosure. According to the present teachings,a dynamic closure can include a pressure difference or a gas curtainused between volumes or compartments for example, at an opening orpassageway between a printing system enclosure and an auxiliaryenclosure or an auxiliary enclosure and the exterior of a gas enclosuresystem. By way of a non-limiting example, a printing system enclosurecan be dynamically isolated from an auxiliary enclosure by using apressure differential at an opening or passageway between a printingsystem enclosure and an auxiliary enclosure to prevent the backdiffusion of non-inert gas into the printing system enclosure.Similarly, an auxiliary enclosure can be dynamically isolated from theexterior of a gas enclosure by using a pressure differential at anopening or passageway between an auxiliary enclosure and the exterior ofa gas enclosure to prevent the back diffusion of non-inert gas into theauxiliary enclosure. By way of an additional non-limiting example, aprinting system enclosure can be dynamically isolated from an auxiliaryenclosure using a gas curtain, which can effectively act as a diffusionbarrier between the printing system enclosure and the auxiliaryenclosure. Similarly, an auxiliary enclosure can be dynamically isolatedfrom of the exterior of a gas enclosure using a gas curtain, which caneffectively act as a diffusion barrier between the auxiliary enclosureand the exterior of a gas enclosure.

For various embodiments of a gas enclosure system, an opening orpassageway can be sealably closed using combinations of variousembodiments of a dynamic closure and a structural closure. By way of anon-limiting example, a printing system enclosure can be isolated froman auxiliary enclosure using a sealable covering in combination with adynamic closure such as a pressure difference or a gas curtain betweenan opening or passageway that allows access between the printing systemenclosure and the auxiliary enclosure. Similarly, an auxiliary enclosurecan be isolated from the exterior of a gas enclosure using a sealablecovering in combination with a dynamic closure such as a pressuredifference or a gas curtain between an opening or passageway that allowsaccess between the auxiliary enclosure and the exterior of a gasenclosure. By way of an additional non-limiting example, a printingsystem enclosure can be isolated from an auxiliary enclosure using asealable covering between an opening or passageway that allows accessbetween the printing system enclosure and the auxiliary enclosure, whilean auxiliary enclosure can be isolated from the exterior of a gasenclosure using a dynamic closure such as a pressure difference or a gascurtain between an opening or passageway that allows access between theauxiliary enclosure and the exterior of a gas enclosure.

According to various embodiments of the present teachings, a gasenclosure can have an auxiliary enclosure that can be a variety ofhousings. Various embodiments of an auxiliary enclosure can beconstructed as a section of a gas enclosure assembly for housing aprinting system. Various embodiments of an auxiliary enclosure can befor example, but not limited by, an adaptable controlled-environmentenclosure, a transfer chamber, and a load lock chamber. Variousembodiments of an auxiliary enclosure such as an adaptablecontrolled-environment enclosure, a transfer chamber, and a load lockchamber, can be readily moved from one position to another position. Invarious embodiments, an auxiliary enclosure can define a second volumethat can be maintained as an inert environment. For embodiments of a gasenclosure system of the present teachings, a gas enclosure assembly forhousing a printing system defining a first volume can have a gas volumethat can be maintained at 100 ppm or lower, for example, at 10 ppm orlower, at 1.0 ppm or lower, or at 0.1 ppm or lower for each species ofvarious reactive species, including various reactive atmospheric gases,such as water vapor and oxygen, as well as organic solvent vapors.Additionally, a gas enclosure system of the present teachings, anauxiliary enclosure defining a second volume can have a gas volume thatcan be maintained at 100 ppm or lower, for example, at 10 ppm or lower,at 1.0 ppm or lower, or at 0.1 ppm or lower for each species of variousreactive species, including various reactive atmospheric gases, such aswater vapor and oxygen, as well as organic solvent vapors. Further,various embodiments of a gas enclosure system can provide a low particleprinting environment meeting the standards of International StandardsOrganization Standard (ISO) 14644-1:1999, “Cleanrooms and associatedcontrolled environments—Part 1: Classification of air cleanliness,” asspecified by Class 1 through Class 5.

As previously mentioned, fabrication of OLED displays on substrateslarger than Gen 5.5 substrates, a Gen 5.5 substrate having dimensions ofabout 130 cm×150 cm, presents significant engineering challenges.Generations of mother glass substrate sizes have been undergoingevolution for flat panel displays fabricated by other-than OLED printingsince about the early 1990's. The first generation of mother glasssubstrates, designated as Gen 1, is approximately 30 cm×40 cm, andtherefore could produce a 15″ panel. Around the mid-1990's, the existingtechnology for producing flat panel displays had evolved to a motherglass substrate size of Gen 3.5, which has dimensions of about 60 cm×72cm.

As generations have advanced, mother glass sizes for Gen 7.5 and Gen 8.5are in production for other-than OLED printing fabrication processes. AGen 7.5 mother glass has dimensions of about 195 cm×225 cm, and can becut into eight 42″ or six 47″ flat panels per substrate. The motherglass used in Gen 8.5 is approximately 220 cm×250 cm, and can be cut tosix 55″ or eight 46″ flat panels per substrate. The promise of OLED flatpanel display for qualities such as truer color, higher contrast,thinness, flexibility, transparency, and energy efficiency have beenrealized, at the same time that OLED manufacturing is practicallylimited to Gen 3.5 and smaller. Currently, OLED printing is believed tobe the optimal manufacturing technology to break this limitation andenable OLED panel manufacturing for not only mother glass sizes of Gen3.5 and smaller, but at the largest mother glass sizes, such as Gen 5.5,Gen 7.5, and Gen 8.5. One of the features of OLED panel printingincludes that a variety of substrate materials can be used, for example,but not limited by, a variety of glass substrate materials, as well as avariety of polymeric substrate materials. In that regard, sizes recitedfrom the terminology arising from the use of glass-based substrates canbe applied to substrates of any material suitable for use in OLEDprinting.

It is contemplated that a wide variety of ink formulations can beprinted within the inert, substantially particle-free environment ofvarious embodiments of a gas enclosure system of the present teachings.In addition to various ink formulations for the printing of an emissivelayer (EL) of an OLED substrate, various ink formulations can includeinks comprising one or more components useful in forming at least one ofa hole transport layer (HTL), a hole injection layer (HIL), an electrontransport layer (ETL), and an electron injection layer (EIL) of an OLEDdevice.

It is further contemplated that an organic encapsulation layer can beprinted on an OLED panel using inkjet printing. It is contemplated thatan organic encapsulation layer can be printed using inkjet printing, asinkjet printing can provide several advantages. First, a range of vacuumprocessing operations can be eliminated because such inkjet-basedfabrication can be performed at atmospheric pressure. Additionally,during an inkjet printing process, an organic encapsulation layer can belocalized to cover portions of an OLED substrate over and proximal to anactive region, to effectively encapsulate an active region, includinglateral edges of the active region. The targeted patterning using inkjetprinting results in eliminating material waste, as well as eliminatingadditional processing typically required to achieve patterning of anorganic layer. An encapsulation ink can comprise a polymer including,for example, but not limited by, an acrylate, methacrylate, urethane, orother material, as well as copolymers and mixtures thereof, which can becured using thermal processing (e.g. bake), UV exposure, andcombinations thereof.

With respect to OLED printing, according to the present teachings,maintaining substantially low levels of reactive species, for example,but not limited by, atmospheric constituents such as oxygen and watervapor, as well as various organic solvent vapors used in OLED inks, hasbeen found to correlate to providing OLED flat panel displays meetingthe requisite lifetime specifications. The lifetime specification is ofparticular significance for OLED panel technology, as this correlatesdirectly to display product longevity; a product specification for allpanel technologies, which is currently challenging for OLED paneltechnology to meet. In order to provide panels meeting requisitelifetime specifications, levels of each of a reactive species, such aswater vapor, oxygen, as well as organic solvent vapors, can bemaintained at 100 ppm or lower, for example, at 10 ppm or lower, at 1.0ppm or lower, or at 0.1 ppm or lower with various embodiments of a gasenclosure system of the present teachings. Additionally, OLED printingrequires a substantially particle-free environment. Maintaining asubstantially particle-free environment for OLED printing is ofparticular importance, as even very small particles can lead to avisible defect on an OLED panel. Maintaining a substantiallyparticle-free environment in an entire enclosed system providesadditional challenges not presented by particle reduction for processesthat can be done in atmospheric conditions, such as under open air, highflow laminar flow filtration hoods. As such, maintaining the requisitespecifications for an inert, particle-free environment in a largefacility can present a variety of challenges.

The need for printing an OLED panel in a facility in which the levels ofeach of a reactive species, such as water vapor, oxygen, as well asorganic solvent vapors, can be maintained at 100 ppm or lower, forexample, at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm orlower, can be illustrated in reviewing the information summarized inTable 1. The data summarized on Table 1 resulted from the testing ofeach of a test coupon comprising organic thin film compositions for eachof red, green, and blue, fabricated in a large-pixel, spin-coated deviceformat. Such test coupons are substantially easier to fabricate and testfor the purpose of rapid evaluation of various formulations andprocesses. Though test coupon testing should not be confused withlifetime testing of a printed panel, it can be indicative of the impactof various formulations and processes on lifetime. The results shown inthe table below represent variation in the process step in thefabrication of test coupons in which only the spin-coating environmentvaried for test coupons fabricated in a nitrogen environment wherereactive species were less than 1 ppm compared to test coupons similarlyfabricated but in air instead of a nitrogen environment.

It is evident through the inspection of the data in Table 1 for testcoupons fabricated under different processing environments, particularlyin the case of red and blue, that printing in an environment thateffectively reduces exposure of organic thin film compositions toreactive species may have a substantial impact on the stability ofvarious EMLs, and hence on lifetime.

TABLE 1 Impact of inert gas processing on lifetime for OLED panelsProcess Color Environment V Cd/A CIE (x, y) T95 T80 T50 @ 10 mA/cm² @1000 Cd/m² Red Nitrogen 6 9 (0.61, 0.38) 200 1750 10400 Air 6 8 (0.60,0.39) 30 700 5600 Green Nitrogen 7 66 (0.32, 0.63) 250 3700 32000 Air 761 (0.32, 0.62) 250 2450 19700 Blue Nitrogen 4 5 (0.14, 0.10) 150 7503200 Air 4 5 (0.14, 0.10) 15 250 1800

Additionally, as previously discussed, maintaining a substantiallyparticle-free environment for OLED printing is of particular importance,as even very small particles can lead to a visible defect on an OLEDpanel. Currently, it is a challenge for facilities to produce OLEDdisplays that meet the required low defect levels for commercializationfor either maintaining low levels of each of a reactive species, such aswater vapor, oxygen, as well as organic solvent vapors, as well as formaintaining a sufficiently low-particle environment. Additionally, it iscontemplated that a gas enclosure system would have attributes thatinclude, for example, but are not limited by, a gas enclosure assemblythat can be readily scaled to provide an optimized working volume for anOLED printing system, while providing minimized inert gas volume, andadditionally providing ready access to an OLED printing system from theexterior during processing, while providing access to the interior formaintenance with minimal downtime. In that regard, according to variousembodiments of the present teachings, a gas enclosure assembly forvarious air-sensitive processes that require an inert environment isprovided that can include a plurality of wall frame and ceiling framemembers that can be sealed together. In some embodiments, a plurality ofwall frame and ceiling frame members can be fastened together usingreusable fasteners, for example, bolts and threaded holes. For variousembodiments of a gas enclosure assembly according to the presentteachings, a plurality of frame members, each frame member comprising aplurality of panel frame sections, can be constructed to define a gasenclosure frame assembly.

A gas enclosure assembly of the present teachings can be designed toaccommodate a printing system, such as an OLED printing system, in afashion that can minimize the volume of the enclosure around a system.Various embodiments of such a printing system enclosure can beconstructed in a fashion that minimizes the internal volume of aprinting system enclosure and at the same time optimizes a workingvolume to accommodate various footprints of various OLED printingsystems. For example, an OLED printing system according to variousembodiments of a gas enclosure system of the present teachings, cancomprise, for example, a granite base, a moveable bridge that cansupport an OLED printing device, one or more devices and apparatusesrunning from various embodiments of a pressurized inert gasrecirculation system, such as a substrate floatation table, airbearings, tracks, rails, an ink-jet printer system for depositing OLEDfilm-forming material onto substrates, including an OLED ink supplysubsystem and an inkjet printhead, one or more robots, and the like.Given the variety of components that can comprise OLED printing system,various embodiments of OLED printing system can have a variety offootprints and form factors. Various embodiments of a gas enclosureassembly so constructed additionally provide ready access to theinterior of a gas enclosure assembly from the exterior duringprocessing, in order to readily access a printing system formaintenance, while minimizing downtime. In that regard, variousembodiments of a gas enclosure assembly according to the presentteachings can be contoured with respect to various footprints of variousOLED printing systems. According to various embodiments, once thecontoured fame members are constructed to form a gas enclosure frameassembly, various types of panels may be sealably installed in aplurality of panel sections comprising a frame member to complete theinstallation of a gas enclosure assembly. In various embodiments of agas enclosure assembly, a plurality of frame members including, forexample, but not limited by, a plurality of wall frame members and atleast one ceiling frame member, as well as a plurality of panels forinstallation in panel frame sections, may be fabricated at one locationor locations, and then constructed at another location. Moreover, giventhe transportable nature of components used to construct a gas enclosureassembly of the present teachings, various embodiments of a gasenclosure assembly can be repeatedly installed and removed throughcycles of construction and deconstruction.

Moreover, various embodiments of an auxiliary enclosure can be isolatedfrom the working volume of a printing system enclosure of a gasenclosure system, from the exterior of a gas enclosure or from both byusing a structural closure for a sealable opening, which can be used toallow access, for example, between an auxiliary enclosure and a printingsystem enclosure or an auxiliary enclosure and the exterior of a gasenclosure. For various embodiments of systems and methods of the presentteachings, a structural closure can include a variety of sealablecoverings for an opening or passageway; such opening or passagewayincluding non-limiting examples of an enclosure panel opening orpassageway, a door or a window. According to systems and methods of thepresent teachings, a gate can be any structural closure that can be usedto reversibly cover or reversibly sealably close any opening orpassageway using pneumatic, hydraulic, electrical, or manual actuation.Various embodiments of an auxiliary enclosure can be isolated from theworking volume of a printing system enclosure, from the exterior of agas enclosure or from both by using a dynamic closure such as a pressuredifference or a gas curtain at an opening between a working volume of agas enclosure system and an auxiliary enclosure or at an opening betweenan auxiliary enclosure and the exterior of a gas enclosure. For variousembodiments of a gas enclosure system, an auxiliary enclosure can beisolated from the working volume of a printing system enclosure, fromthe exterior of a gas enclosure or from both using combinations variousembodiments of a structural closure and a dynamic closure.

For various embodiments of systems and methods of the present teachings,an auxiliary enclosure can be less than or equal to about 1% of theenclosure volume of a gas enclosure system. In various embodiments ofsystems and methods of the present teachings, an auxiliary enclosure canbe can be less than or equal to about 2% of the enclosure volume of agas enclosure system. For various embodiments of systems and methods ofthe present teachings, an auxiliary enclosure can be less than or equalto about 5% of the enclosure volume of a gas enclosure system. Invarious embodiments of systems and methods of the present teachings, anauxiliary enclosure can be less than or equal to about 10% of theenclosure volume of a gas enclosure system. In various embodiments ofsystems and methods of the present teachings, an auxiliary enclosure canbe less than or equal to about 20% of the enclosure volume of a gasenclosure system. As such, given the relatively small volume of anauxiliary enclosure, recovery of an auxiliary enclosure can takesignificantly less time than recovery of an entire printing systemenclosure. Therefore, the utilization of an auxiliary enclosure whileperforming various printhead management procedures can minimize oreliminate gas enclosure system downtime.

In order to ensure that a gas enclosure is hermetically sealed, variousembodiments of a gas enclosure assembly of the present teaching providefor joining each frame member to provide frame sealing. The interior canbe sufficiently sealed, for example, hermetically sealed, bytight-fitting intersections between the various frame members, whichinclude gaskets or other seals. Once fully constructed, a sealed gasenclosure assembly can comprise an interior and a plurality of interiorcorner edges, at least one interior corner edge provided at theintersection of each frame member with an adjacent frame member. One ormore of the frame members, for example, at least half of the framemembers, can comprise one or more compressible gaskets fixed along oneor more respective edges thereof. The one or more compressible gasketscan be configured to create an hermetically sealed gas enclosureassembly once a plurality of frame members are joined together, andgas-tight panels installed. A sealed gas enclosure assembly can beformed having corner edges of frame members sealed by a plurality ofcompressible gaskets. For each frame member, for example, but notlimited by, an interior wall frame surface, a top wall frame surface, avertical side wall frame surface, a bottom wall frame surface, and acombination thereof can be provided with one or more compressiblegaskets.

For various embodiments of a gas enclosure assembly, each frame membercan comprise a plurality of sections framed and fabricated to receiveany of a variety of panel types that can be sealably installed in eachsection to provide a gas-tight panel seal for each panel. In variousembodiments of a gas enclosure assembly of the present teachings, eachsection frame can have a section frame gasket that, with selectedfasteners, ensures each panel installed in each section frame canprovide a gas-tight seal for each panel, and therefore for afully-constructed gas enclosure. In various embodiments, a gas enclosureassembly can have one or more of a window panel or service window ineach of a wall panel; where each window panel or service window can haveat least one gloveport. During assembly of a gas enclosure assembly,each gloveport can have a glove attached, so that the glove can extendinto the interior. According to various embodiments, each gloveport canhave hardware for mounting a glove, wherein such hardware utilizesgasket seals around each gloveport that provide a gas-tight seal tominimize leakage or molecular diffusion through the gloveport. Forvarious embodiments of a gas enclosure assembly of the presentteachings, the hardware is further designed for providing ease ofcapping and uncapping a gloveport to an end-user.

Various embodiments of a gas enclosure system according to the presentteachings can include a gas enclosure assembly formed from a pluralityof frame members and panel sections, as well as gas circulation,filtration and purification components. For various embodiments of a gasenclosure system, ductwork may be installed during the assembly process.According to various embodiments of the present teachings, ductwork canbe installed within a gas enclosure frame assembly, which has beenconstructed from a plurality of frame members. In various embodiments,ductwork can be installed on a plurality of frame members before theyare joined to form a gas enclosure frame assembly. Ductwork for variousembodiments of a gas enclosure system can be configured such thatsubstantially all gas drawn into the ductwork from one or more ductworkinlets is moved through various embodiments of a gas circulation andfiltration loop for removing particulate matter internal to a gasenclosure system. Additionally, ductwork of various embodiments of a gasenclosure system can be configured to separate the inlets and outlets ofa gas purification loop that is external to a gas enclosure assemblyfrom a gas circulation and filtration loop that is internal to a gasenclosure assembly. According to various embodiments of a gas enclosuresystem of the present teachings, a gas circulation and filtration systemcan be in fluid communication with, for example, but not limited by,components of a particle control assembly. For various embodiments of agas enclosure assembly, a gas circulation and filtration system can bein fluid communication with a cable tray assembly exhaust system. Forvarious embodiments of a gas enclosure assembly, a gas circulation andfiltration system can be in fluid communication with a printheadassembly exhaust system. In various embodiments of a gas enclosuresystem, various components of a particle control system in fluidcommunication with a gas circulation and filtration system can provide alow particle zone proximal to a substrate positioned in a printingsystem.

For example, a gas enclosure system can have a gas circulation andfiltration system internal a gas enclosure assembly. Such an internalfiltration system can have a plurality of fan filter units within theinterior, and can be configured to provide a laminar flow of gas withinthe interior. The laminar flow can be in a direction from a top of theinterior to a bottom of the interior, or in any other direction.Although a flow of gas generated by a circulating system need not belaminar, a laminar flow of gas can be used to ensure thorough andcomplete turnover of gas in the interior. A laminar flow of gas can alsobe used to minimize turbulence, such turbulence being undesirable as itcan cause particles in the environment to collect in such areas ofturbulence, preventing the filtration system from removing thoseparticles from the environment. Further, to maintain a desiredtemperature in the interior, a thermal regulation system utilizing aplurality of heat exchangers can be provided, for example, operatingwith, adjacent to, or used in conjunction with, a fan or another gascirculating device. A gas purification loop can be configured tocirculate gas from within the interior of a gas enclosure assemblythrough at least one gas purification component exterior the enclosure.In that regard, a circulation and filtration system internal to a gasenclosure assembly in conjunction with a gas purification loop externalto a gas enclosure assembly can provide continuous circulation of asubstantially low-particulate inert gas having substantially low levelsof reactive species throughout a gas enclosure system.

Various embodiments of a gas enclosure system that include a gasenclosure assembly having a gas enclosure defining a first volume and anauxiliary enclosure defining a second volume having a gas purificationsystem can be configured to maintain very low levels of undesiredcomponents, for example, organic solvents and vapors thereof, as well aswater, water vapor, oxygen, and the like. Recalling, various embodimentsof an auxiliary enclosure can be readily integrated with environmentalregulation system components, such as lighting, gas circulation andfiltration, gas purification, and thermostating components of a gasenclosure system. As such, various embodiments of a gas enclosure systemincluding an auxiliary enclosure can have a uniform controlledenvironment for a gas enclosure defining a first volume and an auxiliaryenclosure defining a second volume. Such a controlled environment canprovide, for example, an inert, thermally controlled, and substantiallyparticle-free environment for processes requiring such an environment.In various embodiments of gas enclosure systems of the presentteachings, a controlled environment can provide, for example, athermally controlled and substantially particle-free environment forprocesses requiring such an environment.

Further, various embodiments of a gas enclosure system including anauxiliary enclosure can provide for a controlled environment in aworking portion of a gas enclosure system that can be maintained underconditions that are different than the controlled environment maintainedfor an auxiliary enclosure. Accordingly, various embodiments of anauxiliary enclosure can be isolated from the working volume of a gasenclosure system, so that each volume is a separately-functioningsection. For various embodiments of a gas enclosure system, an auxiliaryenclosure can be isolated from the working volume of a gas enclosuresystem using a structural closure for an opening, such as an enclosurepanel opening or passageway, door or window. For various embodiments ofsystems and methods of the present teachings, a structural closure caninclude a variety of sealable coverings for an opening or passageway;such opening or passageway including non-limiting examples of anenclosure panel opening or passageway, a door or a window. According tosystems and methods of the present teachings, a gate can be anystructural closure that can be used to reversibly cover or reversiblysealably close any opening or passageway using pneumatic, hydraulic,electrical, or manual actuation. Various embodiments of an auxiliaryenclosure can be isolated from the working volume of a gas enclosuresystem using a dynamic closure, such as a pressure difference or a gascurtain, between a working volume of a gas enclosure system and anauxiliary enclosure, and combinations of various embodiments of adynamic closure and a structural closure. Additionally, each of aworking volume of a gas enclosure and an auxiliary enclosure can haveseparately controlled environments, providing the capability ofindependent regulation of, for example, but not limited by, temperature,lighting, particle control, and gas purification. As such, thespecification for the thermal control, lighting control, particlecontrol and inert gas environment control for an auxiliary enclosurevolume and a working volume of a gas enclosure can be set to be the sameor to be different for each volume.

In addition to providing for the gas circulation, filtration andpurification components, the ductwork can be sized and shaped toaccommodate therein at least one of an electrical wire, a wire bundle,as well as various fluid-containing tubings, which when bundled can havea considerable dead volume in which atmospheric constituents, such aswater, water vapor, oxygen, and the like, can be trapped and difficultto remove by the purification system. Additionally, such bundles are anidentified source of particulate matter. In some embodiments, acombination of cables; electrical and optical, as well as electricalwires and wire bundles, and fluid-containing tubing can be disposedsubstantially within the ductwork and can be operatively associated withat least one of an optical system, an electrical system, an opticalsystem, a mechanical system, and a fluidic system, respectively,disposed within the interior. As the gas circulation, filtration andpurification components can be configured such that substantially allcirculated inert gas is drawn through the ductwork, both particulatematter arising from such bundles, as well as atmospheric constituentstrapped in the dead volume of variously bundled materials can beeffectively removed by having such bundled materials contained withinthe ductwork.

Various embodiments of systems and methods of the present teachings caninclude various embodiments of a gas enclosure having a first volume anda second volume, as well as gas circulation, filtration and purificationcomponents, and additionally various embodiments of a pressurized inertgas recirculation system. Such a pressurized inert gas recirculationsystem can be utilized in the operation of an OLED printing system forvarious pneumatically-driven devices and apparatuses, as will bediscussed in more detail subsequently.

According to the present teachings, several engineering challenges wereaddressed in order to provide for various embodiments of a pressurizedinert gas recirculation system in a gas enclosure system. First, undertypical operation of a gas enclosure system without a pressurized inertgas recirculation system, a gas enclosure system can be maintained at aslightly positive internal pressure relative to an external pressure inorder to safeguard against outside gas or air from entering the interiorshould any leaks develop in a gas enclosure system. For example, undertypical operation, for various embodiments of a gas enclosure system ofthe present teachings, the interior of a gas enclosure system can bemaintained at a pressure relative to the surrounding atmosphere externalto the enclosure system, for example, of at least 2 mbarg, for example,at a pressure of at least 4 mbarg, at a pressure of at least 6 mbarg, ata pressure of at least 8 mbarg, or at a higher pressure. Maintaining apressurized inert gas recirculation system within a gas enclosure systemcan be challenging, as it presents a dynamic and ongoing balancing actregarding maintaining a slight positive internal pressure of a gasenclosure system, while at the same time introducing pressurized gasinto a gas enclosure system. Further, variable demand of various devicesand apparatuses can create an irregular pressure profile for various gasenclosure assemblies and systems of the present teachings. Maintaining adynamic pressure balance for a gas enclosure system held at a slightpositive pressure relative to the external environment under suchconditions can provide for the integrity of an ongoing OLED printingprocess.

For various embodiments of a gas enclosure system, a pressurized inertgas recirculation system according to the present teachings can includevarious embodiments of a pressurized inert gas loop that can utilize atleast one of a compressor, an accumulator, and a blower, andcombinations thereof. Various embodiments of a pressurized inert gasrecirculation system that include various embodiments of a pressurizedinert gas loop can have a specially designed pressure-controlled bypassloop that can provide internal pressure of an inert gas in a gasenclosure system of the present teachings at a stable, defined value. Invarious embodiments of a gas enclosure system, a pressurized inert gasrecirculation system can be configured to recirculate pressurized inertgas via a pressure-controlled bypass loop when a pressure of an inertgas in an accumulator of a pressurized inert gas loop exceeds a pre-setthreshold pressure. The threshold pressure can be, for example, within arange from between about 25 psig to about 200 psig, or more specificallywithin a range of between about 75 psig to about 125 psig, or morespecifically within a range from between about 90 psig to about 95 psig.In that regard, a gas enclosure system of the present teachings having apressurized inert gas recirculation system with various embodiments of aspecially designed pressure-controlled bypass loop can maintain abalance of having a pressurized inert gas recirculation system in anhermetically sealed gas enclosure.

According to the present teachings, various devices and apparatuses canbe disposed in the interior and in fluid communication with variousembodiments of a pressurized inert gas recirculation system havingvarious pressurized inert gas loops that can utilize a variety ofpressurized gas sources, such as at least one of a compressor, a blower,and combinations thereof. For various embodiments of a gas enclosure andsystem of the present teachings, the use of various pneumaticallyoperated devices and apparatuses can be provide low-particle generatingperformance, as well as being low maintenance. Exemplary devices andapparatuses that can be disposed in the interior of a gas enclosuresystem and in fluid communication with various pressurized inert gasloops can include, for example, but not limited by, one or more of apneumatic robot, a substrate floatation table, an air bearing, an airbushing, a compressed gas tool, a pneumatic actuator, and combinationsthereof. A substrate floatation table, as well as air bearings can beused for various aspects of operating an OLED printing system inaccordance with various embodiments of a gas enclosure system of thepresent teachings. For example, a substrate floatation table utilizingair-bearing technology can be used to transport a substrate intoposition in a printhead chamber, as well as to support a substrateduring an OLED printing process.

As previously discussed, various embodiments of a substrate floatationtable, as well as air bearings can be useful for the operation ofvarious embodiments of an OLED printing system housed in a gas enclosuresystem according to the present teachings. As shown schematically inFIG. 1 for gas enclosure system 500, a substrate floatation tableutilizing air-bearing technology can be used to transport a substrateinto position in a printhead chamber, as well support a substrate duringan OLED printing process. In FIG. 1, a gas enclosure assembly 1100 forhousing a printing system can be a load-locked system that can have aninlet chamber 1110 for receiving a substrate through inlet gate 1112 andfirst enclosure gate 1114 for moving a substrate from inlet chamber 1110to gas enclosure assembly 1100 for printing. Various gates according tothe present teachings can be used for isolating the chambers from eachother and from the external surroundings. According to the presentteachings, various gates can be a selected from a physical gate and agas curtain.

During the substrate-receiving process, inlet gate 1112 can be open,while first enclosure gate 1114 can be in the closed position in orderto prevent atmospheric gases from entering gas enclosure assembly 1100.Once a substrate is received in inlet chamber 1110, both inlet gate 1112and first enclosure gate 1114 can be closed and inlet chamber 1110 canbe purged with an inert gas, such as nitrogen, any of the noble gases,and any combination thereof, until reactive atmospheric gases are at alow of level of 100 ppm or lower, for example, at 10 ppm or lower, at1.0 ppm or lower, or at 0.1 ppm or lower. After atmospheric gases havereached a sufficiently low level, gate first enclosure gate 1114 can beopened, while inlet gate 1112 remains closed, to allow substrate 2050,to be transported from inlet chamber 1110 to gas enclosure assembly1100, as depicted in FIG. 1. The transport of the substrate from inletchamber 1110 to gas enclosure assembly 1100 can be via, for example, butnot limited by, a floatation table provided in gas enclosure assembly1100 and inlet chamber 1110. The transport of the substrate from inletchamber 1110 to gas enclosure assembly 1100 can also be via, forexample, but not limited by, a substrate transport robot, which canplace substrate 2050 onto a floatation table provided in gas enclosureassembly 1100. Substrate 2050 can remain supported on a substratefloatation table during the printing process.

Various embodiments of gas enclosure system 500 can have outlet chamber1120 in fluid communication with gas enclosure assembly 1100 throughsecond enclosure gate 1124. According to various embodiments of gasenclosure system 500, after the printing process is complete, substrate2050 can be transported from gas enclosure assembly 1100 to outletchamber 1120 through second enclosure gate 1124. The transport of thesubstrate from gas enclosure assembly 1100 to outlet chamber 1120 can bevia, for example, but not limited by, a floatation table provided in gasenclosure assembly 1100 and outlet chamber 1120. The transport of thesubstrate from gas enclosure assembly 1100 to outlet chamber 1120 canalso be via, for example, but not limited by, a substrate transportrobot, which can pick up substrate 2050 from a floatation table providedin gas enclosure assembly 1100 and transport it into outlet chamber1120. For various embodiments of gas enclosure system 500, substrate2050 can be retrieved from outlet chamber 1120 via outlet gate 1122,when second enclosure gate 1124 is in a closed position in order toprevent reactive atmospheric gases from entering gas enclosure assembly1100.

In addition to a load-locked system that includes an inlet chamber 1110and an outlet chamber 1120, which are in fluid communication with gasenclosure assembly 1100 via first enclosure gate 1114 and secondenclosure gate 1124 respectively, gas enclosure system 500 can includesystem controller 1130. System controller 1130 can include one or moreprocessor circuits (not shown) in communication with one or more memorycircuits (not shown). System controller 1130 can also communicate with aload-locked system that includes an inlet chamber 1110 and an outletchamber 1120 and ultimately with a print nozzle of an OLED printingsystem. In this manner, system controller 1130 can coordinate openingand closing of gates 1112, 1114, 1122 and 1124. System controller 1130can also control ink dispensing to a print nozzle of an OLED printingsystem. Substrate 2050 can be transported through various embodiments ofa load-locked system of the present teachings that includes an inletchamber 1110 and an outlet chamber 1120, which are in fluidcommunication with gas enclosure assembly 1100 via gates 1114 and 1124respectively, via for example, but not limited by, a substratefloatation table utilizing air-bearing technology or a combination offloatation tables utilizing air-bearing technology and substratetransport robots.

Various embodiments of a load-locked system of FIG. 1 can also includepneumatic control system 1150, which can include a vacuum source and aninert gas source that can include nitrogen, any of the noble gases, andany combination thereof. A substrate floatation system housed within gasenclosure system 500 can include multiple vacuum ports and gas bearingports, which are typically arranged on a flat surface. Substrate 2050can be lifted and kept off of a hard surface by the pressure of an inertgas such as nitrogen, any of the noble gases, and any combinationthereof. The flow out of the bearing volume is accomplished by means ofmultiple vacuum ports. The floating height of substrate 2050 over asubstrate floatation table is typically a function of gas pressure andgas flow. Vacuum and pressure of pneumatic control system 1150 can beused to support substrate 2050 during handling inside the gas enclosureassembly 1100 in the load-locked system of FIG. 1, for example, duringprinting. Control system 1150 can also be used to support substrate 2050during transport through load-locked system of FIG. 1 that includes aninlet chamber 1110 and an outlet chamber 1120, which are in fluidcommunication with gas enclosure assembly 1100 via gates 1114 and 1124respectively. To control transporting substrate 2050 through gasenclosure system 500, system controller 1130 communicates with inert gassource 1152 and vacuum 1154 through valves 1156 and 1158, respectively.Additional vacuum and inert gas supply lines and valving, not shown, canbe provided to the gas enclosure system 500, illustrated by thelock-locked system in FIG. 1, to further provide the various gas andvacuum facilities needed for controlling the enclosed environment.

To lend a more dimensional perspective to various embodiments of a gasenclosure system according to the present teachings, FIG. 2 is a leftfront perspective view of various embodiments of gas enclosure system501. FIG. 2 depicts a load-locked system including various embodimentsof gas enclosure assembly 100, which will be discussed subsequently. Gasenclosure system 501 can have load-locked inlet chamber 1110, which canhave inlet gate 1112. Gas enclosure system 501 of FIG. 2 can include agas purification system 3130 for providing gas enclosure assembly 100with a constant supply of inert gas having substantially low levels ofreactive atmospheric species, such as water vapor and oxygen, as well asorganic solvent vapors that result from an OLED printing process. Gasenclosure system 501 of FIG. 2 can also have controller system 1130 forsystem control functions, as previously discussed.

FIG. 3 is a right, front perspective view of a fully-constructed gasenclosure assembly 100 according to various embodiments of the presentteachings. Gas enclosure assembly 100 can contain one or more gases formaintaining an inert environment in a gas enclosure assembly interior. Agas enclosure system of the present teachings can be useful inmaintaining an inert gas atmosphere in the interior. An inert gas may beany gas that does not undergo a chemical reaction under a defined set ofconditions. Some commonly used examples of an inert gas can includenitrogen, any of the noble gases, and any combination thereof. Gasenclosure assembly 100 is configured to encompass and protect anair-sensitive process, such as the printing of an organic light emittingdiode (OLED) ink using an industrial printing system. Examples ofatmospheric gases that are reactive to OLED inks include water vapor andoxygen. As previously discussed, gas enclosure assembly 100 can beconfigured to maintain a sealed atmosphere and allow the component orprinting system to operate effectively while avoiding contamination,oxidation, and damage to otherwise reactive materials and substrates.

As depicted in FIG. 3, various embodiments of gas enclosure assembly 100can comprise component parts including a front or first wall panel 210′,a left, or second wall panel (not shown), a right or third wall panel230′, a back or forth wall panel (not shown), and ceiling panel 250′,which gas enclosure assembly can be attached to pan 204, which rests ona base (not shown). As will be discussed in more detail subsequently,various embodiments of a gas enclosure assembly 100 of FIG. 3 can beconstructed from a front or first wall frame 210, a left, or second wallframe (not shown), a right or third wall frame 230, a back or forth wallpanel (not shown), and a ceiling frame 250. Various embodiments of aceiling frame 250 can include a fan filter unit cover 103, as well asfirst ceiling frame duct 105, and first ceiling frame duct 107.According to embodiments of the present teachings, various types ofsection panels may be installed in any of a plurality of panel sectioncomprising a frame member. In various embodiments of gas enclosure 100of FIG. 1, sheet metal panel sections 109 can be welded into a framemember during the construction of a frame. For various embodiments ofgas enclosure assembly 100, types of section panels can that can berepeatedly installed and removed through cycles of construction anddeconstruction of a gas enclosure assembly can include an inset panel110, as indicated for wall panel 210′, as well as a window panel 120 andreadily-removable service window 130, as indicated for wall panel 230′.

Though readily-removable service window 130 can provide ready access tothe interior of enclosure 100, any panel that is removable can be usedto provide access to the interior of a gas enclosure system for thepurpose of repair and regular service. Such access for service or repairis differentiated from the access provided by panels such as windowpanel 120 and readily-removable service window 130, which can provide anend-user glove access to the interior of a gas enclosure assembly duringuse from the exterior of a gas enclosure assembly. For example, any ofthe gloves, such as glove 142, which is attached to gloveport 140, asshown in FIG. 3 for panel 230, can provide an end-user access to theinterior during use of a gas enclosure system.

FIG. 4 depicts an exploded view of various embodiments of a gasenclosure assembly as depicted in FIG. 3. Various embodiments of a gasenclosure assembly can have a plurality of wall panels, includingoutside perspective view of front wall panel 210′, outside perspectiveview of left wall panel 220′, interior perspective view of a right wallpanel 230′, interior perspective view of rear wall panel 240′, and topperspective view of ceiling panel 250′, which as shown in FIG. 3 can beattached to pan 204, which rests upon base 202. An OLED printing systemcan mounted on top of pan 204, which printing processes are known to besensitive to atmospheric conditions. According to the present teachings,a gas enclosure assembly can be constructed from frame members, forexample, wall frame 210 of wall panel 210′, wall frame 220 of wall panel220′, wall frame 230 of wall panel 230′, wall frame 240 of wall panel240′, and ceiling frame 250 of ceiling panel 250′, in which a pluralityof section panels can then be installed. In that regard, it can bedesirable to streamline the design of section panels that can berepeatedly installed and removed through cycles of construction anddeconstruction of various embodiments of a gas enclosure assembly of thepresent teachings. Moreover, contouring of a gas enclosure assembly 100can be done to accommodate a footprint of various embodiments of an OLEDprinting system in order to minimize the volume of inert gas required ina gas enclosure assembly, as well as providing ready access to anend-user; both during use of a gas enclosure assembly, as well as duringmaintenance.

Using front wall panel 210′ and left wall panel 220′ as exemplary,various embodiments of a frame member can have sheet metal panelsections 109 welded into a frame member during frame memberconstruction. Inset panel 110, window panel 120 and readily-removableservice window 130 can be installed in each of a wall frame member, andcan be repeatedly installed and removed through cycles of constructionand deconstruction of gas enclosure assembly 100 of FIG. 4. As can beseen; in the example of wall panel 210′ and wall panel 220′, a wallpanel can have a window panel 120 proximal to a readily-removableservice window 130. Similarly, as depicted in the example rear wallpanel 240′, a wall panel can have a window panel such as window panel125, which has two adjacent gloveports 140. For various embodiments ofwall frame members according to the present teachings, and as seen forgas enclosure assembly 100 of FIG. 3, such an arrangement of glovesprovides easy access from the exterior of a gas enclosure to componentparts within an enclosed system. Accordingly, various embodiments of agas enclosure can provide two or more gloveports so that an end-user canextend a left glove and a right glove into the interior and manipulateone or more items in the interior, without disturbing the composition ofthe gaseous atmosphere within the interior. For example, any of windowpanel 120 and service window 130 can be positioned to facilitate easyaccess from the exterior of a gas enclosure assembly to an adjustablecomponent in the interior of a gas enclosure assembly. According tovarious embodiments of a window panel, such as window panel 120 andservice window 130, when end-user access through a gloveport glove isnot indicated, such windows may not include a gloveport and gloveportassembly.

Various embodiments of wall and ceiling panels, as depicted in FIG. 4,can have a plurality of an inset panel 110. As can be seen in FIG. 4,inset panels can have a variety of shapes and aspect ratios. In additionto inset panels, ceiling panel 250′ can have a fan filter unit cover 103as well as first ceiling frame duct 105, and second ceiling frame duct107, mounted, bolted, screwed, fixed, or otherwise secured to ceilingframe 250. As will be discussed in more detail subsequently, ductwork influid communication with duct 107 of ceiling panel 250′ can be installedwithin the interior of a gas enclosure assembly. According to thepresent teachings, such ductwork can be part of a gas circulation systeminternal to a gas enclosure assembly, as well as providing forseparating the flow stream exiting a gas enclosure assembly forcirculation through at least one gas purification component external toa gas enclosure assembly.

FIG. 5 is an exploded front perspective view of frame member assembly200, in which wall frame 220 can be constructed to include a completecomplement of panels. Though not limited to the design shown, framemember assembly 200, using wall frame 220, can be used as exemplary forvarious embodiments of a frame member assembly according to the presentteachings. Various embodiments of a frame member assembly can becomprised of various frame members and section panels installed invarious frame panel sections of various frame members according to thepresent teachings.

According to various embodiments of various frame member assemblies ofthe present teachings, frame member assembly 200 can be comprised of aframe member, such as wall frame 220. For various embodiments of a gasenclosure assembly, such as gas enclosure assembly 100 of FIG. 3,processes that may utilize equipment housed in such a gas enclosureassembly may not only require an hermetically sealed enclosure providingan inert environment, but an environment substantially free ofparticulate matter. In that regard, a frame member according to thepresent teachings may utilize variously dimensioned metal tube materialsfor the construction of various embodiments of a frame. Such metal tubematerials address desired material attributes, including, but notlimited by, a high-integrity material that will not degrade to produceparticulate matter, as well as producing a frame member having highstrength, yet optimal weight, providing for ready transport,construction, and deconstruction from one site to another site of a gasenclosure assembly comprising various frame members and panel sections.Any material satisfying these requirements can be utilized for creatingvarious frame members according to the present teachings.

For example, various embodiments of a frame member according to thepresent teachings, such as frame member assembly 200, can be constructedfrom extruded metal tubing. According to various embodiments of a framemember, aluminum, steel, and a variety of metal composite materials maybe utilized for constructing a frame member. In various embodiments,metal tubing having dimensions of, for example, but not limited by,2″w×2″h, 4″w×2″h and 4″w×4″h and having ⅛″ to ¼″ wall thickness can beused to construct various embodiments of frame members according to thepresent teachings. Additionally, a variety of reinforced fiber polymericcomposite materials of a variety of tube or other forms are availablethat have the material attributes including, but not limited by, ahigh-integrity material that will not degrade to produce particulatematter, as well as producing a frame member having high strength, yetoptimal weight, providing for ready transport, construction, anddeconstruction from one site to another site.

Regarding construction of various frame members from variouslydimensioned metal tube materials, it is contemplated that welding tocreate various embodiments of frame weldments can be done. Additionally,construction of various frame members from variously dimensionedbuilding materials can be done using an appropriate industrial adhesive.It is contemplated that the construction of various frame members shouldbe done in a fashion that would not intrinsically create leak pathsthrough a frame member. In that regard, construction of various framemembers can be done using any approach that does not intrinsicallycreate leak paths through a frame member for various embodiments of agas enclosure assembly. Further, various embodiments of frame membersaccording to the present teachings, such as wall frame 220 of FIG. 4,may be painted or coated. For various embodiments of a frame member madefrom a metal tubing material prone, for example, to oxidation, wherematerial formed at the surface may create particulate matter, paintingor coating, or other surface treatment, such as anodizing, to preventthe formation of particulate matter can be done.

A frame member assembly, such as frame member assembly 200 of FIG. 5,can have a frame member, such as wall frame 220. Wall frame 220 can havetop 226, upon which a top wall frame spacer plate 227 can be fastened,as well as a bottom 228, upon which a bottom wall frame spacer plate 229can be fastened. As will be discussed in more detail subsequently,spacer plates mounted on surfaces of a frame member are a part of agasket sealing system, which in conjunction with the gasket sealing ofpanels mounted in frame member sections, provides for hermetic sealingof various embodiments of a gas enclosure assembly according to thepresent teachings. A frame member, such as wall frame 220 of framemember assembly 200 of FIG. 5, can have several panel frame sections,where each section can be fabricated to receive various types of panels,such as, but not limited by, an inset panel 110, a window panel 120 anda readily-removable service window 130. Various types of panel sectionscan be formed in the construction of a frame member. Types of panelsections can include, for example, but not limited by, an inset panelsection 10, for receiving inset panel 110, a window panel section 20,for receiving window panel 120, and a service window panel section 30,for receiving readily-removable service window 130.

Each type of panel section can have a panel section frame to receive apanel, and can provide that each panel can be sealably fastened intoeach panel section in accordance with the present teachings forconstructing an hermetically sealed gas enclosure assembly. For example,in FIG. 5 depicting a frame assembly according to the present teachings,inset panel section 10 is shown to have frame 12, window panel section20 is shown to have frame 22, and service window panel section 30 isshown to have frame 32. For various embodiments of a wall frame assemblyof the present teachings, various panel section frames can be a metalsheet material welded into the panel sections with a continuousweld-bead to provide a hermetic seal. For various embodiments of a wallframe assembly, various panel section frames can be made from a varietyof sheet materials, including building materials selected fromreinforced fiber polymeric composite materials, which can be mounted ina panel section using an appropriate industrial adhesive. As will bediscussed in more detail in subsequent teachings concerning sealing,each panel section frame can have a compressible gasket disposed thereonto ensure that a gas-tight seal can be formed for each panel installedand fastened in each panel section. In addition to a panel sectionframe, each frame member section can have hardware related topositioning a panel, as well as to securely fastening a panel in a panelsection.

Various embodiments of inset panel 110 and panel frame 122 for windowpanel 120 can be constructed from sheet metal material, such as, but notlimited by, aluminum, various alloys of aluminum and stainless steel.The attributes for the panel material can be the same as they are forthe structural material constituting various embodiments of framemembers. In that regard, materials having attributes for various panelmembers include, but not are limited by, a high integrity material thatwill not degrade to produce particulate matter, as well as producing apanel having high strength, yet optimal weight, in order to provide forready transport, construction, and deconstruction from one site toanother site. Various embodiments of, for example, honeycomb core sheetmaterial can have the requisite attributes for use as panel material forconstruction of inset panel 110 and panel frame 122 for window panel120. Honeycomb core sheet material can be made of a variety ofmaterials; both metal, as well as metal composite and polymeric, as wellas polymer composite honeycomb core sheet material. Various embodimentsof removable panels when fabricated from a metal material can haveground connections included in the panel to ensure that when a gasenclosure assembly is constructed that the entire structure is grounded.

Given the transportable nature of components used to construct a gasenclosure assembly of the present teachings, any of the variousembodiments of section panels of the present teachings can be repeatedlyinstalled and removed during use of a gas enclosure system to provideaccess to the interior of a gas enclosure assembly.

For example, panel section 30 for receiving a readily-removable servicewindow panel 130 can have a set of four spacers, of which one isindicated as window guide spacer 34. Additionally, panel section 30,which is constructed for receiving a readily-removable service windowpanel 130, can have a set of four clamping cleats 36, which can be usedto clamp service window 130 into service window panel section 30 using aset of four of a reverse acting toggle clamp 136 mounted on servicewindow frame 132 for each of a readily removable service window 130.Further, two of each of a window handle 138 can be mounted onreadily-removable service window frame 132 to provide an end-user easeof removal and installation of service window 130. The number, type, andplacement of removable service window handles can be varied.Additionally, service window panel section 30 for receiving areadily-removable service window panel 130 can have at least two of awindow clamp 35, selectively installed in each service window panelsection 30. Though depicted as in the top and bottom of each of servicewindow panel section 30, at least two window clamps can be installed inany fashion that acts to secure service window 130 in panel sectionframe 32. A tool can be used to remove and install window clamp 35, inorder to allow service window 130 to be removed and reinstalled.

Reverse acting toggle clamp 136 of service window 130, as well ashardware installed on panel section 30, including clamping cleat 36,window guide spacer 34, and window clamp 35, can be constructed of anysuitable material, as well as combination of materials. For example, oneor more such elements can comprise at least one metal, at least oneceramic, at least one plastic, and a combination thereof. Removableservice window handle 138 can be constructed of any suitable material,as well as a combination of materials. For example, one or more suchelements can comprise at least one metal, at least one ceramic, at leastone plastic, at least one rubber, and a combination thereof. Enclosurewindows, such as window 124 of window panel 120, or window 134 ofservice window 130, can comprise any suitable material as well as acombination of materials. According to various embodiments of a gasenclosure assembly of the present teachings, enclosure windows cancomprise a transparent and a translucent material. In variousembodiments of a gas enclosure assembly, enclosure windows can comprisesilica-based materials, for example, but not limited by, such as glassand quartz, as well as various types of polymeric-based materials, forexample, but not limited by, such as various classes of polycarbonate,acrylic, and vinyl. Various composites and combinations thereof ofexemplary window materials can also be useful as transparent andtranslucent materials according to the present teachings.

As will be discussed in the following teachings for FIGS. 8A-9B, walland ceiling frame member seals in conjunction with gas-tight sectionpanel frame seals together provide for various embodiments of anhermetically-sealed gas enclosure assembly for air-sensitive processesthat require an inert environment. Components of a gas enclosure systemthat contribute to providing substantially low concentrations ofreactive species, as well as substantially low particulate environmentcan include, but are not limited by, an hermetically sealed gasenclosure assembly, as well as a highly effective gas circulation andparticle filtration system, including ductwork. Providing effectivehermetic seals for a gas enclosure assembly can be challenging;especially where three frame members come together to form a three-sidedjoint. As such, three-sided joint sealing presents a particularlydifficult challenge with respect to providing readily-installablehermetic sealing for a gas enclosure assembly that can be assembled anddisassembled through cycles of construction and deconstruction.

In that regard, various embodiments of a gas enclosure assemblyaccording to the present teachings provide for hermetic sealing of afully-constructed gas enclosure system through effective gasket sealingof joints, as well as providing effective gasket sealing around loadbearing building components. Unlike conventional joint sealing, jointsealing according to the present teachings: 1) includes uniform parallelalignment of abutted gasket segments from orthogonally oriented gasketlengths at top and bottom terminal frame joint junctures where threeframe members are joined, thereby avoiding angular seam alignment andsealing, 2) provides for forming the abutted lengths across an entirewidth of a joint, thereby increasing the sealing contact area atthree-sided joint junctures, 3) is designed with spacer plates thatprovide uniform compression force across all vertical, and horizontal,as well as top and bottom three-sided joint gasket seals. Additionally,the selection of the gasket material can impact the effectiveness ofproviding an hermetic seal, which will be discussed subsequently.

FIG. 6A through FIG. 6C are top schematic views that depict a comparisonof conventional three-sided joint seals to three-sided joint sealsaccording to the present teachings. According to various embodiments ofa gas enclosure assembly the present teachings, there can be, forexample, but not limited by, at least four wall frame members, a ceilingframe member and a pan, that can be joined to form a gas enclosureassembly, creating a plurality of vertical, horizontal, and three-sidedjoints requiring hermetic sealing. In FIG. 6A, a top schematic view of aconventional three-sided gasket seal formed from a first gasket I, whichis orthogonally oriented to gasket II in the X-Y plane. As shown in FIG.6A, a seam formed from the orthogonal orientation in the X-Y plane has acontact length W₁ between the two segments defined by the dimension ofwidth of the gasket. Additionally, a terminal end portion of gasket III,which is a gasket orthogonally oriented to both gasket I and gasket IIin the vertical direction, can abut gasket I and gasket II, as indicatedby the hatching. In FIG. 6B, a top schematic view of a conventionalthree-sided joint gasket seal formed from a first gasket length I, whichis orthogonal to a second gasket length II, and has a seam joining 45°faces of both lengths, where the seam has a contact length W₂ betweenthe two segments that is greater than the width of the gasket material.Similarly to the configuration of FIG. 6A, an end portion of gasket III,which is orthogonal to both gasket I and gasket II in the verticaldirection can abut gasket I and gasket II, as indicated by the hatching.Assuming that the gaskets widths are the same in FIG. 6A and FIG. 6B,the contact length W₂ for FIG. 6B is greater than the contact length W₁for FIG. 6A.

FIG. 6C is a top schematic view of a three-sided joint gasket sealaccording to the present teachings. A first gasket length I can have agasket segment I′ formed orthogonally to the direction of gasket lengthI, where gasket segment I′ has a length that can be approximately thedimension of the width of a structural component being joined, such as a4″w×2″h or 4″w×4″h metal tube used to form various wall frame members ofa gas enclosure assembly of the present teachings. Gasket II isorthogonal to gasket I in the X-Y plane, and has gasket segment II′,which has an overlapping length with gasket segment I′ that isapproximately the width of structural components being joined. The widthof gasket segments I′ and II′ are the width of a compressible gasketmaterial selected. Gasket III is orthogonally oriented to both gasket Iand gasket II in the vertical direction. Gasket segment III′ is an endportion of gasket III. Gasket segment III′ is formed from the orthogonalorientation of gasket segment III′ to the vertical length of gasket III.Gasket segment III′ can be formed so that it has approximately the samelength as gasket segments I′ and II′, and a width that is the thicknessof a compressible gasket material selected. In that regard, the contactlength W₃ for the three aligned segments shown in FIG. 6C is greaterthan for the conventional three-corner joint seals shown in either FIG.6A or FIG. 6B, having contact length W₁ and W₂, respectively.

In that regard, three-sided joint gasket sealing according to thepresent teachings creates uniform parallel alignment of gasket segmentsat terminal joint junctures from what would otherwise be orthogonallyaligned gaskets, as shown in the case of FIG. 6A and FIG. 6B. Suchuniform parallel alignment of the three-sided joint gasket sealingsegments provides for applying a uniform lateral sealing force acrossthe segments to promote an hermetic three-sided joint seal at the topand bottom corners of joints formed from wall frame members.Additionally, each segment of the uniformly aligned gasket segments foreach three-sided joint seal is selected to be approximately the width ofthe structural components being joined, providing for a maximum lengthof contact of the uniformly aligned segments. Moreover, joint sealingaccording to the present teachings is designed with spacer plates thatprovide a uniform compression force across all vertical, horizontal, andthree-sided gasket seals of a building joint. It may be argued that thewidth of the gasket material selected for conventional three-sided sealsgiven for the examples of FIGS. 6A and 6B could be at least the width ofstructural components being joined.

The exploded perspective view of FIG. 7A, depicts sealing assembly 300according to the present teachings before all frame members have beenjoined, so that the gaskets are depicted in an uncompressed state. InFIG. 7A, a plurality of wall frame members, such as wall frame 310, wallframe 350, as well as ceiling frame 370 can be sealably joined in afirst step of the construction of a gas enclosure from variouscomponents of a gas enclosure assembly. Frame member sealing accordingto the present teachings is a substantial part of providing that a gasenclosure assembly once fully constructed is hermetically sealed, aswell as providing sealing that can be implemented through cycles ofconstruction and deconstruction of a gas enclosure assembly. Though theexample given in the following teachings for FIGS. 7A-7B are for thesealing of a portion of a gas enclosure assembly, such teachings applyto the entirety of any of a gas enclosure assembly of the presentteachings.

First wall frame 310 depicted in FIG. 7A can have interior side 311 onwhich spacer plate 312 is mounted, vertical side 314, and top surface315 on which spacer plate 316 is mounted. First wall frame 310 can havefirst gasket 320 disposed in and adhered to a space formed from spacerplate 312. Gap 302, remaining after first gasket 320 is disposed in andadhered to a space formed from spacer plate 312, can run a verticallength of first gasket 320, as shown in FIG. 7A. As depicted in FIG. 7A,compliant gasket 320 can be disposed in and adhered to the space formedfrom spacer plate 312, and can have vertical gasket length 321,curvilinear gasket length 323, and gasket length 325 that is formed 90°in plane to vertical gasket length 321 on interior frame member 311 andterminates at vertical side 314 of wall frame 310. In FIG. 7A, firstwall frame 310 can have top surface 315 on which spacer plate 316 ismounted, thereby forming a space on surface 315 on which second gasket340 is disposed in and adhered to proximal to inner edge 317 of wallframe 310. Gap 304, remaining after second gasket 340 is disposed in andadhered to a space formed from spacer plate 316, can run a horizontallength of second gasket 340, as shown in FIG. 7A. Further, as indicatedby the hatched line, length 345 of gasket 340 is uniformly parallel andcontiguously aligned with length 325 of gasket 320.

Second wall frame 350 depicted in FIG. 7A can have exterior frame side353, vertical side 354, and top surface 355 on which spacer plate 356 ismounted. Second wall frame 350 can have first gasket 360 disposed in andadhered to first gasket a space, which is formed from spacer plate 356.Gap 306, remaining after first gasket 360 is disposed in and adhered toa space formed from spacer plate 356, can run a horizontal length offirst gasket 360, as shown in FIG. 7A. As depicted in FIG. 7A, compliantgasket 360 can have horizontal length 361, curvilinear length 363, andlength 365 that is formed 90° in plane on top surface 355 and terminatesat exterior frame member 353.

As indicated in the exploded perspective view of FIG. 7A, interior framemember 311 of wall frame 310 can be joined to vertical side 354 of wallframe 350 to form one building joint of a gas enclosure frame assembly.Regarding the sealing of a building joint so formed, in variousembodiments of gasket sealing at terminal joint junctures of wall framemembers according to the present teachings as depicted in FIG. 7A,length 325 of gasket 320, length 365 of gasket 360 and length 345 ofgasket 340 are all contiguously and uniformly aligned. Additionally, aswill be discussed in more detail subsequently, various embodiments of aspacer plate of the present teachings can provide for a uniformcompression of between about 20% to about 40% deflection of acompressible gasket material used for hermetically sealing variousembodiments of a gas enclosure assembly of the present teachings.

FIG. 7B depicts sealing assembly 300 according to the present teachingsafter all frame members have been joined, so that the gaskets aredepicted in a compressed state. FIG. 7B is perspective view that showsthe detail of corner seal of a three-sided joint formed at the topterminal joint juncture between first wall frame 310, second wall frame350 and ceiling frame 370; which is shown in phantom view. As shown inFIG. 7B, the gasket spaces defined by the spacer plates can bedetermined to be a width, such that upon joining wall frame 310, wallframe 350 and ceiling frame 370; shown in phantom view, a uniformcompression of between about 20% to about 40% deflection of acompressible gasket material for forming vertical, horizontal, andthree-sided gasket seals ensures that gasket sealing at all surfacessealed at joints of wall frame members can provide hermetic sealing.Additionally gasket gaps 302, 304, and 306 (not shown) are dimensioned,so that upon optimal compression of between about 20% to about 40%deflection of a compressible gasket material, each gasket can fill agasket gap as shown for gasket 340 and gasket 360 in FIG. 7B. As such,in addition to providing uniform compression by defining a space inwhich each gasket is disposed in and adhered to, various embodiments ofa spacer plate designed to provide a gap also ensure that eachcompressed gasket can conform within the spaces defined by a spacerplate without wrinkling or bulging or otherwise irregularly forming in acompressed state in a fashion that could form leak paths.

According to various embodiments of a gas enclosure assembly of thepresent teachings, various types of section panels can be sealed usingcompressible gasket material disposed on each of a panel section frame.In conjunction with the frame member gasket sealing, the locations andmaterials of the compressible gaskets used to form seals between thevarious section panels and panel section frames can provide for anhermetically sealed gas enclosure assembly with little or no gasleakage. Additionally, the sealing design for all types of panels, suchas inset panel 110, window panel 120 and readily-removable servicewindow 130 of FIG. 5, can provide for durable panel sealing afterrepeated removal and installation of such panels that may be required asto access the interior of a gas enclosure assembly, for example, formaintenance.

For example, FIG. 8A, is an exploded view depicting service window panelsection 30, and readily-removable service window 130. As previouslydiscussed, service window panel section 30 can be fabricated forreceiving readily-removable service window 130. For various embodimentsof a gas enclosure assembly, a panel section, such as removable servicepanel section 30, can have panel section frame 32, as well ascompressible gasket 38 disposed on panel section frame 32. In variousembodiments, hardware related to fastening readily-removable servicewindow 130 in removable service window panel section 30 can provide easeof installation and reinstallation to an end-user, and at the same timeensure that a gas-tight seal is maintained when readily-removableservice window 130 is installed and reinstalled in panel section 30 asneeded by an end-user requiring direct access to the interior of a gasenclosure assembly. Readily-removable service window 130 can includerigid window frame 132, which can be constructed from, for example, butnot limited by, a metal tube material as described for constructing anyof the frame members of the present teachings. Service window 130 canutilize quick-acting fastening hardware, for example, but not limited byreverse acting toggle clamp 136 in order to provide an end-user readyremoval and reinstallation of service window 130.

As shown in front view of removable service window panel section 30 ofFIG. 8A, readily-removable service window 130 can have a set of fourtoggle clamps 136 secured on window frame 132. Service window 130 can bepositioned into panel section frame 30 at a defined distance forinsuring a proper compression force against gasket 38. Using a set offour window guide spacers 34, as shown in FIG. 8B, of which can beinstalled in each corner of panel section 30 for positioning servicewindow 130 in panel section 30. A set of each of a clamping cleat 36 canbe provided to receive reverse acting toggle clamp 136 of readilyremovable service window 130. According to various embodiments for thehermetic sealing of service window 130 through cycles of installationand removal, the combination of the mechanical strength of servicewindow frame 132, in conjunction with the defined position of servicewindow 130 provided by a set of window guide spacers 34 with respect tocompressible gasket 38 can ensure that once service window 130 issecured in place with, for example, but not limited by, using reverseaction toggle clamps 136 fastened in respective clamping cleats 36,service window frame 132 can provide an even force over panel sectionframe 32 with defined compression as set by a set of window guidespacers 34. The set of window guide spacers 34 are positioned so thatthe compression force of window 130 on gasket 38 deflects compressiblegasket 38 between about 20% to about 40%. In that regard, theconstruction of service window 130, as well as fabrication of panelsection 30 provide for a gas-tight seal of service window 130 in panelsection 30. As previously discussed, window clamps 35 can be installedinto panel section 30 after service window 130 is fastened into panelsection 30, and removed when service window 130 needs to be removed.

Reverse acting toggle clamp 136 can be secured to a readily-removableservice window frame 132 using any suitable means, as well as acombination of means. Examples of suitable securing means that can beused include at least one adhesive, for example, but not limited by anepoxy, or a cement, at least one bolt, at least one screw, at least oneother fastener, at least one slot, at least one track, at least oneweld, and a combination thereof. Reverse acting toggle clamp 136 can bedirectly connected to removable service window frame 132 or indirectlythrough an adaptor plate. Reverse acting toggle clamp 136, clampingcleat 36, window guide spacer 34, and window clamp 35 can be constructedof any suitable material, as well as a combination of materials. Forexample, one or more such elements can comprise at least one metal, atleast one ceramic, at least one plastic, and a combination thereof.

In addition to sealing a readily-removable service window, gas-tightsealing can also be provided for inset panels and window panels. Othertypes of section panels that can be repeatedly installed and removed inpanel sections include, for example, but not limited by, inset panels110 and window panels 120, as shown in FIG. 5. As can be seen in FIG. 5,panel frame 122 of window panel 120 is constructed similarly to insetpanel 110. As such, according to various embodiments of a gas enclosureassembly, the fabrication of panel sections for receiving inset panelsand window panels can be the same. In that regard, the sealing of insetpanels and window panel can be implemented using the same principles.

With reference to FIG. 9A and FIG. 9B, and according to variousembodiments of the present teachings, any of the panels of gasenclosure, such as gas enclosure assembly 100 of FIG. 1, can include oneor more inset panel sections 10, which can have frames 12 configured toreceive a respective inset panel 110. FIG. 9A is a perspective viewindicating an enlarged portion shown in FIG. 9B. In FIG. 9A inset panel110 is depicted positioned with respect to inset frame 12. As can beseen in FIG. 9B, inset panel 110 is affixed to frame 12, where frame 12can be, for example, constructed of a metal. In some embodiments, themetal can comprise aluminum, steel, copper, stainless steel, chromium,an alloy, and combinations thereof, and the like. A plurality of a blindtapped hole 14 can be made in inset panel section frame 12. Panelsection frame 12 is constructed so as to comprise a gasket 16 betweeninset panel 110 and frame 12, in which compressible gasket 18 can bedisposed. Blind tapped hole 14 can be of the M5 variety. Screw 15 can bereceived by blind tapped hole 14, compressing gasket 16 between insetpanel 110 and frame 12. Once fastened into place against gasket 16,inset panel 110 forms a gas-tight seal within inset panel section 10. Aspreviously discussed, such panel sealing can be implemented for avariety of section panels, including, but not limited by, inset panels110 and window panels 120, as shown in FIG. 5.

According to various embodiments of compressible gaskets according tothe present teachings, compressible gasket material for frame membersealing and panel sealing can be selected from a variety of compressiblepolymeric materials, for example, but not limited by, any in the classof closed-cell polymeric materials, also referred to in the art asexpanded rubber materials or expanded polymer materials. Briefly, aclosed-cell polymer is prepared in a fashion whereby gas is enclosed indiscrete cells; where each discrete cell is enclosed by the polymericmaterial. Properties of compressible closed-cell polymeric gasketmaterials that are desirable for use in gas-tight sealing of frame andpanel components include, but are not limited by, that they are robustto chemical attack over a wide range of chemical species, possessexcellent moisture-barrier properties, are resilient over a broadtemperature range, and they are resistant to a permanent compressionset. In general, compared to open-cell-structured polymeric materials,closed-cell polymeric materials have higher dimensional stability, lowermoisture absorption coefficients, and higher strength. Various types ofpolymeric materials from which closed-cell polymeric materials can bemade include, for example, but not limited by, silicone, neoprene,ethylene-propylene-diene terpolymer (EPT); polymers and composites madeusing ethylene-propylene-diene-monomer (EPDM), vinyl nitrile,styrene-butadiene rubber (SBR), and various copolymers and blendsthereof.

The desirable material properties of closed-cell polymers are maintainedonly if the cells comprising the bulk material remain intact during use.In that regard, using such material in a fashion that can exceedmaterial specifications set for a closed-cell polymer, for example,exceeding the specification for use within a prescribed temperature orcompression range may cause degradation of a gasket seal. In variousembodiments of closed-cell polymer gaskets used for sealing framemembers and section panels in frame panel sections, compression of suchmaterials should not exceed between about 50% to about 70% deflection,and for optimal performance can be between about 20% to about 40%deflection.

In addition to close-cell compressible gasket materials, another exampleof a class of compressible gasket material having desired attributes foruse in constructing embodiments of a gas enclosure assembly according tothe present teachings includes the class of hollow-extruded compressiblegasket materials. Hollow-extruded gasket materials as a class ofmaterials have the desirable attributes, including, but not limited by,that they are robust to chemical attack over a wide range of chemicalspecies, possess excellent moisture-barrier properties, are resilientover a broad temperature range, and they are resistant to a permanentcompression set. Such hollow-extruded compressible gasket materials cancome in a wide variety of form factors, such as for example, but notlimited by, U-cell, D-cell, square-cell, rectangular-cell, as well asany of a variety of custom form factor hollow-extruded gasket materials.Various hollow-extruded gasket materials can be fabricated frompolymeric materials that are used for closed-cell compressible gasketfabrication. For example, but not limited by, various embodiments ofhollow-extruded gaskets can be fabricated from silicone, neoprene,ethylene-propylene-diene terpolymer (EPT); polymers and composites madeusing ethylene-propylene-diene-monomer (EPDM), vinyl nitrile,styrene-butadiene rubber (SBR), and various copolymers and blendsthereof. Compression of such hollow cell gasket materials should notexceed about 50% deflection in order to maintain the desired attributes.

While the class of close-cell compressible gasket materials and theclass of hollow-extruded compressible gasket materials have been givenas examples, any compressible gasket material having the desiredattributes can be used for sealing structural components, such asvarious wall and ceiling frame members, as well as sealing variouspanels in panel section frames, as provided by the present teachings.

FIG. 10 is a bottom view of various embodiments of a ceiling panel ofthe present teaching, for example, such as ceiling panel 250′ of gasenclosure assembly 100 of FIG. 3. According to various embodiments ofthe present teachings for the assembly of a gas enclosure, lighting canbe installed on the interior top surface of a ceiling panel, such asceiling panel 250′ of gas enclosure assembly 100 of FIG. 3. As depictedin FIG. 10, ceiling frame 250, having interior portion 251, can havelighting installed on the interior portion of various frame members. Forexample, ceiling frame 250 can have two ceiling frame sections 40, whichhave in common two ceiling frame beams 42 and 44. Each ceiling framesection 40 can have a first side 41, positioned towards the interior ofceiling frame 250, and a second side 43, positioned towards the exteriorof ceiling frame 250. For various embodiments according to the presentteaching of providing lighting for a gas enclosure system, pairs oflighting elements 46 can be installed. Each pair of lighting elements 46can include a first lighting element 45, proximal to first side 41 andsecond lighting element 47 proximal to second side 43 of a ceiling framesection 40. The number, positioning, and grouping of lighting elementsshown in FIG. 10 are exemplary. The number and grouping of lightingelements can be varied in any desired or suitable manner. In variousembodiments, the lighting elements can be mounted flat, while in otherembodiments that can be mounted so that they can be moved to a varietyof positions and angles. The placement of lighting elements is notlimited to the top panel ceiling 433 but can located, in addition or inthe alternative, on any other interior surface, exterior surface, andcombination of surfaces of gas enclosure assembly 100 shown in FIG. 3.

The various lighting elements can comprise any number, type, orcombination of lights, for example, halogen lights, white lights,incandescent lights, arc lamps, or light emitting diodes or devices(LEDs). For example, each lighting element can comprise from 1 LED toabout 100 LEDs, from about 10 LEDs to about 50 LEDs, or greater than 100LEDs. LED or other lighting devices can emit any color or combination ofcolors in the color spectrum, outside the color spectrum, or acombination thereof. According to various embodiments of a gas enclosureassembly used for inkjet printing of OLED materials, as some materialsare sensitive to some wavelengths of light, a wavelength of light forlighting devices installed in a gas enclosure assembly can bespecifically selected to avoid material degradation during processing.For example, a 4× cool white LED can be used as can a 4× yellow LED orany combination thereof. An example of a 4× cool white LED is anLF1B-D4S-2THWW4 available from IDEC Corporation of Sunnyvale, Calif. Anexample of a 4× yellow LED that can be used is an LF1B-D4S-2SHY6 alsoavailable from IDEC Corporation. LEDs or other lighting elements can bepositioned or hung from any position on interior portion 251 of ceilingframe 250 or on another surface of a gas enclosure assembly. Lightingelements are not limited to LEDs. Any suitable lighting element orcombination of lighting elements can be used. FIG. 11 is a graph of anIDEC LED light spectra and shows the X-axis corresponding to intensitywhen peak intensity is 100% and the Y-axis corresponding to wavelengthin nanometers. Spectra for LF1B yellow type, a yellow fluorescent lamp,a LF1B white type LED, a LF1B cool white type LED, and an LF1B red typeLED are shown. Other light spectra and combinations of light spectra canbe used in accordance with various embodiments of the present teachings.

A gas enclosure system according to the present teachings can have a gascirculation and filtration system internal a gas enclosure assembly.Such an internal filtration system can have a plurality of fan filterunits within the interior, and can be configured to provide a laminarflow of gas within the interior. The laminar flow can be in a directionfrom a top of the interior to a bottom of the interior, or in any otherdirection. Although a flow of gas generated by a circulating system neednot be laminar, a laminar flow of gas can be used to ensure thorough andcomplete turnover of gas in the interior. A laminar flow of gas can alsobe used to minimize turbulence, such turbulence being undesirable as itcan cause particles in the environment to collect in such areas ofturbulence, preventing the filtration system from removing thoseparticles from the environment.

FIG. 12 depicts a right front phantom perspective view of circulationand filtration system 1500, which can include ductwork assembly 1501 andfan filter unit assembly 1502 of gas enclosure assembly 100. Enclosureductwork assembly 1501 can have front wall panel ductwork assembly 1510.As shown front wall panel ductwork assembly 1510 can have front wallpanel inlet duct 1512, first front wall panel riser 1514 and secondfront wall panel riser 1516, both of which are in fluid communicationwith front wall panel inlet duct 1512. First front wall panel riser 1514is shown having outlet 1515, which is sealably engaged with ceiling duct1505 of fan filter unit cover 103. In a similar fashion, second frontwall panel riser 1516 is shown having outlet 1517, which is sealablyengaged with ceiling duct 1507 of fan filter unit cover 103. In thatregard, front wall panel ductwork assembly 1510 provides for circulatinginert gas within a gas enclosure system from the bottom, utilizing frontwall panel inlet duct 1512, through each front wall panel riser, 1514and 1516, and delivering the air through outlets 1505 and 1507,respectively, so that the air can be filtered by, for example, fanfilter unit 1552 of fan filter unit assembly 1502. Proximal fan filterunit 1552 is heat exchanger 1562, which as part of a thermal regulationsystem, can maintain inert gas circulating through gas enclosureassembly 100 at a desired temperature.

Right wall panel ductwork assembly 1530 can have right wall panel inletduct 1532, which is in fluid communication with right wall panel upperduct 1538 through right wall panel first riser 1534 and right wall panelsecond riser 1536. Right wall panel upper duct 1538, can have first ductinlet end 1535 and second duct outlet end 1537, which second duct outletend 1537 is in fluid communication with rear wall panel upper duct 1546of rear wall ductwork assembly 1540. Left wall panel ductwork assembly1520 can have the same components as described for right wall panelassembly 1530, of which left wall panel inlet duct 1522, which is influid communication with left wall panel upper duct (not shown) throughfirst left wall panel riser 1524 and first left wall panel riser 1524are apparent in FIG. 12. Rear wall panel ductwork assembly 1540 can haverear wall panel inlet duct 1542, which is in fluid communication withleft wall panel assembly 1520 and right wall panel assembly 1530.Additionally, rear wall panel ductwork assembly 1540, can have rear wallpanel bottom duct 1544, which can have rear wall panel first inlet 1541and rear wall panel second inlet 1543. Rear wall panel bottom duct 1544can be in fluid communication with rear wall panel upper duct 1546 viafirst bulkhead 1547 and second bulkhead 1549, which bulkhead structurescan be used to feed, for example, but not limited by, various bundles ofcables, wires, and tubings and the like, from the exterior of gasenclosure assembly 100 into the interior. Duct opening 1533 provides formoving bundles of cables, wires, and tubings and the like, out of rearwall panel upper duct 1546, which can be passed through rear wall panelupper duct 1546 via bulkhead 1549. Bulkhead 1547 and bulkhead 1549 canbe hermetically sealed on the exterior using a removable inset panel, aspreviously described. Rear wall panel upper duct is in fluidcommunication with, for example, but not limited by, fan filter unit1554 through vent 545, of which a corner is shown in FIG. 12. In thatregard, left wall panel ductwork assembly 1520, right wall panelductwork assembly 1530, and rear wall panel ductwork assembly 1540provide for circulating inert gas within a gas enclosure assembly fromthe bottom, utilizing wall panel inlet ducts 1522, 1532, and 1542,respectively, as well as rear panel lower duct 1544, which are in fluidcommunication with vent 1545 through various risers, ducts, bulkheadpassages, and the like as previously described. Accordingly, air can befiltered by, for example, fan filter unit 1554 of fan filter unitassembly 1502 of circulation and filtration system 1500. Proximal fanfilter unit 1554 is heat exchanger 1564, which as part of a thermalregulation system, can maintain inert gas circulating through gasenclosure assembly 100 at a desired temperature. As will be discussed inmore detail subsequently, the number, size and shape of fan filter unitsfor a fan filter unit assembly, such as fan filter unit assembly 1502including fan filter unit 1552 and 1554 of circulation and filtrationsystem 1500, can be selected in accordance with the physical position ofa substrate in a printing system during processing. The number, size andshape of fan filter units for a fan filter unit assembly selected withrespect to the physical travel of a substrate can provide a low-particlezone proximal a substrate during a substrate manufacturing process.

In FIG. 12, cable feed through opening 1533 is shown. As will bediscussed in more detail subsequently, various embodiments of a gasenclosure assembly of the present teachings provide for bringing bundlesof cables, wires, and tubings and the like through ductwork. In order toeliminate leak paths formed around such bundles, various approaches forsealing differently sized cables, wires, and tubings in a bundle usingconforming material can be used. Also shown in FIG. 12 for enclosureductwork assembly 1501 is conduit I and conduit II, which are shown aspart of fan filter unit cover 103. Conduit I provides an outlet of inertgas to an external gas purification system, while conduit II provides areturn of purified inert gas to the circulation and filtration loopinternal gas enclosure assembly 100.

In FIG. 13, a top phantom perspective view of enclosure ductworkassembly 1501 is shown. The symmetric nature of left wall panel ductworkassembly 1520 and right wall panel ductwork assembly 1530 can be seen.For right wall panel ductwork assembly 1530, right wall panel inlet duct1532, is in fluid communication with right wall panel upper duct 1538through right wall panel first riser 1534 and right wall panel secondriser 1536. Right wall panel upper duct 1538, can have first duct inletend 1535 and second duct outlet end 1537, which second duct outlet end1537 is in fluid communication with rear wall panel upper duct 1546 ofrear wall ductwork assembly 1540. Similarly, left wall panel ductworkassembly 1520 can have left wall panel inlet duct 1522, which is influid communication with left wall panel upper duct 1528 through leftwall panel first riser 1524 and left wall panel second riser 1526. Leftwall panel upper duct 1528, can have first duct inlet end 1525 andsecond duct outlet end 1527, which second duct outlet end 1527 is influid communication with rear wall panel upper duct 1546 of rear wallductwork assembly 1540. Additionally, rear wall panel ductwork assemblycan have rear wall panel inlet duct 1542, which is in fluidcommunication with left wall panel assembly 1520 and right wall panelassembly 1530. Additionally, rear wall panel ductwork assembly 1540, canhave rear wall panel bottom duct 1544, which can have rear wall panelfirst inlet 1541 and rear wall panel second inlet 1543. Rear wall panelbottom duct 1544 can be in fluid communication with rear wall panelupper duct 1546 via first bulkhead 1547 and second bulkhead 1549.Ductwork assembly 1501 as shown in FIG. 12 and FIG. 13 can provideeffective circulation of inert gas from front wall panel ductworkassembly 1510, which circulates inert gas from front wall panel inletduct 1512 to ceiling panel ducts 1505 and 1507 via front wall paneloutlets 1515 and 1517, respectively, as well as from left wall panelassembly 1520, right wall panel assembly 1530 and rear wall panelductwork assembly 1540, which circulate air from inlet ducts 1522, 1532,and 1542, respectively to vent 1545. Once inert gas is exhausted viaceiling panel ducts 1505 and 1507 and vent 1545 into the enclosure areaunder fan filter unit cover 103 of enclosure 100, the inert gas soexhausted can be filtered through fan filter units 1552 and 1554 of fanfilter unit assembly 1502. Additionally, the circulated inert gas can bemaintained at a desired temperature by heat exchangers 1562 and 1564,which are part of a thermal regulation system.

FIG. 14 is a bottom phantom view of enclosure ductwork assembly 1501.Inlet ductwork assembly 1509 includes front wall panel inlet duct 1512,left wall panel inlet duct 1522, right wall panel inlet duct 1532, andrear wall panel inlet duct 1542, which are in fluid communication withone another. As previously discussed, conduit I provides an outlet ofinert gas to an external gas purification system, while conduit IIprovides a return of purified inert gas to the circulation andfiltration loop internal to gas enclosure assembly 100.

For each inlet duct included in inlet ductwork assembly 1509, there areapparent openings evenly distributed across the bottom of each duct,sets of which are specifically highlighted for the purpose of thepresent teachings, as openings 1504 of front wall panel inlet duct 1512,openings 1521 of left wall panel inlet duct 1522, openings 1531 of rightwall panel inlet duct 1532, and openings 1541 of right wall panel inletduct 1542. Such openings, as are apparent across the bottom of eachinlet duct, provide for effective uptake of inert gas within enclosure100 for continual circulation and filtration. The continual circulationand filtration of inert gas various embodiments of a gas enclosureassembly are a part of a particle control system that can provide formaintaining a substantially particle-free environment within variousembodiments of a gas enclosure system. Various embodiments of a gascirculation and filtration system can be designed to provide a lowparticle environment for airborne particulates meeting the standards ofInternational Standards Organization Standard (ISO) 14644-1:1999,“Cleanrooms and associated controlled environments—Part 1:Classification of air cleanliness,” as specified by Class 1 throughClass 5.

In addition to a gas enclosure system utilizing a gas circulation andfiltration system to provide a laminar flow of gas, ensuring a thoroughand complete turnover of gas in the interior, a thermal regulationsystem utilizing a plurality of heat exchangers can be provided tomaintain a desired temperature in the interior. For example, a pluralityof heat exchangers can be provided operating with, adjacent to, or usedin conjunction with, a fan or another gas circulating device. A gaspurification loop can be configured to circulate gas from within theinterior of a gas enclosure assembly through at least one gaspurification component exterior the enclosure. In that regard, acirculation and filtration system internal a gas enclosure assembly inconjunction with a gas purification loop external a gas enclosureassembly can provide continuous circulation of a substantiallylow-particulate inert gas having substantially low levels of reactivespecies throughout a gas enclosure system. Various embodiments of a gasenclosure system having a gas purification system can be configured tomaintain very low levels of undesired components, for example, organicsolvents and vapors thereof, as well as water, water vapor, oxygen, andthe like.

FIG. 15 is a schematic diagram showing a gas enclosure system 502.Various embodiments of a gas enclosure system 502 according to thepresent teachings can comprise gas enclosure assembly 1101 for housing aprinting system, gas purification loop 3130 in fluid communication gasenclosure assembly 1101, and at least one thermal regulation system3140. Additionally, various embodiments of gas enclosure system 502 canhave pressurized inert gas recirculation system 3000, which can supplyinert gas for operating various devices, such as a substrate floatationtable for an OLED printing system. Various embodiments of a pressurizedinert gas recirculation system 3000 can utilize a compressor, a blowerand combinations of the two as sources for various embodiments ofpressurized inert gas recirculation system 3000, as will be discussed inmore detail subsequently. Additionally, gas enclosure system 502 canhave a circulation and filtration system internal to gas enclosuresystem 502 (not shown).

As depicted in FIG. 15, for various embodiments of a gas enclosureassembly according to the present teachings, the design of the ductworkcan separate the inert gas circulated through gas purification loop 3130from the inert gas that is continuously filtered and circulatedinternally for various embodiments of a gas enclosure assembly. Gaspurification loop 3130 includes outlet line 3131 from gas enclosureassembly 1101, to a solvent removal component 3132 and then to gaspurification system 3134. Inert gas purified of solvent and otherreactive gas species, such as oxygen and water vapor, are then returnedto gas enclosure assembly 1101 through inlet line 3133. Gas purificationloop 3130 may also include appropriate conduits and connections, andsensors, for example, oxygen, water vapor and solvent vapor sensors. Agas circulating unit, such as a fan, blower or motor and the like, canbe separately provided or integrated, for example, in gas purificationsystem 3134, to circulate gas through gas purification loop 3130.According to various embodiments of a gas enclosure assembly, thoughsolvent removal system 3132 and gas purification system 3134 are shownas separate units in the schematic shown in FIG. 15, solvent removalsystem 3132 and gas purification system 3134 can be housed together as asingle purification unit.

Gas purification loop 3130 of FIG. 15 can have solvent removal system3132 placed upstream of gas purification system 3134, so that inert gascirculated from gas enclosure assembly 1101 passes through solventremoval system 3132 via outlet line 3131. According to variousembodiments, solvent removal system 3132 may be a solvent trappingsystem based on adsorbing solvent vapor from an inert gas passingthrough solvent removal system 3132 of FIG. 15. A bed or beds of asorbent, for example, but not limited by, such as activated charcoal,molecular sieves, and the like, may effectively remove a wide variety oforganic solvent vapors. For various embodiments of a gas enclosuresystem cold trap technology may be employed to remove solvent vapors insolvent removal system 3132. As previously mentioned, for variousembodiments of a gas enclosure system according to the presentteachings, sensors, such as oxygen, water vapor and solvent vaporsensors, may be used to monitor the effective removal of such speciesfrom inert gas continuously circulating through a gas enclosure system,such as gas enclosure system 502 of FIG. 15. Various embodiments of asolvent removal system can indicate when sorbent, such as activatedcarbon, molecular sieves, and the like, has reached capacity, so thatthe bed or beds of sorbent can be regenerated or replaced. Regenerationof a molecular sieve can involve heating the molecular sieve, contactingthe molecular sieve with a forming gas, a combination thereof, and thelike. Molecular sieves configured to trap various species, includingoxygen, water vapor, and solvents, can be regenerated by heating andexposure to a forming gas that comprises hydrogen, for example, aforming gas comprising about 96% nitrogen and 4% hydrogen, with saidpercentages being by volume or by weight. Physical regeneration ofactivated charcoal can be done using a similar procedure of heatingunder an inert environment.

Any suitable gas purification system can be used for gas purificationsystem 3134 of gas purification loop 3130 of FIG. 15. Gas purificationsystems available, for example, from MBRAUN Inc., of Statham, N.H., orInnovative Technology of Amesbury, Mass., may be useful for integrationinto various embodiments of a gas enclosure assembly according to thepresent teachings. Gas purification system 3134 can be used to purifyone or more inert gases in gas enclosure system 502, for example, topurify the entire gas atmosphere within a gas enclosure assembly. Aspreviously mentioned, in order to circulate gas through gas purificationloop 3130, gas purification system 3134 can have a gas circulating unit,such as a fan, blower or motor, and the like. In that regard, a gaspurification system can be selected depending on the volume of theenclosure, which can define a volumetric flow rate for moving an inertgas through a gas purification system. For various embodiments of gasenclosure system having a gas enclosure assembly with a volume of up toabout 4 m³; a gas purification system that can move about 84 m³/h can beused. For various embodiments of gas enclosure system having a gasenclosure assembly with a volume of up to about 10 m³; a gaspurification system that can move about 155 m³/h can be used. Forvarious embodiments of a gas enclosure assembly having a volume ofbetween about 52-114 m³, more than one gas purification system may beused.

Any suitable gas filters or purifying devices can be included in the gaspurification system 3134 of the present teachings. In some embodiments,a gas purification system can comprise two parallel purifying devices,such that one of the devices can be taken off line for maintenance andthe other device can be used to continue system operation withoutinterruption. In some embodiments, for example, the gas purificationsystem can comprise one or more molecular sieves. In some embodiments,the gas purification system can comprise at least a first molecularsieve, and a second molecular sieve, such that, when one of themolecular sieves becomes saturated with impurities, or otherwise isdeemed not to be operating efficiently enough, the system can switch tothe other molecular sieve while regenerating the saturated ornon-efficient molecular sieve. A control unit can be provided fordetermining the operational efficiency of each molecular sieve, forswitching between operation of different molecular sieves, forregenerating one or more molecular sieves, or for a combination thereof.As previously mentioned, molecular sieves may be regenerated and reused.

Thermal regulation system 3140 of FIG. 15 can include at least onechiller 3142, which can have fluid outlet line 3141 for circulating acoolant into a gas enclosure assembly, and fluid inlet line 3143 forreturning the coolant to the chiller. An at least one fluid chiller 3142can be provided for cooling the gas atmosphere within gas enclosuresystem 502. For various embodiments of a gas enclosure system of thepresent teachings, fluid chiller 3142 delivers cooled fluid to heatexchangers within the enclosure, where inert gas is passed over afiltration system internal the enclosure. At least one fluid chiller canalso be provided with gas enclosure system 502 to cool heat evolvingfrom an apparatus enclosed within gas enclosure system 502. For example,but not limited by, at least one fluid chiller can also be provided forgas enclosure system 502 to cool heat evolving from an OLED printingsystem. Thermal regulation system 3140 can comprise heat-exchange orPeltier devices and can have various cooling capacities. For example,for various embodiments of a gas enclosure system, a chiller can providea cooling capacity of from between about 2 kW to about 20 kW. Variousembodiments of a gas enclosure system can have a plurality of fluidchillers that can chill one or more fluids. In some embodiments, thefluid chillers can utilize a number of fluids as coolant, for example,but not limited by, water, anti-freeze, a refrigerant, and a combinationthereof as a heat exchange fluid. Appropriate leak-free, lockingconnections can be used in connecting the associated conduits and systemcomponents.

As shown in FIG. 15, various embodiments of a gas enclosure system caninclude a pressurized inert gas recirculation system 3000. Variousembodiments of a pressurized inert gas recirculation loop can utilize acompressor, a blower and combinations thereof.

For example, as shown in FIG. 16, various embodiments of gas enclosuresystem 503 can have external gas loop 3200 for integrating andcontrolling inert gas source 3201 and clean dry air (CDA) source 3203for use in various aspects of operation of gas enclosure system 503. Gasenclosure system 503 can also include various embodiments of an internalparticle filtration and gas circulation system, as well as variousembodiments of an external gas purification system, as previouslydescribed. In addition to external loop 3200 for integrating andcontrolling inert gas source 3201 and CDA source 3203, gas enclosuresystem 503 can have compressor loop 3250, which can supply inert gas foroperating various devices and apparatuses that can be disposed in theinterior of gas enclosure system 503.

Compressor loop 3250 of FIG. 16 can include compressor 3262, firstaccumulator 3264 and second accumulator 3268, which are configured to bein fluid communication. Compressor 3262 can be configured to compressinert gas withdrawn from gas enclosure assembly 1101 to a desiredpressure. An inlet side of compressor loop 3250 can be in fluidcommunication with gas enclosure assembly 1101 via gas enclosureassembly outlet 3252 through line 3254, having valve 3256 and checkvalve 3258. Compressor loop 3250 can be in fluid communication with gasenclosure assembly 1101 on an outlet side of compressor loop 3250 viaexternal gas loop 3200. Accumulator 3264 can be disposed betweencompressor 3262 and the junction of compressor loop 3250 with externalgas loop 3200 and can be configured to generate a pressure of 5 psig orhigher. Second accumulator 3268 can be in compressor loop 3250 forproviding dampening fluctuations due to compressor piston cycling atabout 60 Hz. For various embodiments of compressor loop 3250, firstaccumulator 3264 can have a capacity of between about 80 gallons toabout 160 gallons, while second accumulator can have a capacity ofbetween about 30 gallons to about 60 gallons. According to variousembodiments of gas enclosure system 503, compressor 3262 can be a zeroingress compressor. Various types of zero ingress compressors canoperate without leaking atmospheric gases into various embodiments of agas enclosure system of the present teachings. Various embodiments of azero ingress compressor can be run continuously, for example, during anOLED printing process utilizing the use of various devices andapparatuses requiring compressed inert gas.

Accumulator 3264 can be configured to receive and accumulate compressedinert gas from compressor 3262. Accumulator 3264 can supply thecompressed inert gas as needed in gas enclosure assembly 1101. Forexample, accumulator 3264 can provide gas to maintain pressure forvarious components of gas enclosure assembly 1101, such as, but notlimited by, one or more of a pneumatic robot, a substrate floatationtable, an air bearing, an air bushing, a compressed gas tool, apneumatic actuator, and combinations thereof. As shown in FIG. 16 forgas enclosure system 503, gas enclosure assembly 1101 can have an OLEDprinting system 2003 enclosed therein. As schematically depicted in FIG.16, inkjet printing system 2003 can be supported by printing system base2100, which can be a granite stage. Printing system base 2100 cansupport a substrate support apparatus, such as a chuck, for example, butnot limited by, a vacuum chuck, a substrate floatation chuck havingpressure ports, and a substrate floatation chuck having vacuum andpressure ports. In various embodiments of the present teachings, asubstrate support apparatus can be a substrate floatation table, such assubstrate floatation table 2200 indicated in FIG. 16. Substratefloatation table 2200 can be used for the frictionless support of asubstrate. In addition to a low-particle generating floatation table,for frictionless y-axis conveyance of a substrate, printing system 2003can have a y-axis motion system utilizing air bushings. Additionally,printing system 2003 can have at least one X,Z-axis carriage assemblywith motion control provided by a low-particle generating X-axis airbearing assembly. Various components of a low-particle generating motionsystem, such as an X-axis air bearing assembly, can be used in place of,for example, various particle-generating linear mechanical bearingsystems. For various embodiments of a gas enclosure and system of thepresent teachings, the use of a variety of pneumatically operateddevices and apparatuses can provide low-particle generating performance,as well as being low maintenance. Compressor loop 3250 can be configuredto continuously supply pressurized inert gas to various devices andapparatuses of gas enclosure system 503. In addition to a supply ofpressurized inert gas, substrate floatation table 2200 of inkjetprinting system 2003, which utilizes air bearing technology, alsoutilizes vacuum system 3270, which is in communication with gasenclosure assembly 1101 through line 3272 when valve 3274 is in an openposition.

A pressurized inert gas recirculation system according to the presentteachings can have pressure-controlled bypass loop 3260 as shown in FIG.16 for compressor loop 3250, which acts to compensate for variabledemand of pressurized gas during use, thereby providing dynamic balancefor various embodiments of a gas enclosure system of the presentteachings. For various embodiments of a gas enclosure system accordingto the present teachings, a bypass loop can maintain a constant pressurein accumulator 3264 without disrupting or changing the pressure inenclosure 1101. Bypass loop 3260 can have first bypass inlet valve 3261on an inlet side of bypass loop, which is closed unless bypass loop 3260is used. Bypass loop 3260 can also have back pressure regulator 3266,which can be used when second valve 3263 is closed. Bypass loop 3260 canhave second accumulator 3268 disposed at an outlet side of bypass loop3260. For embodiments of compressor loop 3250 utilizing a zero ingresscompressor, bypass loop 3260 can compensate for small excursions ofpressure that can occur over time during use of a gas enclosure system.Bypass loop 3260 can be in fluid communication with compressor loop 3250on an inlet side of bypass loop 3260 when bypass inlet valve 3261 is inan opened position. When bypass inlet valve 3261 is opened, inert gasshunted through bypass loop 3260 can be recirculated to the compressorif inert gas from compressor loop 3250 is not in demand within theinterior of gas enclosure assembly 1101. Compressor loop 3250 isconfigured to shunt inert gas through bypass loop 3260 when a pressureof the inert gas in accumulator 3264 exceeds a pre-set thresholdpressure. A pre-set threshold pressure for accumulator 3264 can be frombetween about 25 psig to about 200 psig at a flow rate of at least about1 cubic feet per minute (cfm), or from between about 50 psig to about150 psig at a flow rate of at least about 1 cubic feet per minute (cfm),or from between about 75 psig to about 125 psig at a flow rate of atleast about 1 cubic feet per minute (cfm) or between about 90 psig toabout 95 psig at a flow rate of at least about 1 cubic feet per minute(cfm).

Various embodiments of compressor loop 3250 can utilize a variety ofcompressors other than a zero ingress compressor, such as a variablespeed compressor or a compressor that can be controlled to be in eitheran on or off state. As previously discussed, a zero ingress compressorensures that no atmospheric reactive species can be introduced into agas enclosure system. As such, any compressor configuration preventingatmospheric reactive species from being introduced into a gas enclosuresystem can be utilized for compressor loop 3250. According to variousembodiments, compressor 3262 of gas enclosure system 503 can be housedin, for example, but not limited by, an hermetically-sealed housing. Thehousing interior can be configured in fluid communication with a sourceof inert gas, for example, the same inert gas that forms the inert gasatmosphere for gas enclosure assembly 1101. For various embodiments ofcompressor loop 3250, compressor 3262 can be controlled at a constantspeed to maintain a constant pressure. In other embodiments ofcompressor loop 3250 not utilizing a zero ingress compressor, compressor3262 can be turned off when a maximum threshold pressure is reached, andturned on when a minimum threshold pressure is reached.

In FIG. 17 for gas enclosure system 504, blower loop 3280 utilizingvacuum blower 3290 is shown for the operation of substrate floatationtable 2200 of inkjet printing system 2003, which are housed in gasenclosure assembly 1101. As previously discussed for compressor loop3250, blower loop 3280 can be configured to continuously supplypressurized inert gas to a substrate floatation table 2200 of printingsystem 2003.

Various embodiments of a gas enclosure system that can utilize apressurized inert gas recirculation system can have various loopsutilizing a variety of pressurized gas sources, such as at least one ofa compressor, a blower, and combinations thereof. In FIG. 17 for gasenclosure system 504, compressor loop 3250 can be in fluid communicationwith external gas loop 3200, which can be used for the supply of inertgas for high consumption manifold 3225, as well as low consumptionmanifold 3215. For various embodiments of a gas enclosure systemaccording to the present teachings as shown in FIG. 17 for gas enclosuresystem 504, high consumption manifold 3225 can be used to supply inertgas to various devices and apparatuses, such as, but not limited by, oneor more of a substrate floatation table, a pneumatic robot, an airbearing, an air bushing, and a compressed gas tool, and combinationsthereof. For various embodiments of a gas enclosure system according tothe present teachings, low consumption 3215 can be used to supply inertgas to various apparatuses and devises, such as, but not limited by, oneor more of an isolator, and a pneumatic actuator, and combinationsthereof.

For various embodiments of gas enclosure system 504 of FIG. 17, blowerloop 3280 can be utilized to supply pressurized inert gas to variousembodiments of substrate floatation table 2200, while compressor loop3250; in fluid communication with external gas loop 3200, can beutilized to supply pressurized inert gas to, for example, but notlimited by, one or more of a pneumatic robot, an air bearing, an airbushing, and a compressed gas tool, and combinations thereof. Inaddition to a supply of pressurized inert gas, substrate floatationtable 2200 of OLED inkjet printing system 2003, which utilizes airbearing technology, also utilizes blower vacuum 3290, which is incommunication with gas enclosure assembly 1101 through line 3292 whenvalve 3294 is in an open position. Housing 3282 of blower loop 3280 canmaintain first blower 3284 for supplying a pressurized source of inertgas to substrate floatation table 2200, and second blower 3290, actingas a vacuum source for substrate floatation table 2200, which is housedin an inert gas environment in gas enclosure assembly 1101. Attributesthat can make blowers suitable for use as a source of either pressurizedinert gas or vacuum for various embodiments a substrate floatation tableinclude, for example, but not limited by, that they have highreliability; making them low maintenance, have variable speed control,and have a wide range of flow volumes; various embodiments capable ofproviding a volume flow of between about 100 m³/h to about 2,500 m³/h.Various embodiments of blower loop 3280 additionally can have firstisolation valve 3283 at an inlet end of blower loop 3280, as well ascheck valve 3285 and a second isolation valve 3287 at an outlet end ofblower loop 3280. Various embodiments of blower loop 3280 can haveadjustable valve 3286, which can be, for example, but not limited by, agate, butterfly, needle or ball valve, as well as heat exchanger 3288for maintaining inert gas from blower loop 3280 to substrate floatationtable 2200 at a defined temperature.

FIG. 17 depicts external gas loop 3200, also shown in FIG. 16, forintegrating and controlling inert gas source 3201 and clean dry air(CDA) source 3203 for use in various aspects of operation of gasenclosure system 503 of FIG. 16 and gas enclosure system 504 of FIG. 17.External gas loop 3200 of FIG. 16 and FIG. 17 can include at least fourmechanical valves. These valves comprise first mechanical valve 3202,second mechanical valve 3204, third mechanical valve 3206, and fourthmechanical valve 3208. These various valves are located at positions invarious flow lines that allow control of both an inert gas, for example,such as nitrogen, any of the noble gases, and any combination thereof,and an air source such as clean dry air (CDA). From a house inert gassource 3201, a house inert gas line 3210 extends. House inert gas line3210 continues to extend linearly as low consumption manifold line 3212,which is in fluid communication with low consumption manifold 3215. Across-line first section 3214 extends from a first flow juncture 3216,which is located at the intersection of house inert gas line 3210, lowconsumption manifold line 3212, and cross-line first section 3214.Cross-line first section 3214 extends to a second flow juncture 3218. Acompressor inert gas line 3220 extends from accumulator 3264 ofcompressor loop 3250 and terminates at second flow juncture 3218. A CDAline 3222 extends from a CDA source 3203 and continues as highconsumption manifold line 3224, which is in fluid communication withhigh consumption manifold 3225. A third flow juncture 3226 is positionedat the intersection of a cross-line second section 3228, clean dry airline 3222, and high consumption manifold line 3224. Cross-line secondsection 3228 extends from second flow juncture 3218 to third flowjuncture 3226. Various components that are high consumption can besupplied CDA during maintenance, by means high consumption manifold3225. Isolating the compressor using valves 3204, 3208, and 3230 canprevent reactive species, such as oxygen and water vapor fromcontaminating an inert gas within the compressor and accumulator.

As previously discussed, the present teachings disclose variousembodiments of a gas enclosure system that can include a gas enclosureassembly defining a first volume and an auxiliary enclosure defining asecond volume. Various embodiments of a gas enclosure system can have anauxiliary enclosure that can be sealably constructed as a section of gasenclosure assembly and readily integrated with gas circulation,filtration and purification components to form a gas enclosure systemthat can sustain an inert, substantially particle-free environment forprocesses requiring such an environment with little or no interruptionof a printing process. For example, all steps associated with aprinthead management procedure can be done to eliminate or minimize theexposure of a printing system enclosure to contamination, such as airand water vapor and various organic vapors, as well as particulatecontamination. According to various systems and methods of the presentteachings, a printing system enclosure may be introduced to a level ofcontamination that is sufficiently low that a purification system canremove the contamination before it can affect a printing process.

According to systems and methods of the present teachings, variousembodiments of a printing system enclosure and an auxiliary enclosureconstructed as sections of a gas enclosure assembly can be constructedin a fashion to provide for separately-functioning frame member assemblysections. Gas enclosure system 505 of FIG. 18, in addition to having allelements disclosed for gas enclosure systems 502-504, can have first gasenclosure assembly section 1101-S1 of gas enclosure assembly 1101defining a first volume and second gas enclosure assembly section1101-S2 of gas enclosure assembly 1101 defining a second volume. If allvalves, V₁, V₂, V₃ and V₄ are opened, then gas purification loop 3130operates essentially as previously described for gas enclosure assemblyand system 1101 of FIG. 15. With closure of V₃ and V₄, only first gasenclosure assembly section 1101-S1 is in fluid communication with gaspurification loop 3130. This valve state may be used, for example, butnot limited by, when second gas enclosure assembly section 1101-S2 issealably closed and thereby isolated from first gas enclosure assemblysection 1101-S1 during various measurement and maintenances procedurerequiring that second gas enclosure assembly section 1101-S2 be openedto the atmosphere. With closure of V₁ and V₂, only second gas enclosureassembly section 1101-S2 is in fluid communication with gas purificationloop 3130. This valve state may be used, for example, but not limitedby, during recovery of second gas enclosure assembly section 1101-S2after the section has been opened to the atmosphere. As previouslymentioned for the present teachings related to FIG. 15, the requirementsfor gas purification loop 3130 are specified with respect to the totalvolume of gas enclosure assembly 1101. Therefore, by devoting theresources of a gas purification system to the recovery of a gasenclosure assembly section, such as second gas enclosure assemblysection 1101-S2, which is depicted in FIG. 18 to be significantly lessin volume than the total volume of gas enclosure 1101, the recovery timecan be substantially reduced.

Additionally, various embodiments of an auxiliary enclosure can bereadily integrated with a dedicated set of environmental regulationsystem components, such as lighting, gas circulation and filtration, gaspurification, and thermostating components. In that regard, variousembodiments of a gas enclosure system including an auxiliary enclosurethat can be sealably constructed as a section of gas enclosure assemblycan have a controlled environment that is set to be uniform with a firstvolume defined by a gas enclosure assembly housing a printing systemFurther, various embodiments of a gas enclosure system including anauxiliary enclosure that can be sealably constructed as a section of gasenclosure assembly can have a controlled environment that is set to bedifferent than the controlled environment of a first volume defined by agas enclosure assembly housing a printing system.

Recalling, various embodiments of a gas enclosure assembly utilized inembodiments of a gas enclosure system of the present teachings can beconstructed in a contoured fashion that minimizes the internal volume ofa gas enclosure assembly, and at the same time optimizes the workingvolume for accommodating various footprints of OLED printing systemsdesigns. For example, various embodiments of a contoured gas enclosureassembly according to the present teachings can have a gas enclosurevolume of between about 6 m³ to about 95 m³ for various embodiments of agas enclosure assembly of the present teachings covering, for example,substrate sizes from Gen 3.5 to Gen 10. Various embodiments of acontoured gas enclosure assembly according to the present teachings canhave a gas enclosure volume of, for example, but not limited by, ofbetween about 15 m³ to about 30 m³, which might be useful for OLEDprinting of, for example, Gen 5.5 to Gen 8.5 substrate sizes. Variousembodiments of an auxiliary enclosure can be constructed as a section ofgas enclosure assembly and readily integrated with gas circulation andfiltration, as well as purification components to form a gas enclosuresystem that can sustain an inert, substantially particle-freeenvironment for processes requiring such an environment.

According to various embodiments of systems and methods of the presentteachings, frame member construction, panel construction, frame andpanel sealing, as well as construction of a gas enclosure assembly, suchas gas enclosure assembly 100 of FIG. 3, can be applied to a gasenclosure assembly of a variety of sizes and designs. For example, butnot limited by, various embodiments of a contoured gas enclosureassembly of the present teachings covering substrate sizes from Gen 3.5to Gen 10 can have an internal volume of between about 6 m³ to about 95m³, which can be between about 30% to about 70% savings in volume for anenclosure not contoured and having comparative gross dimensions. Variousembodiments of a gas enclosure assembly can have various frame membersthat are constructed to provide contour for a gas enclosure assembly, inorder to optimize the working volume accommodating various embodimentsof a printing system of the present teachings; while minimizing inertgas volume, as well as also allowing ready access to an OLED printingsystem from the exterior during processing. In that regard, various gasenclosure assemblies of the present teachings can vary in contouredtopology and volume.

Moreover, various embodiments of a gas enclosure system of the presentteachings can utilize a gas enclosure assembly having an auxiliaryenclosure that can be sealably constructed as a section of gas enclosureassembly, in order to readily perform various procedures related to theongoing management of a printing system, for example, but not limitedby, processes related to the management of a printhead assembly. Forvarious embodiments of a gas enclosure assembly with an auxiliaryenclosure, an auxiliary frame member assembly section can be less thanor equal to about 1% of the enclosure volume of a gas enclosure system.In various embodiments of a gas enclosure assembly, an auxiliary framemember assembly section can be less than or equal to about 2% of theenclosure volume of a gas enclosure system. For various embodiments of agas enclosure assembly, an auxiliary frame member assembly section canbe less than or equal to about 5% of the enclosure volume of a gasenclosure system. In various embodiments of a gas enclosure assembly, anauxiliary frame member assembly section can be less than or equal toabout 10% of the enclosure volume of a gas enclosure system. In variousembodiments of a gas enclosure assembly, an auxiliary frame memberassembly section can be less than or equal to about 20% of the enclosurevolume of a gas enclosure system. Various procedures related to theongoing management of a printing system, for example, but not limitedby, various process steps related to the management of a printheadassembly can be performed in an auxiliary enclosure. According tovarious systems and methods of the present teachings, an auxiliaryenclosure can be separated from a printing system enclosure portion of agas enclosure system, thereby ensuring either minimal or no interruptionof a printing process. Moreover, given the relatively small volume of anauxiliary enclosure, recovery of an auxiliary enclosure can takesignificantly less time than recovery of an entire printing systemenclosure.

Further, various embodiments of a gas enclosure assembly of the presentteachings can be constructed in a fashion to provide forseparately-functioning frame member assembly sections. Recalling, withrespect to FIG. 5, a frame member assembly according to variousembodiments of a gas enclosure assembly and system of the presentteachings, can include a frame member having various panels sealablymounted onto a frame member. For example, but not limited by, a wallframe member assembly, or wall panel assembly, can be a wall framemember including various panels sealably mounted onto the wall framemember. Accordingly, various fully constructed panel assemblies, suchas, but not limited by, wall panel assemblies, ceiling panel assemblies,wall and ceiling panel assemblies, base support panel assemblies, andthe like are various types of frame member assemblies. A gas enclosureassembly of the present teachings can provide for various embodiments ofa gas enclosure assembly having various frame member assembly sections,where each frame member assembly section is a proportion of the totalvolume of a gas enclosure assembly. Various frame member assemblysections comprising various embodiments of a gas enclosure assembly canhave at least one frame member in common. For various embodiments of agas enclosure assembly, various frame member assembly sectionscomprising a gas enclosure assembly can have at least one frame memberassembly in common. Various frame member assembly sections comprisingvarious embodiments of a gas enclosure assembly can have a combinationof at least one frame member and one frame member assembly in common.

According to the present teachings, various frame member assemblysections can be separated into sections through, for example, but notlimited by, closure of an opening or passage, or combination thereof,common to each of a frame member assembly section. For example, invarious embodiments, an auxiliary frame member assembly section can beseparated by covering an opening or passage, or combination thereof, ina frame member or frame member panel common to each frame memberassembly section; effectively closing the opening or passage, orcombination thereof thereby. In various embodiments, an auxiliary framemember assembly section can be separated by sealing an opening orpassage, or combination thereof, common to each frame member assemblysection. In that regard, sealably closing an opening or passage, orcombination thereof, can result in separation that disrupts the fluidcommunication between each volume of a gas enclosure frame memberassembly section defining a working volume and an auxiliary enclosuredefining a second volume, where each volume is a proportion of the totalvolume contained within a gas enclosure assembly. Sealably closing anopening or passage can thereby isolate a working volume of a gasenclosure assembly from an auxiliary frame member assembly sectiondefining a second volume.

FIG. 19 depicts a perspective view gas enclosure assembly 1000 inaccordance with various embodiments of a gas enclosure assembly of thepresent teachings. Gas enclosure assembly 1000 can include front panelassembly 1200′, middle panel assembly 1300′ and rear panel assembly1400′. Front panel assembly 1200′ can include front ceiling panelassembly 1260′, front wall panel assembly 1240′, which can have opening1242 for receiving a substrate, and front base panel assembly 1220′.Rear panel assembly 1400′ can include rear ceiling panel assembly 1460′,rear wall panel assembly 1440′ and rear base panel assembly 1420′.Middle panel assembly 1300′ can include first middle enclosure panelassembly 1340′, middle wall and ceiling panel assembly 1360′ and secondmiddle enclosure panel assembly 1380′, as well as middle base panelassembly 1320′. Additionally, middle panel assembly 1300′ can includefirst printhead management system auxiliary panel assembly 1330′, aswell as a second printhead management system auxiliary panel assembly(not shown). Various embodiments of an auxiliary enclosure constructedas a section of a gas enclosure assembly can be sealably isolated fromthe working volume of a gas enclosure system. Such physical isolation ofan auxiliary enclosure can enable various procedures, for example, butnot limited by, various maintenance procedures on a printhead assembly,to be conducted with little or no interruption of a printing process,thereby minimizing or eliminating gas enclosure system downtime.

As depicted in FIG. 20A, gas enclosure assembly 1000 can include frontbase panel assembly 1220′, middle base panel assembly 1320′, and rearbase panel assembly 1420′, which when fully-constructed form acontiguous base or pan on which OLED printing system 2000 can bemounted. In a similar fashion as described for gas enclosure assembly100 of FIG. 3, the various frame members and panels comprising frontpanel assembly 1200′, middle panel assembly 1300′, and rear panelassembly 1400′ of gas enclosure assembly 1000 can be joined around OLEDprinting system 2000. Accordingly, a fully constructed gas enclosureassembly, such as gas enclosure assembly 1000, when integrated withvarious environmental control systems can form various embodiments of agas enclosure system including various embodiments of OLED printingsystem 2000. According to various embodiments of a gas enclosure systemof the present teachings as previously described, environmental controlof an interior volume defined by a gas enclosure assembly can includecontrol of lighting, for example, by the number and placement of lightsof a specific wavelength, control of particulate matter using variousembodiments of a gas circulation and filtration system, control ofreactive gas species using various embodiments of a gas purificationsystem, and temperature control of a gas enclosure assembly usingvarious embodiments of a thermal control system.

An OLED inkjet printing system, such as OLED printing system 2000 ofFIG. 20A, shown in expanded view in FIG. 20B, can be comprised ofseveral devices and apparatuses, which allow the reliable placement ofink drops onto specific locations on a substrate. These devices andapparatuses can include, but are not limited to, a printhead assembly,ink delivery system, motion system, substrate support apparatus,substrate loading and unloading system, and printhead management system.

A printhead assembly can include at least one ink jet head, with atleast one orifice capable of ejecting droplets of ink at a controlledrate, velocity, and size. The inkjet head is fed by an ink supply systemwhich provides ink to the inkjet head. As shown in an expanded view ofFIG. 20B, OLED inkjet printing system 2000 can have a substrate, such assubstrate 2050, which can be supported by a substrate support apparatus,such as a chuck, for example, but not limited by, a vacuum chuck, asubstrate floatation chuck having pressure ports, and a substratefloatation chuck having vacuum and pressure ports. In variousembodiments of systems and methods of the present teachings, a substratesupport apparatus can be a substrate floatation table. As will bediscussed in more detail subsequently, substrate floatation table 2200of FIG. 20B can be used for supporting substrate 2050, and inconjunction with a Y-axis motion system, can be part of a substrateconveyance system providing for the frictionless conveyance of substrate2050. Substrate floatation table 2200 of OLED inkjet printing system2000 shown in FIG. 20A and FIG. 20B can define the travel of substrate2050 through gas enclosure assembly 1000 of FIG. 19 during a printingprocess. Printing requires relative motion between the printheadassembly and the substrate. This is accomplished with a motion system,typically a gantry or split axis XYZ system. Either the printheadassembly can move over a stationary substrate (gantry style), or boththe printhead and substrate can move, in the case of a split axisconfiguration. In another embodiment, a printhead assembly can besubstantially stationary; for example, in the X and Y axes, and thesubstrate can move in the X and Y axes relative to the printheads, withZ axis motion provided either by a substrate support apparatus or by aZ-axis motion system associated with a printhead assembly. As theprintheads move relative to the substrate, droplets of ink are ejectedat the correct time to be deposited in the desired location on asubstrate. A substrate can be inserted and removed from the printerusing a substrate loading and unloading system. Depending on the printerconfiguration, this can be accomplished with a mechanical conveyor, asubstrate floatation table with a conveyance assembly, or a substratetransfer robot with end effector. A printhead management system can becomprised of several subsystems which allow for such measurement tasks,such as the checking for nozzle firing, as well as the measurement ofdrop volume, velocity and trajectory from every nozzle in a printhead,and maintenance tasks, such as wiping or blotting the inkjet nozzlesurface of excess ink, priming and purging a printhead by ejecting inkfrom an ink supply through the printhead and into a waste basin, andreplacement of printheads. Given the variety of components that cancomprise an OLED printing system, various embodiments of OLED printingsystem can have a variety of footprints and form factors.

In the expanded view of OLED printing system 2000 of FIG. 20B, variousembodiments of a printing system can include substrate floatation table2200, supported by substrate floatation table base 2220. Substratefloatation table base 2220 can be mounted on printing system base 2100.Substrate floatation table 2200 of OLED printing system can supportsubstrate 2050, as well as defining the travel over which substrate 2050can be moved through gas enclosure assembly 1000 during the printing ofan OLED substrate. In that regard, in conjunction with a motion system;as depicted in FIG. 20B, a Y-axis motion system, substrate floatationtable 2200 can provide frictionless conveyance of substrate 2050 througha printing system.

FIG. 21 depicts a floatation table according to various embodiments ofthe present teachings for the frictionless support, and in conjunctionwith a conveyance system, the stable conveyance of a load, such assubstrate 2050 of FIG. 20B. Various embodiments of a floatation tablecan be used in any of the various embodiments of a gas enclosure systemof the present teachings. As previously discussed, various embodimentsof a gas enclosure system of the present teachings can process a rangeof sizes of OLED flat panel display substrates from smaller than a Gen3.5 substrate, which has dimensions of about 61 cm×72 cm, as well as theprogression of larger generation sizes. It is contemplated that variousembodiments of gas enclosure system can process substrate sizes of Gen5.5, having dimensions of about 130 cm×150 cm, as well as a Gen 7.5substrate, having dimensions of about 195 cm×225 cm, and can be cut intoeight 42″ or six 47″ flat panels per substrate and larger. A Gen 8.5substrate is approximately 220 cm×250 cm, and can be cut to six 55″ oreight 46″ flat panels per substrate. However, substrate generation sizeskeep advancing, so that a currently-available Gen 10 substrate, havingdimensions of about 285 cm×305 cm, does not appear to be the ultimategeneration of substrate sizes. Additionally, sizes recited from theterminology arising from the use of glass-based substrates can beapplied to substrates of any material suitable for use in OLED printing.For various embodiments of an OLED inkjet printing system, a variety ofsubstrate materials can be used for substrate 2050, for example, but notlimited by, a variety of glass substrate materials, as well as a varietyof polymeric substrate materials. Accordingly, there are a variety ofsubstrate sizes and materials requiring stable conveyance duringprinting in various embodiments of gas enclosure systems of the presentteachings.

As depicted if FIG. 21, substrate floatation table 2200 according tovarious embodiments of the present teachings can have floatation tablebase 2220 for supporting a plurality of floatation table zones.Substrate floatation table 2200 can have zone 2210 in which bothpressure and vacuum can be applied through a plurality of ports. Such azone having both pressure and vacuum control can effectively provide afluidic spring between zone 2210 and a substrate (not shown). Zone 2210having both pressure and vacuum control is a fluidic spring withbidirectional stiffness. The gap that exits between a load and afloatation table surface is referred to as the fly height. A zone suchas zone 2210 of substrate floatation table 2200 of FIG. 21, in which afluidic spring having bidirectional stiffness is created using aplurality of pressure and vacuum ports, can provide a controllable flyheight for a load, such as a substrate.

Proximal to zone 2210 are first and second transition zones; 2211 and2212, respectively, and then proximal first and second transition zones2211 and 2212 are pressure-only zones, 2213 and 2214, respectively. Inthe transition zones, the ratio of pressure to vacuum nozzles increasesgradually towards the pressure only zones to provide for a gradualtransition from zone 2210 to zones 2213 and 2214. As indicated in FIG.21, FIG. 14B depicts an expanded view of the three zones. For variousembodiments of a substrate floatation table, for example, as depicted inFIG. 21, pressure-only zones 2213, 2214 are depicted as comprised ofrail structures. For various embodiments of a substrate floatationtable, pressure only zones, such as pressure-only zones 2213, 2214 ofFIG. 21, can be comprised of a continuous plate, such as that depictedfor pressure-vacuum zone 2210 of FIG. 21.

For various embodiments of a floatation table as depicted in FIG. 21,there can be essentially uniform height between the pressure-vacuumzone, the transition zone, and the pressure only zone, so that withintolerances, the three zones lie essentially in one plane and can vary inlength. For example, but not limited by, in order to provide a sense ofscale and proportion, for various embodiments of a floatation table ofthe present teachings, a transition zone can be about 400 mm, while thepressure-only zone can be about 2.5 m, and the pressure-vacuum zone canbe about 800 mm. In FIG. 21, the pressure-only zones 2213 and 2214 donot provide a fluidic spring having bidirectional stiffness, andtherefore do not provide the control that zone 2210 can provide.Accordingly, the fly height of a load can be typically greater overpressure-only zones than the fly height of a substrate over apressure-vacuum zone, in order to allow enough height so that a loadwill not collide with a floatation table in the pressure-only zones. Forexample, but not limited by, it can be desirable for processing an OLEDpanel substrate to have a fly height of between about 150μ. (micron) toabout 300μ (micron) above pressure-only zones, such as zones 2213 and2214, and then between about 30μ (micron) to about 50μ (micron) above apressure-vacuum zone, such as zone 2210.

Various embodiments of substrate floatation table 2200 can beaccommodated in a gas enclosure, including gas enclosure assemblies ofthe present teachings, for example, but not limited by those depictedand described for FIG. 3 and FIG. 19, which can be integrated withvarious system functions as those described for FIG. 15 through FIG. 18.For example, various embodiments of a gas enclosure system can utilize apressurized inert gas recirculation system for the operation of avariety of pneumatically operated devices and apparatuses. Additionally,as was previously discussed, embodiments of a gas enclosure assembly ofthe present teachings can be maintained at a slight positive pressurerelative to the external environment, for example, but not limited bybetween about 2 mbarg to about 8 mbarg. Maintaining a pressurized inertgas recirculation system within a gas enclosure system can bechallenging, as it presents a dynamic and ongoing balancing actregarding maintaining a slight positive internal pressure of a gasenclosure system, while at the same time continuously introducingpressurized gas into a gas enclosure system. Further, variable demand ofvarious pneumatically operated devices and apparatuses can create anirregular pressure profile for various gas enclosure assemblies andsystems of the present teachings. Accordingly, maintaining a dynamicpressure balance for a gas enclosure assembly held at a slight positivepressure relative to the external environment under such conditions canprovide for the integrity of an ongoing OLED printing process.

Referring back to FIG. 20B, printing system base 2100, can include firstriser (not visible) and second riser 2122, upon which bridge 2130 ismounted. For various embodiments of OLED printing system 2000, bridge2130 can support first X,Z-axis carriage assembly 2301 and secondX,Z-axis carriage assembly 2302, which can control the movement of firstprinthead assembly 2501 and second printhead assembly 2502,respectively. Though FIG. 20B depicts two carriage assemblies and twoprinthead assemblies, for various embodiments of OLED inkjet printingsystem 2000, there can be a single carriage assembly and a singleprinthead assembly. For example, either of first printhead assembly 2501and second printhead assembly 2502 can be mounted on an X,Z-axiscarriage assembly, while a camera system for inspecting features ofsubstrate 2050 can be mounted on a second X,Z-axis carriage assembly.Various embodiments of OLED inkjet printing system 2000 can have asingle printhead assembly, for example, either of first printheadassembly 2501 and second printhead assembly 2502 can be mounted on anX,Z-axis carriage assembly, while a UV lamp for curing an encapsulationlayer printed on substrate 2050 can be mounted on a second X,Z-axiscarriage assembly. For various embodiments of OLED inkjet printingsystem 2000, there can be a single printhead assembly, for example,either of first printhead assembly 2501 and second printhead assembly2502, mounted on an X,Z-axis carriage assembly, while a heat source forcuring an encapsulation layer printed on substrate 2050 can be mountedon a second carriage assembly.

In FIG. 20B, first X,Z-axis carriage assembly 2301 can be used toposition first printhead assembly 2501, which can be mounted on firstZ-axis moving plate 2310, over substrate 2050, which is shown supportedon substrate floatation table 2200. Second X,Z-axis carriage assembly2302 can be similarly configured for controlling the X-Z axis movementof second printhead assembly 2502 relative to substrate 2050. Eachprinthead assembly, such as first printhead assembly 2501 and secondprinthead assembly 2502 of FIG. 20B, can have a plurality of printheadsmounted in at least one printhead device, as depicted in partial viewfor first printhead assembly 2501, which depicts a plurality ofprinthead 2505. A printhead device can include, for example, but notlimited by, fluidic and electronic connections to at least oneprinthead; each printhead having a plurality of nozzles or orificescapable of ejecting ink at a controlled rate, velocity and size. Forvarious embodiments of printing system 2000, a printhead assembly caninclude between about 1 to about 60 printhead devices, where eachprinthead device can have between about 1 to about 30 printheads in eachprinthead device. A printhead, for example, an industrial inkjet head,can have between about 16 to about 2048 nozzles, which can expel adroplet volume of between about 0.1 pL to about 200 pL.

According to various embodiments of gas enclosure assembly 1000 andprinting system 2000 of FIG. 20A and FIG. 20B, a printing system canhave a printhead management system that can be mounted proximal to aprinthead assembly, for example, first printhead management system 2701and second printhead management system 2702 can be mounted upon firstprinthead management system platform 2703 and second printheadmanagement system platform 2704, respectively. First printheadmanagement system platform 2703 and second printhead management systemplatform 2704 are depicted in FIG. 20B affixed to floatation table base2100. Various embodiments of a printhead management system can perform avariety of measurement and maintenance tasks on a printhead assembly.Various measurements performed on a printhead can include, for example,but not limited by, checking for nozzle firing, measuring drop volume,velocity and trajectory, as well as tuning a printhead so that eachnozzle ejects a droplet of known volume. Maintaining a printhead caninclude, for example, but not limited by, procedures such as printheadpurging and priming, which requires collection and containment of theink expelled from a printhead, removal of excess ink after a purging orpriming procedure, as well as printhead or printhead device replacement.In a printing process, for example, for the printing of an OLED displaypanel substrate, reliable firing of the nozzles is critical for ensuringthat a printing process can manufacture quality OLED panel displays.Therefore, it is necessary that the various procedures associated withprinthead management can be readily and reliably done to eliminate orminimize the exposure of a printing system enclosure to contamination,such as air and water vapor and various organic vapors, as well asparticulate contamination. According to various systems and methods ofthe present teachings, a printing system enclosure may be introduced toa level of contamination that is sufficiently low that a purificationsystem can remove the contamination before it can affect a printingprocess.

According to various embodiments of a gas enclosure system of thepresent teachings, given the sheer number of printhead devices andprintheads, first printhead management system 2701 and second printheadmanagement system 2702 can be housed in an auxiliary enclosure, whichcan be isolated during a printing process for performing variousmeasurement and maintenance tasks with little or no interruption to theprinting process. As can be seen in FIG. 20B, first printhead assembly2501 can be seen positioned relative to first printhead managementsystem 2701 for ready performance of various measurement and maintenanceprocedures that can be performed by first printhead management systemapparatuses 2707, 2709 and 2711. Apparatuses 2707, 2709, and 2011 can beany of a variety of subsystems or modules for performing variousprinthead management functions. For example apparatuses 2707, 2709, and2011 can be any of a drop measurement module, a printhead replacementmodule, a purge basin module, and a blotter module.

Recalling, a printhead assembly can include between about 1 to about 60printhead devices, where each printhead device can have between about 1to about 30 printheads in each printhead device. As such, variousembodiments of a printing system of the present teachings can havebetween about 1 to about 1800 printheads. The sheer number of printheadscan require ongoing measurement and maintenance procedures be performedon a periodic basis as required. For example, a drop measurement modulecan be used for measurement tasks, such as the checking for nozzlefiring, as well as the measurement of drop volume, velocity andtrajectory from every nozzle in a printhead. A purge basin module can beused for priming and purging a printhead by ejecting ink from an inksupply through the printhead into a waste basin, while a blotter modulecan be used for wiping or blotting the inkjet nozzle surface of excessink.

In that regard, each subsystem can have various parts that areconsumable by nature, and require replacement, such as replacing blotterpaper, ink, and waste reservoirs. Various consumable parts can bepackaged for ready insertion, for example, in a fully automated modeusing a handler. As a non-limiting example, blotter paper can bepackaged in a cartridge format, which can be readily inserted for useinto a blotting module. By way of another non-limiting example ink canbe packaged in a replaceable reservoir, as well as a cartridge formatfor use in a printing system. Various embodiments of a waste reservoircan be packaged in a cartridge format, which can be readily inserted foruse into a purge basin module. Additionally, parts of various componentsof a printing system subject to on-going use can require periodicreplacement. During a printing process, expedient management of aprinthead assembly, for example, but not limited by, an exchange of aprinthead device or printhead, can be desirable. A printhead replacementmodule can have parts, such as a printhead device or printhead, whichcan be readily inserted for use into a printhead assembly. A dropmeasurement module used for checking for nozzle firing, as well as themeasurement based on optical detection of drop volume, velocity andtrajectory from every nozzle can have a source and a detector, which canrequire periodic replacement after use. Various consumable andhigh-usage parts can be packaged for ready insertion, for example, in afully automated mode using a handler or by end-user mitigated exchange.Accordingly, utilizing an auxiliary enclosure for the automated orend-user mitigated exchange of parts of a printing system can ensurethat a printing process can continue in an uninterrupted fashion. Asdepicted in FIG. 20B, first printhead management system apparatuses2707, 2709 and 2711 can be mounted on a linear rail motion system 2705for positioning relative to first printhead assembly 2501.

With respect to various embodiments of a gas enclosure assembly havingan auxiliary enclosure that can be closed off from, as well as sealablyisolated from a first working volume, reference is made again to FIG.20A. As depicted in FIG. 20B, there can be four isolators on OLEDprinting system 2000; first isolator set 2110 (second not shown onopposing side) and second isolator set 2112 (second not shown onopposing side), which support substrate floatation table 2200 of OLEDprinting system 2000. For gas enclosure assembly 1000 of FIG. 20A, firstisolator set 2110 and second isolator set 2112 can be mounted in each ofa respective isolator well panel, such as first isolator wall panel1325′ and second isolator wall panel 1327′ of middle base panel assembly1320′. For gas enclosure assembly 1000 of FIG. 20A, middle base assembly1320′ can include first printhead management system auxiliary panelassembly 1330′, as well as second printhead management system auxiliarypanel assembly 1370′. FIG. 20A of gas enclosure assembly 1000 depictsfirst printhead management system auxiliary panel assembly 1330′ thatcan include first back wall panel assembly 1338′. Similarly, alsodepicted is second printhead management system auxiliary panel assembly1370′ that can include second back wall panel assembly 1378′. First backwall panel assembly 1338′ of first printhead management system auxiliarypanel assembly 1330′ can be constructed in a similar fashion as shownfor second back wall panel assembly 1378′. Second back wall panelassembly 1378′ of second printhead management system auxiliary panelassembly 1370′ can be constructed from second back wall frame assembly1378 having second seal-support panel 1375 sealably mounted to secondback wall frame assembly 1378. Second seal-support panel 1375 can havesecond passage 1365, which is proximal to a second end of base 2100 (notshown). Second seal 1367 can be mounted on second seal-support panel1375 around second passage 1365. A first seal can be similarlypositioned and mounted around a first passage for first printheadmanagement system auxiliary panel assembly 1330′. Each passage inauxiliary panel assembly 1330′ and auxiliary panel assembly 1370′ canaccommodate having each maintenance system platform, such as first andsecond maintenance system platforms 2703 and 2704 of FIG. 20B passthrough the passages. As will be discussed in more detail subsequently,in order to sealably isolate auxiliary panel assembly 1330′ andauxiliary panel assembly 1370′ the passages, such as second passage 1365of FIG. 20A must be sealable. It is contemplated that various seals,such as an inflatable seal, a bellows seal and a lip seal can be usedfor sealing a passage, such as second passage 1365 of FIG. 20A, around amaintenance platform affixed to a printing system base.

First printhead management system auxiliary panel assembly 1330′ andsecond printhead management system auxiliary panel assembly 1370′ caninclude first printhead assembly opening 1342 of first floor panelassembly 1341′ and second printhead assembly opening 1382 of secondfloor panel assembly 1381′; respectively. First floor panel assembly1341′ is depicted in FIG. 20A as part of first middle enclosure panelassembly 1340′ of middle panel assembly 1300′. First floor panelassembly 1341′ is a panel assembly in common with both first middleenclosure panel assembly 1340′ and first printhead management systemauxiliary panel assembly 1330′. Second floor panel assembly 1381′ isdepicted in FIG. 20A as part of second middle enclosure panel assembly1380′ of middle panel assembly 1300′. Second floor panel assembly 1381′is a panel assembly in common with both second middle enclosure panelassembly 1380′ and second printhead management system auxiliary panelassembly 1370′.

As previously mentioned, first printhead assembly 2501 can be housed infirst printhead assembly enclosure 2503, and second printhead assembly2502 can be housed in second printhead assembly enclosure 2504. As willbe discussed in more detail subsequently, first printhead assemblyenclosure 2503 and second printhead assembly enclosure 2504 can have anopening at the bottom that can have a rim (not shown), so that variousprinthead assemblies can be positioned for printing during a printingprocess. Additionally, the portions of first printhead assemblyenclosure 2503 and second printhead assembly enclosure 2504 forming ahousing can be constructed as previously described for various panelassemblies, so that the frame assembly members and panels are capable ofproviding an hermetically-sealed enclosure.

A compressible gasket, such as previously described for the hermeticsealing of various frame members, can be affixed around each of firstprinthead assembly opening 1342 and second printhead assembly opening1382, or alternatively around the rim of first printhead assemblyenclosure 2503 and second printhead assembly enclosure 2504.

As depicted in FIG. 20A, first printhead assembly docking gasket 1345and second printhead assembly docking gasket 1385 can be affixed aroundfirst printhead assembly opening 1342 and second printhead assemblyopening 1382, respectively. During various printhead measurement andmaintenance procedures, first printhead assembly 2501 and secondprinthead assembly 2502 can be positioned by first X,Z-axis carriageassembly 2301 and second X,Z-axis carriage assembly 2302, respectively,over first printhead assembly opening 1342 of first floor panel assembly1341′ and second printhead assembly opening 1382 of second floor panelassembly 1381′, respectively. In that regard, for various printheadmeasurement and maintenance procedures, first printhead assembly 2501and second printhead assembly 2502 can be positioned over firstprinthead assembly opening 1342 of first floor panel assembly 1341′ andsecond printhead assembly opening 1382 of second floor panel assembly1381′, respectively, without covering or sealing first printheadassembly opening 1342 and second printhead assembly opening 1382. FirstX,Z-axis carriage assembly 2301 and second X,Z-axis carriage assembly2302 can dock first printhead assembly enclosure 2503 and secondprinthead assembly enclosure 2504, respectively, with first printheadmanagement system auxiliary panel assembly 1330′ and second printheadmanagement system auxiliary panel assembly 1370′, respectively. Invarious printhead measurement and maintenance procedures, such dockingmay effectively close first printhead assembly opening 1342 and secondprinthead assembly opening 1382 without the need for sealing firstprinthead assembly opening 1342 and second printhead assembly opening1382. For various printhead measurement and maintenance procedures, thedocking can include the formation of a gasket seal between each of theprinthead assembly enclosures and the printhead management system panelassemblies. In conjunction with sealably closing passages, such assecond passage 1365 and a complementary first passage of FIG. 20A, whenfirst printhead assembly enclosure 2503 and second printhead assemblyenclosure 2504 are docked with first printhead management systemauxiliary panel assembly 1330′ and second printhead management systemauxiliary panel assembly 1370′ to sealably close first printheadassembly opening 1342 and second printhead assembly opening 1382, thecombined structures so formed are hermetically sealed.

Accordingly, sealing of first printhead assembly opening 1342 and secondprinthead assembly opening 1382 can separate first printhead managementsystem auxiliary panel assembly 1330′ as an auxiliary enclosure sectionand second printhead management system auxiliary panel assembly 1370′ asan auxiliary enclosure section from the remaining volume of gasenclosure assembly 1000. For various printhead measurement andmaintenance procedures, first printhead assembly 2501 and secondprinthead assembly 2502 can be docked upon a gasket in a Z-axisdirection over first printhead assembly opening 1342 and secondprinthead assembly opening 1382, respectively, thereby closing firstprinthead assembly opening 1342 and second printhead assembly opening1382. According to the present teachings, depending on the force appliedto first printhead assembly enclosure 2503 and second printhead assemblyenclosure 2504 in the Z-axis direction, first printhead assembly opening1342 and second printhead assembly opening 1382 can be either be coveredor sealed. In that regard, a force applied to first printhead assemblyenclosure 2503 in the Z-axis direction that can seal first printheadassembly opening 1342 can isolate first printhead management systemauxiliary panel assembly 1330′ as an auxiliary enclosure section fromthe remaining frame member assembly sections comprising gas enclosureassembly 1000. Similarly, a force applied to second printhead assemblyenclosure 2504 in the Z-axis direction that can second printheadassembly opening 1382 can isolate second printhead management systemauxiliary panel assembly 1370′ as an auxiliary enclosure section fromthe remaining frame member assembly sections comprising gas enclosureassembly 1000.

FIGS. 22A-22F are schematic cross-section views of gas enclosureassembly 1001 that can further illustrate various aspects of firstprinthead management system auxiliary panel assembly 1330′ and secondprinthead management system auxiliary panel assembly 1370′. Variousembodiments of a printing system, such as printing system 2000 of FIG.20A and FIG. 20B, can be symmetric, and can have first X,Z-axis carriageassembly 2301 and second X,Z-axis carriage assembly 2302 for positioningfirst printhead assembly 2501 and second printhead assembly 2502,respectively. Moreover, various embodiments of a gas enclosure assemblycan have a first and second auxiliary enclosure, such as first printheadmanagement system auxiliary panel assembly 1330′ and second printheadmanagement system auxiliary panel assembly 1370′ of FIG. 20A, fordocking a first and second X-axis carriage assembly, which can have atleast one printhead assembly, as well as other various apparatuses thatmay require maintenance. In that regard, for FIGS. 22A-22D, given theprinting system symmetry of various printing systems of the presentteachings, the following teachings recited for first printheadmanagement system auxiliary panel assembly 1330′ can apply to secondprinthead management system auxiliary panel assembly 1370′.

FIG. 22A depicts a schematic cross-section view of gas enclosureassembly 1001, showing first printhead management system auxiliary panelassembly 1330′ and second printhead management system auxiliary panelassembly 1370′. First printhead management system auxiliary panelassembly 1330′ of FIG. 22A can house first printhead management system2701, which can be positioned in relationship to first printheadassembly opening 1342 by first printhead management system positioningsystem 2705. First printhead assembly opening 1342 is an opening infirst floor panel assembly 1341′, which is a panel in common with firstprinthead management system auxiliary panel assembly 1330′ and firstmiddle enclosure panel assembly 1340′. First printhead management systempositioning system 2705 can be mounted on first printhead managementsystem platform 2703, which can be stably mounted to base 2100 on firstend 2101. First printhead management system platform 2703 can extendthrough first passage 1361 from first end 2101 of base 2100 into firstprinthead management system auxiliary panel assembly 1330′. Similarly,as depicted in FIG. 22A, second printhead management system auxiliarypanel assembly 1370′ of FIG. 22A can house second printhead managementsystem 2702, which can be positioned in relationship to second printheadassembly opening 1382 by second printhead management system positioningsystem 2706. Second printhead assembly opening 1382 is an opening infirst floor panel assembly 1381′, which is a panel in common with secondprinthead management system auxiliary panel assembly 1370′ and secondmiddle enclosure panel assembly 1380′. Second printhead managementsystem positioning system 2706 can be mounted on second printheadmanagement system platform 2704, which can extend through second passage1365 from second end 2102 of base 2100 into second printhead managementsystem auxiliary panel assembly 1370′.

First seal 1363 can be mounted on first outer surface 1337 of firstseal-support panel 1335 around first passage 1361. Similarly, secondseal 1367 can be mounted on second outer surface 1377 of secondseal-support panel 1375 around second passage 1365. With respect to seal1361 and 1367 of FIG. 22A, it is contemplated that a variety of gasketsproviding a mechanical seal can be used for sealing for sealing passages1361 and 1367.

In various embodiments, an inflatable gasket for sealing passage 1361and 1367 can be used. Various embodiments of an inflatable gasket can bea made from a reinforced elastomeric material into a hollow moldedstructure, which when not inflated can be in a concave, convoluted orflat configuration. In various embodiments, a gasket can be mounted onpanel first outer surface 1337 of first seal-support panel 1335 andsecond outer surface 1377 of second seal-support panel 1375 for sealablyclosing passages 1361 and 1367, respectively around base 2100. As such,when inflated using any of a variety of appropriate fluid media, forexample, but not limited by, an inert gas, various embodiments of aninflatable gasket for sealably closing passages 1361 and 1367 aroundbase 2100, can form a tight barrier between a mounting surface, such asfirst outer surface 1337 of first seal-support panel 1335 and secondouter surface 1377 of second seal-support panel 1375, and a strikingsurface, such as the surface of first end 2101 and second end 2012 ofbase 2100, respectively. In various embodiments, an inflatable gasketcan be mounted on first end 2101 and second end 2012 of base sealingpassage 1361 and 1367, respectively. In that regard, for variousembodiments, first end 2101 and second end 2012 of base 2100 can be amounting surfaces and the first outer surface 1337 of first seal-supportpanel 1335 and second outer surface 1377 of second seal-support panel1375 can be a striking surfaces, respectively. In that regard, variousembodiments a conforming seal can be used to sealably close passages1361 and 1365.

In addition to various embodiments of an inflatable gasket, a flexibleseal, such as a bellows seal or a lip seal, can also be used for sealingpassage a passage, such as passage 1361 and 1365 of FIG. 22A. Variousembodiments of a flexible seal can be permanently attached, for example,attached to first outer surface 1337 of first seal-support panel 1335and second outer surface 1377 of second seal-support panel 1375.Alternatively, various embodiments of a flexible seal can be permanentlyattached to first end 2101 and second end 2102 of base 2100. Such apermanently attached seal can provide the flexibility needed toaccommodate the various translational and vibrational movements of base2100, while at the same time providing a hermetic seal for a passage,such as passages 1361 and 1365.

Regarding various challenges related to hermetic sealing of variousembodiments of a gas enclosure assembly of the present teachings,forming a conforming seal around a well-defined edge can be problematic.In various embodiments of a gas enclosure in which sealing around astructure, such as first printhead management system platform 2703 andsecond printhead management system platform 2703 affixed to first end2101 and second end 2012 of base 2100, respectively. Such platformstructures can be fabricated to eliminate well-defined edges wheresealing is desired. For example, first printhead management systemplatform 2703 and second printhead management system platform 2703affixed to first end 2101 and second end 2012 of base 2100 can beinitially fabricated to have rounded lateral edges for promotingsealing. first printhead management system platform 2703 and secondprinthead management system platform 2703 affixed to first end 2101 andsecond end 2012 of base 2100 can be made of a material that can providethe stability needed for supporting a printhead management system, forexample, but not limited by, granite and steel, and also modified forpromoting sealing.

FIGS. 22B and 22C illustrate covering and sealing of various openingsand passages of gas enclosure assembly 1001 of the present teachings,which illustrates positioning of first printhead assembly 2501 withrespect to first printhead management system auxiliary panel assembly1330′ for various procedures related to printhead assembly management,for example. As previously mentioned, the following teachings for firstprinthead management system auxiliary panel assembly 1330′ can apply tosecond printhead management system auxiliary panel assembly 1370′, aswell.

In FIG. 22B, first printhead assembly 2501 can include a printheaddevice 2505, having at least one printhead, which includes a pluralityof nozzles or orifices. Printhead device 2505 can be housed in firstprinthead assembly enclosure 2503, which can have first printheadassembly enclosure opening 2507 from which printhead device 2505 can bepositioned so that during printing the nozzles eject ink at a controlledrate, velocity and size onto a substrate mounted on substrate floatationtable 2200. As previously discussed, first X,Z-axis carriage assembly2301 can be controlled during a printing process to position firstprinthead assembly 2501 over a substrate for printing. Additionally, asdepicted in FIG. 22B, for various embodiments of gas enclosure assembly1001, first X,Z-axis carriage assembly 2301, which has controllable X-Zaxis movement, can position first printhead assembly 2501 in over firstprinthead assembly opening 1342. As depicted in FIG. 22B, firstprinthead assembly opening 1342 of first floor panel assembly 1341′ iscommon to first middle enclosure panel assembly 1340′ and firstprinthead management system auxiliary panel assembly 1330′.

First printhead assembly enclosure 2503 of FIG. 22B can include firstprinthead assembly enclosure rim 2509, which can be a docking surfacewith first floor panel assembly 1341′ around first printhead assemblyopening 1342. First printhead assembly enclosure rim 2509 can engagefirst printhead assembly docking gasket 1345, which is depicted in FIG.22B affixed around first printhead assembly opening 1342. Though firstprinthead assembly enclosure rim 2509 is shown depicted as an inwardlyprojecting structure, any of variety of rims can be constructed on firstprinthead assembly enclosure 2503. Additionally, though first printheadassembly docking gasket 1345 is depicted in FIG. 22B to be affixedaround first printhead assembly opening 1342, the ordinary practitionerwill appreciate that gasket 1345 can be affixed to first printheadassembly enclosure rim 2509. First printhead assembly docking gasket1345 can be any of a gasket material as previously described for sealingframe member assemblies. In various embodiments of gas enclosureassembly 1001 of FIG. 22B, first printhead assembly docking gasket 1345can be an inflatable gasket, such as gasket 1363. In that regard, firstprinthead assembly docking gasket 1345 can be an inflatable gasket aspreviously described for FIG. 22A. As previously presented, first seal1363 can be mounted on first outer surface 1337 of first seal-supportpanel 1335 around first passage 1361.

As depicted in FIG. 22B and FIG. 22C, for various measurement andmaintenance procedures that can be conducted in a fully-automated mode,first printhead assembly 2501 can remain positioned over first printheadassembly opening 1342. In that regard, first printhead assembly 2501 canbe adjusted in the Z-axis direction by first X,Z-axis carriage assembly2301 for positioning printhead device 2505 over first printhead assemblyopening 1342 with respect to first printhead management system 2701.Additionally, first printhead management system 2701 can be adjusted inthe Y-X direction on first printhead management system positioningsystem 2705 for positioning first printhead management system 2701 withrespect to printhead device 2505. During various procedures related tothe management of a printhead assembly, first printhead assembly 2501can be placed into contact with first printhead assembly docking gasket1345 by further adjustment in the Z-axis direction by first X,Z-axiscarriage assembly 2301 to place first printhead assembly enclosure 2503in a position to cover first printhead assembly opening 1342 (notshown). As depicted in FIG. 22C, for various procedures related to themanagement of a printhead assembly, for example, but not limited by,maintenance procedures requiring direct access to the interior of firstprinthead management system auxiliary panel assembly 1330′, firstprinthead assembly 2501 can be docked with first printhead assemblydocking gasket 1345 by still further adjustment in the Z-axis directionby first X,Z-axis carriage assembly 2301 to seal first printheadassembly opening 1342. As previously mentioned, first printhead assemblydocking gasket 1345 can be either a compressible gasket material aspreviously described for the hermetic sealing of various frame members,or an inflatable gasket, as previously described for FIG. 22A.Additionally, as depicted in FIG. 22C, inflatable gasket 1363 can beinflated, thereby sealably closing first passage 1361. Moreover, theportions of first printhead assembly enclosure 2503 forming a housingcan be constructed as previously described for various panel assemblies,so that the frame assembly members and panels are capable of providingan hermetic enclosure. As such, for FIG. 22C, when first printheadassembly opening 1342 and first passage 1361 are sealably closed, firstprinthead management system auxiliary panel assembly 1330′ can beisolated from the remaining volume of gas enclosure assembly 1001.

In FIG. 22D and FIG. 22E, various embodiments of gas enclosure 1001 aredepicted in which first printhead management system 2701 and secondprinthead management system 2702 can be mounted on first printheadmanagement system platform 2703 and second printhead management systemplatform 2704, respectively. In 22D and FIG. 22E, first printheadmanagement system platform 2703 and second printhead management systemplatform 2704 are enclosed within first printhead management systemauxiliary panel assembly 1330′ and second printhead management systemauxiliary panel assembly 1370′, respectively. As previously mentioned,the following teachings for first printhead management system auxiliarypanel assembly 1330′ can apply to second printhead management systemauxiliary panel assembly 1370′, as well. In that regard, as indicated inFIG. 22D, first printhead assembly 2501 can be docked with firstprinthead assembly docking gasket 1345 with enough force applied theZ-axis direction by first X,Z-axis carriage assembly 2301 so that firstprinthead assembly opening 1342 can be sealed. As such, for FIG. 22D,when first printhead assembly opening 1342 is sealably closed, firstprinthead management system auxiliary panel assembly 1330′ can beisolated from the remaining volume of gas enclosure assembly 1001.

As previously taught for various embodiments of gas enclosure assembly1001 of FIGS. 22A-22C, a printhead can remain positioned over firstprinthead assembly opening 1342 to during various procedures related tothe management of a printhead assembly without covering or sealing firstprinthead assembly opening 1342 so as to close first printhead assemblyopening 1342. In various embodiments of gas enclosure assembly 1001, forexample, but not limited by, for various maintenance procedures, aprinthead assembly enclosure can be placed into contact with a gasket byadjusting the Z-axis to cover a printhead assembly opening. In thisregard, FIG. 22E can be interpreted in two ways. In a firstinterpretation, first printhead assembly docking gasket 1345 and secondprinthead assembly docking gasket 1385 can made from a compressiblegasket material, such as previously described for the hermetic sealingof various frame members. In FIG. 22E, first printhead assembly 2501 hasbeen positioned in the Z-axis direction over first printhead managementsystem 2701 so that gasket 1345 has been compressed, thereby sealablyclosing first printhead assembly opening 1342. In comparison, secondprinthead assembly 2502 has been positioned in the Z-axis direction oversecond printhead management system 2702 to contact second printheadassembly docking gasket 1385, thereby covering second printhead assemblyopening 1382. In a second interpretation, first printhead assemblydocking gasket 1345 and second printhead assembly docking gasket 1385can be an inflatable gasket, as previously described for FIG. 22A. InFIG. 22E, first printhead assembly 2501 can be positioned in the Z-axisdirection over first printhead management system 2701 to contact firstprinthead assembly docking gasket 1345 before it is inflated, therebycovering first printhead assembly opening 1342. In comparison, secondprinthead assembly 2502 has been positioned in the Z-axis direction oversecond printhead management system 2702 so that when second printheadassembly docking gasket 1385 is inflated, second printhead assemblyopening 1382 is sealably closed.

FIG. 22F depicts that a volume defined by, for example, illustratedusing first printhead management system auxiliary panel assembly 1330′and second printhead management system auxiliary panel assembly 1370′,can be sealed using a covering such as, for example, but not limited by,a gate-valve assembly. The following teachings for first printheadmanagement system auxiliary panel assembly 1330′ and second printheadmanagement system auxiliary panel assembly 1370′ can apply to variousembodiments of printhead management system panel assemblies and gasenclosure assemblies. As depicted in FIG. 22F, closing first printheadassembly opening 1342 and second printhead assembly opening 1382 using,for example, but not limited by, first printhead assembly gate valve1347 and second printhead assembly gate valve 1387, respectively, canprovide for continued operation of first printhead assembly 2501 andsecond printhead assembly 2502, respectively. As depicted for firstprinthead management system auxiliary panel assembly 1330′ of FIG. 22F,sealably closing first printhead assembly opening 1342 using firstprinthead assembly gate valve 1347, as well as sealably closing firstpassage 1361 around base 2100 can be done remotely and automatically.Similarly, as depicted for second printhead management system auxiliarypanel assembly 1370′ of FIG. 22F, sealably closing second printheadassembly opening 1382 using second printhead assembly gate valve 1387can be done remotely and automatically. It is contemplated that variousprinthead measurement and maintenance procedures can be facilitated byisolation of a volume defined by an auxiliary frame member assemblysection, for example, as defined by first printhead management systemauxiliary panel assembly 1330′ and second printhead management systemauxiliary panel assembly 1370′, while still providing for thecontinuation of printing processes utilizing first printhead assembly2501 and second printhead assembly 2502.

As previously mentioned, first printhead assembly docking gasket 1345and second printhead assembly docking gasket 1385 can be affixed aroundfirst printhead assembly opening 1342 and second printhead assemblyopening 1382, respectively. Additionally, as depicted in FIG. 22F, firstprinthead assembly docking gasket 1345 and second printhead assemblydocking gasket 1385 can be affixed around first printhead assemblyenclosure rim 2509 and second printhead assembly enclosure rim 2510,respectively. When maintenance of first printhead assembly 2501 andsecond printhead assembly 2502 is indicated, first printhead assemblygate valve 1347 and second printhead assembly gate valve 1387 can beopened, and first printhead assembly 2501 and second printhead assembly2502 can dock with first printhead management system auxiliary panelassembly 1330′ and second printhead management system auxiliary panelassembly 1370′ as previously described.

For example, but not limited by, any procedure related to the managementof a printhead assembly that can be performed on first printheadmanagement system 2701 and second printhead management system 2702 byisolating first printhead management system auxiliary panel assembly1330′ and second printhead management system panel assembly 1370,′respectively, without interrupting printing processes. It is furthercontemplated that loading of new printheads or printhead assembles intothe system, or removal of printheads or printhead assemblies from thesystem can be done by isolating first printhead management systemauxiliary panel assembly 1330′ and second middle printhead managementsystem panel assembly 1370,′ respectively, without interrupting printingprocesses. Such activities may be facilitated automatically, forexample, but not limited by, the use of robots. For example, but notlimited by, robotic retrieval of a printhead stored in a volume definedby an auxiliary frame member assembly section, such as first printheadmanagement system auxiliary panel assembly 1330′ and second printheadmanagement system auxiliary panel assembly 1370′ of FIG. 22F could bedone, followed by robotic changing of a malfunctioning printhead onprinthead device 2505 of first printhead assembly 2501 or on printheaddevice 2506 of second printhead assembly 2502 for a functioningprinthead. This could then be followed by robotic deposition of amalfunctioning printhead into a module in either first printheadmanagement system 2701 or second printhead management system 2702. Suchmaintenance procedures can be carried out in an automated mode withoutdisrupting ongoing printing processes.

After robotic deposition of a malfunctioning printhead in either firstprinthead management system 2701 or second printhead management system2702, a volume defined by an auxiliary frame member assembly section,such as first printhead management system auxiliary panel assembly 1330′and second printhead management system auxiliary panel assembly 1370′,respectively can be sealably closed and isolated by closing firstprinthead assembly opening 1342 and second printhead assembly opening1382 using, for example, but not limited by, first printhead assemblygate valve 1347 and second printhead assembly gate valve 1387,respectively. Moreover a volume defined by an auxiliary frame memberassembly section can then be opened to the atmosphere, for example, inaccordance with the preceding teachings, so that malfunctioningprintheads can be retrieved and replaced. As will be discussed in moredetail subsequently, as various embodiments of a gas purification systemare designed with respect to the volume of an entire gas enclosureassembly, gas purification resources can be devoted to purging thesignificantly reduced volume of a volume defined by an auxiliary framemember assembly section space, thereby significantly reducing systemrecovery time for a volume defined by an auxiliary frame member assemblysection. In that regard, various procedures related to the management ofa printhead assembly that would require opening an auxiliary framemember assembly section to the atmosphere can be carried out with eitherno or minimal disruption to ongoing printing processes.

FIG. 23 depicts an expanded view of first printhead management system2701 housed within first printhead management system auxiliary panelassembly 1330′ in accordance with various embodiments of a gas enclosureassembly and system of the present teachings. As previously discussed, aprinthead management system can include, for example, but not limitedby, a drop measurement module, a purge station, a blotting station and aprinthead exchange station. In various embodiments of a printheadmanagement system, a drop measurement module can perform measurements ona printhead, such as checking for nozzle firing, measuring drop volume,velocity and trajectory, as well as tuning a printhead so that eachnozzle ejects a droplet of known volume. For various embodiments of aprinthead management system, a purge station can be used for priming andpurging a printhead, which requires collection and containment of theink expelled from a printhead, while a blotting station can be utilizedfor removal of excess ink after the priming or purging procedure.Additionally, a printhead management system can include one or moreprinthead exchange stations for receiving one or more printheads orprinthead devices that have been removed from a printhead assembly, suchas first printhead assembly 2501 and second printhead assembly 2502 ofFIG. 20B, as well as for storing printheads or printhead devices thatcan be loaded into first printhead assembly 2501 and second printheadassembly 2502 during a various procedures related to the management of aprinthead assembly.

Various embodiments of a printhead management system according to thepresent teachings, such as first printhead management system 2701 ofFIG. 23, apparatuses 2707, 2709, and 2011 can be a variety of modulesfor performing various functions. For example apparatuses 2707, 2709,and 2011 can be one or more of a drop measurement module, a printheadreplacement module, a purge basin module and a blotter module. Firstprinthead management system 2701 can be mounted on first printheadmanagement system positioning system 2705. First printhead managementsystem positioning system 2705 can provide Y-axis movement toselectively align each of the various modules with a printhead assemblyhaving a printhead device with at least one printhead, such as printheaddevice 2505 of FIG. 22B, with first printhead assembly opening 1342.Positioning of various modules with a printhead assembly having aprinthead device with at least one printhead can be done using acombination of first printhead management system positioning system2705, as well as a printhead assembly positioning system, such as firstX,Z-axis carriage assembly 2301 of FIG. 20B. For various embodiments ofa gas assembly system of the present teachings, printhead managementsystem positioning system 2705 can provide Y-X positioning of variousmodules of first printhead management system 2701 relative to firstprinthead assembly opening 1342, while first X,Z-axis carriage assembly2301 can provide X-Z positioning of first printhead assembly 2501 overfirst printhead assembly opening 1342. In that regard, a printheaddevice with at least one printhead can be positioned over or withinfirst printhead assembly opening 1342 to receive maintenance.

FIG. 24A depicts an expanded view of first printhead management system2701A housed within first printhead management system auxiliary panelassembly 1330′ in accordance with various embodiments of a gas enclosureassembly and system of the present teachings. As depicted in FIG. 24A,auxiliary panel assembly 1330′ is shown with front removable servicewindows absent to more clearly see the details of first printheadmanagement system 2701A. Various embodiments of a printhead managementsystem according to the present teachings, such as first printheadmanagement system 2701A of FIG. 24A, apparatuses 2707, 2709, and 2011can be a variety of subsystems or modules for performing variousfunctions. For example apparatuses 2707, 2709, and 2011 can be a dropmeasurement module, a printhead purge basin module and a blotter module.As depicted in FIG. 24A, printhead replacement module 2713 can providelocations for docking at least one printhead device 2505. In variousembodiments of first printhead management system 2701A, first printheadmanagement system auxiliary panel assembly 1330′ can be maintained tothe same environmental specifications that gas enclosure assembly 1000(see FIG. 19) is maintained. First printhead management system auxiliarypanel assembly 1330′ can have handler 2530 positioned for the carryingout tasks associated with various printhead management procedures. Forexample, each subsystem can have various parts that are consumable bynature, and require replacement, such as replacing blotter paper, ink,and waste reservoirs. Various consumable parts can be packaged for readyinsertion, for example, in a fully automated mode using a handler. As anon-limiting example, blotter paper can be packaged in a cartridgeformat, which can be readily inserted for use into a blotting module. Byway of another non-limiting example ink can be packaged in a replaceablereservoir, as well as a cartridge format for use in a printing system.Various embodiments of a waste reservoir can be packaged in a cartridgeformat, which can be readily inserted for use into a purge basin module.Additionally, parts of various components of a printing system subjectto on-going use can require periodic replacement. During a printingprocess, expedient management of a printhead assembly, for example, butnot limited by, an exchange of a printhead device or printhead, can bedesirable. A printhead replacement module can have parts, such as aprinthead device or printhead, which can be readily inserted for useinto a printhead assembly. A drop measurement module used for checkingfor nozzle firing, as well as the measurement based on optical detectionof drop volume, velocity and trajectory from every nozzle can have asource and a detector, which can require periodic replacement after use.Various consumable and high-usage parts can be packaged for readyinsertion, for example, in a fully automated mode using a handler.Handler 2530 can have end effector 2536 mounted to arm 2534. Variousembodiments of an end effector configuration can be used, for example, ablade-type end effector, a clamp-type end effector, and a gripper-typeend effector. Various embodiments of an end effector can includemechanical grasping and clamping, as well as pneumatic orvacuum-assisted assemblies to either actuate portions of the endeffector or otherwise retain a printhead device or a printhead from aprinthead device.

Regarding the replacement of a printhead device or printhead, printheadreplacement module 2713 of printhead management system 2701A FIG. 24Acan include a docking station for a printhead device having at least oneprinthead, as well as a storage receptacle for a printhead. As eachprinthead assembly (see FIG. 20B) can include between about 1 to about60 printhead devices, and as each printhead device can have betweenabout 1 to about 30 printheads, then various embodiments of a printingsystem of the present teachings can have between about 1 to about 1800printheads. In various embodiments of printhead replacement module 2013,while a printhead device is docked, each printhead mounted to theprinthead device can be maintained in an operable condition while not inuse in a printing system. For example, when placed in a docking station,each printhead on each printhead device can be connected to an inksupply and an electrical connection. Electrical power can be provided toeach printhead on each printhead device, so that a periodic firing pulseto each nozzle of each printhead can be applied while docked in order toensure that the nozzles remain primed and do not clog. Handler 2530 ofFIG. 24A can be positioned proximal to printhead assembly 2500.Printhead assembly 2500 can be docked over first printhead managementsystem auxiliary panel assembly 1330′, as depicted in FIG. 24A. During aprocedure for exchanging a printhead, handler 2530 can remove a targetpart; either a printhead or printhead device having at least oneprinthead, from printhead assembly 2500. Handler 2530 can retrieve areplacement part, such as a printhead device or a printhead, fromprinthead replacement module 2013, and complete the replacement process.The removed part can be placed in printhead replacement module 2713 forretrieval.

As depicted in FIG. 24B, auxiliary panel assembly 1330′ can have firstremovable service window 130A and second removable service window 130Bmounted on the front panel for ready access from the exterior of a gasenclosure, such as gas enclosure 1000 of FIG. 20A. Additionally, a loadlock, such as load lock 1350, can be mounted on a wall panel ofauxiliary panel assembly 1330′. According to various embodiments of thepresent teachings, a printhead management procedure as described forFIG. 24A recited as being performed by a handler, can be performedremotely by an end-user through various gloveports, as shown by thevarious locations of gloves and gloveports in FIG. 24A and FIG. 24B.

Moreover, for various embodiments of systems and methods of the presentteachings, load lock 1350 can be used transfer various parts forsubsystems and modules of various embodiments of a printhead managementsystem of the present teachings. Various replacement parts for printheadmanagement system 2701A of FIG. 24A, for example, but not limited by, ablotter paper cartridge, an ink cartridge, a waste reservoir, aprinthead and a printhead device, and can transferred into auxiliarypanel assembly 1330′ using load lock 1350 using handler 2530 of FIG.24A, and moved to printhead management system 2701A of FIG. 24A.Conversely, parts needing replacement, for example, but not limited by,a blotter paper cartridge, an ink cartridge, a waste reservoir, aprinthead and a printhead device, can be removed from printheadmanagement system 2701A by handler 2530 of FIG. 24A and placed in loadlock 1350. According to the present teachings, load lock 1350 can have agate that is open to the exterior of a gas enclosure, such as gasenclosure 1000 of FIG. 20A, while a gate that allows access to auxiliarypanel assembly 1330′ is closed, exposing only load lock 1350 to ambientgas during a procedure for transfer of parts. After a procedure for theretrieval of parts, the replacement of parts or both has been completed,a gate for load lock 1350 allowing access to the exterior of a gasenclosure can be closed, and load lock 1350 can go through a recoveryprocedure to restore the gas environment of the load lock to a targetspecification. In a next step, a gate between load lock 1350 andauxiliary panel assembly 1330′ can be open, so that retrieval or removedparts from auxiliary panel assembly 1330′, as well as transfer ofreplacement parts to auxiliary panel assembly 1330′ can be done by ahandler, such as handler 2530 of FIG. 24A.

Given the substantially small volume of load lock 1350 in comparison tothe volume of auxiliary panel assembly 1330′, the recovery time issubstantially shorter than the recovery time for auxiliary panelassembly 1330′, allowing ready transfer of parts between load lock 1350and auxiliary panel assembly 1330′ without interruption of a printingprocess. Further, should any maintenance requiring direct access toauxiliary panel assembly 1330′ be indicated, removable service windows130A and 130B can allow such direct access to auxiliary panel assembly1330′ from the exterior of a gas enclosure, such as gas enclosure 1000of FIG. 20A. Given the substantially small volume of auxiliary panelassembly 1330′ in comparison to the volume of the working volume of agas enclosure, such as gas enclosure 1000 of FIG. 20A, the recovery timefor auxiliary panel assembly 1330′ is substantially shorter than therecovery time for the entirety of the working volume of a gas enclosure.As such, all steps associated with a printhead management procedure canbe done to eliminate or minimize the exposure of a printing systemenclosure to contamination, such as air and water vapor and variousorganic vapors, as well as particulate contamination. According tovarious systems and methods of the present teachings, a printing systemenclosure may be introduced to a level of contamination that issufficiently low that a purification system can remove the contaminationbefore it can affect a printing process. In that regard, variousembodiments of auxiliary panel assembly 1330′ can provide for fullyautomated replacement of a part in a printhead management system whilemaintaining an inert, particle-free environment and with little or nointerruption of a printing process.

FIG. 25 illustrates expanded perspective view of first printheadmanagement system auxiliary panel assembly 1330′. As indicated, it iscontemplated that the volume of various printhead management systempanel assemblies, such as first printhead management system auxiliarypanel assembly 1330′, can be about 2 m³. It is contemplated that variousembodiments of an auxiliary frame member assembly section can have avolume of about 1 m³, while for various embodiments of an auxiliaryframe member assembly section the volume can be about 10 m³. For variousembodiments of a gas enclosure assembly, such as gas enclosure assembly100 of FIG. 3 and 1000 of FIG. 19, an auxiliary frame member assemblysection can be a fractional value of the enclosure volume of a gasenclosure system. For example, an auxiliary frame member assemblysection can be less than or equal to about 1% of the enclosure volume ofa gas enclosure system. In various embodiments of a gas enclosureassembly, an auxiliary frame member assembly section can be less than orequal to about 2% of the enclosure volume of a gas enclosure system. Forvarious embodiments of a gas enclosure assembly, an auxiliary framemember assembly section can be less than or equal to about 5% of thetotal volume of a gas enclosure system. In various embodiments of a gasenclosure assembly, an auxiliary frame member assembly section can beless than or equal to about 10% of the enclosure volume of a gasenclosure system. In various embodiments of a gas enclosure assembly, anauxiliary frame member assembly section can be less than or equal toabout 20% of the enclosure volume of a gas enclosure system.Accordingly, given the relatively small volume of an auxiliaryenclosure, recovery of an auxiliary enclosure can take significantlyless time than recovery of an entire printing system enclosure.

Various procedures associated with printhead management can be conductedin a fully-automated mode. As will be discussed in more detailsubsequently, in some instances, where a certain degree of end-userintervention may be indicated during various procedures related to themanagement of a printhead assembly, end-user access can be doneexternally through, for example, the use of gloveports. As previouslydiscussed, various embodiments of a gas enclosure assembly with anauxiliary enclosure as a section of the gas enclosure assembly, forexample, as depicted in FIG. 19 through FIG. 25 effectively decrease thevolume of inert gas required during an OLED printing process, while atthe same time provide ready access to the interior of gas enclosure.

In addition to various embodiments of a gas enclosure system having anauxiliary enclosure constructed as a section of a gas enclosureassembly, various embodiments of an auxiliary enclosure can beassociated with a gas enclosure system without being constructed as anauxiliary frame member assembly section of a gas enclosure assembly.

For example, for various embodiments of a gas enclosure system of thepresent teachings, an auxiliary enclosure can be an adaptablecontrolled-environment enclosure. According to the present teachings, anadaptable controlled-environment enclosure can be adaptable with respectflexibility of design and construction, which can include, for example,number and types of openings, environmental control systems, size,breadth of selection of materials used for construction, as well as easeof installation. For example, in various embodiments, an adaptable canbe of a soft wall construction, in which the framework can be, forexample, either steel, powder-coated steel, or aluminum, and the panelscan be fabricated from a flexible polymer sheet material, such as forexample, vinyl, polyvinyl chloride, and polyurethane, of about 1-2 mmthickness. For various embodiments of a soft wall construction, theflexible polymeric sheet material can be mounted as a series of strips,as intact sheets, as well as combinations of strips and sheets. In stillother embodiments of an auxiliary enclosure, an adaptablecontrolled-environment enclosure can be a hard wall construction, inwhich the panel material is a rigid material, such as a rigid plastic,for example, an acrylic or polycarbonate material, or a tempered glassmaterial. For various embodiments of a hard wall construction, variouspanels of a hard wall construction, such as a wall panel, window panel,and door panel, can be selected from different materials. In variousembodiments of the present teachings, an adaptablecontrolled-environment enclosure can be a combination of a hard wall andsoft wall construction. Panel materials for various embodiments of anadaptable controlled-environment enclosure of the present teachings maybe selected for attributes that include, for example, but not limitedby, low-particle generation, high optical clarity, effective staticdissipation, and mechanical durability.

In addition to an adaptable controlled-environment enclosure, variousembodiments of an auxiliary enclosure can be a transfer chamber. Instill other embodiments, an auxiliary chamber can be a load lockchamber. According to the present teachings, various embodiments of anauxiliary enclosure can have a separate environmental control systemfrom the working volume of a gas enclosure system, while otherembodiments of an auxiliary enclosure can be maintained using the sameenvironmental control system as the working volume of a gas enclosuresystem. Various embodiments of an auxiliary enclosure can be stationary,while other embodiments of an auxiliary enclosure can be movable, suchas on wheels or on a track assembly, so that they can be readilypositioned for use proximal to a gas enclosure system.

FIG. 26A depicts a perspective view of OLED printing tool 4000 accordingto various embodiments of the present teachings, which can include firstmodule 3400, printing module 3500, and second module 3600. Variousmodules, such as first module 3400 can have first transfer chamber 3410,which can have a gate, such as gate 3412, for each side of firsttransfer chamber 3410 to accommodate various chambers having a specifiedfunction. As depicted in FIG. 26A first transfer chamber 3410 can have aload lock gate (not shown) for integration of first load lock chamber3450 with first transfer chamber 3410, as well as a buffer gate (notshown) for integration of first buffer chamber 3460 with first transferchamber 3410. Gate 3412 of first transfer chamber 3410 can be used for achamber or unit that can be movable, such as, but not limited by, a loadlock chamber. Observation windows, such as observation windows 3402 and3404 of first transfer chamber 3410, as well as observation window 3406of first buffer chamber 3460, can be provided for an end user to, forexample, monitor a process. Printing module 3500 can include gasenclosure assembly 3510, which can have first panel assembly 3520,printing system enclosure assembly 3540, and second panel assembly 3560.Similar to gas enclosure assembly 1000 of FIG. 19, gas enclosureassembly 3510 can house various embodiments of a printing system. Secondmodule 3600 can include second transfer chamber 3610, which can have agate, such as gate 3612, for each side of second transfer chamber 3610to accommodate various chambers having a specified function. As depictedin FIG. 26A second transfer chamber 3610 can have a load lock gate (notshown) for integration of second load lock chamber 3650 with secondtransfer chamber 3610, as well as a buffer gate (not shown) forintegration of second buffer chamber 3660 with second transfer chamber3610. Gate 3612 of second transfer chamber 3610 can be used for achamber or unit that can be movable, such as, but not limited by, a loadlock chamber. Observation windows, such as observation windows 3602 and3604 of second transfer chamber 3610, can be provided for an end userto, for example, monitor a process.

First load lock chamber 3450 and second load lock chamber 3650 can beaffixably associated with first transfer chamber 3410 and secondtransfer chamber 3610, respectively or can be movable, such as on wheelsor on a track assembly, so that they can be readily positioned for useproximal a chamber. As previously described for gas enclosure system 500of FIG. 1, a load lock chamber can be mounted to a support structure andcan have at least two gates. For example first load lock chamber 3450can be supported by first support structure 3454 and can have first gate3452, as well as a second gate (not shown) that can allow fluidcommunication with first transfer module 3410. Similarly, second loadlock chamber 3650 can be supported by second support structure 3654 andcan have second gate 3652, as well as a first gate (not shown) that canallow fluid communication with second transfer module 3610.

FIG. 26B a first phantom perspective view of OLED printing tool 4000 ofFIG. 26A, which particularly depicts the placement of a plurality of fanfilter units proximal to the position of travel of a substrate. Aspreviously discussed, the number, size and shape of fan filter units fora fan filter unit assembly of a circulation and filtration system can beselected in accordance with the physical position of a substrate in aprinting system during processing. The number, size and shape of fanfilter units for a fan filter unit assembly selected with respect to thephysical travel of a substrate can provide a low-particle zone proximala substrate during a substrate manufacturing process. Variousembodiments of printing module 3500 of FIG. 26A through FIG. 26C canalso include a controlled particulate level meeting the standards ofInternational Standards Organization Standard (ISO) 14644-1:1999,“Cleanrooms and associated controlled environments—Part 1:Classification of air cleanliness,” as specified by Class 1 throughClass 5. In an illustrative example of FIG. 26B, an array of fan filterunits can be located along a path traversed by a substrate duringprocessing, such, for example fan filter units 3422 and 3423 of firstmodule 3400, as well as fan filter units 3522, 3542, 3544, and 3562 ofsecond module 3500 as depicted in FIG. 26B. Fan filter units can beincluded in other chambers, such as one or more fan filter unit locatedwithin transfer chamber 3610 of second module 3600, similarly to fanfilter units 3422 and 3423 of first module 3400, within the first bufferchamber 3460 or the second buffer chamber 3660. As previously described,various embodiments of a circulation and filtration system of thepresent teachings need not provide a down-flow direction of air flow.For various embodiments of systems and methods of the present teachings,ductwork and fan filter units can be positioned to provide asubstantially laminar flow in a lateral direction across a surface of asubstrate, such as substrate 2050, as well as a vertical direction, asdepicted in FIG. 26B. Such laminar flow can enhance or otherwise provideparticulate control.

FIG. 26C is a second phantom perspective view of OLED printing tool 4000of FIG. 26A, which shows more detail of a handler and a printing systemaccording to the present teachings. As previously discussed, OLEDprinting tool 4000 can include a first load lock chamber 3450, which canbe sealably coupled to a first transfer chamber 3410. The first loadlock chamber 3450 can be in fluid communication with transfer chamber3410 by a port, which can be, for example, a gas-impermeable gate. Whensuch a gas-impermeable gate is opened, an interior of first load lockchamber 3450 can be accessed by a handler, such as handler 3430,depicted in FIG. 26C in first transfer chamber 3410. Handler 3430, shownin FIG. 26C can have base 3432, arm assembly 3434, and end effector3436. Handler 3430, which is proximal to first transfer module printingsystem gate 3418, can position a substrate on the input end offloatation table 2200, which can be supported by printing system base2100. Given the position of handler 3430 within first module 3400,handler 3430 can be proximal to any chamber of first module 3400, andcan, for example, position a substrate into any chamber. In that regard,handler 3430 can position a substrate into buffer 3460 via first modulebuffer gate 3416 as workflow may demand. Handler 3430 can be a roboticassembly having various degrees of freedom in order to manipulate asubstrate, such as substrate 2050, which are shown in FIG. 26C to besupported on floatation table 2200 of printing system 2000. Handler 3430can manipulate a substrate using an end effector, such as end effector3436. An end effector such as end effector 3436 can include a tray orframe configured to support a substrate by gravity, or an end effectorcan securely grasp or clamp a substrate to allow, for example, securetransfer from one position to a next position or for reorientation ofthe substrate from a face-up or face-down configuration to one or moreother configurations. Various embodiments of an end effectorconfiguration can be used, for example, a fork-type, a blade-type endeffector, a clamp-type end effector, and a gripper-type end effector.Various embodiments of an end effector can include mechanical graspingand clamping, as well as pneumatic or vacuum-assisted assemblies toeither actuate portions of the end effector or otherwise retain asubstrate. Various embodiments of an end effector can include vacuumsuction cups.

Regarding other features of OLED printing tool 4000 as depicted in FIG.26C, as previously discussed for gas enclosure assembly 100 of FIG. 3and gas enclosure assembly 1000 of FIG. 19, printing module 3500 of OLEDprinting tool 4000 can include gas enclosure assembly 3510. Gasenclosure assembly 3510 can have first panel assembly 3520, printingsystem enclosure assembly 3540, and second panel assembly 3560. Printingmodule 3500 can have an internal environment maintained as an inert gasenvironment, and as previously discussed, can be sealed from thesurrounding environment (e.g., hermetically sealed). Additionally, firstmodule 3400 and second module 3600 and all associated chambers canlikewise have an internal environment that is maintained as an inert gasenvironment, so that OLED printing tool 4000 can be entirely sealed fromthe surrounding environment (e.g., hermetically sealed) and have aninternal environment maintained as an inert gas environment. As will bediscussed in more detail subsequently, a printhead management system,such as printhead management system 2701 FIG. 20B and FIG. 23 andprinthead management system 2701A of FIG. 24A, can be positioned inprinting system enclosure assembly area 3570 proximal to first bridgeend 2132 and printhead assembly 2500. An enclosed system, such asprinting tool 4000, including all of the various enclosed interiorregions can be monitored and controlled to maintain specified levels ofone or more of gas purity, contaminants, or particulates. Recalling, aninert gas environment can be maintained using a gas, such as nitrogen,any of the noble gases, and any combination thereof. An inert gasenvironment within a gas enclosure system can have levels of each of areactive species, such as water vapor, oxygen, as well as organicsolvent vapors, maintained at 100 ppm or lower, for example, at 10 ppmor lower, at 1.0 ppm or lower, or at 0.1 ppm or lower for variousembodiments of a gas enclosure system of the present teachings.

For various embodiments of OLED printing tool 4000 of FIG. 26C, firstprocessing module 3400 can include buffer or holding module 3460configured to provide respective environmentally-controlled regions toaccommodate respective substrates being fabricated. Variousenvironmentally-controlled regions can be offset from each other along aspecified (e.g., vertical) axis of a buffer or holding module to providea “stack buffer” configuration. In this manner, one or more substratescan be buffered or stored within an inert environment of the OLEDprinting tool 4000, such as queued for further processing in one or moreother modules. The respective substrates can be conveyed to therespective environmentally-controlled regions using handler 3430, whichcan have end effector 3436, which as a depicted in FIG. 26C can be afork-type end effector, for robotic operation. Recalling, various OLEDsubstrates can be from Gen 3.5 to Gen 8.5 and above, so that substratedimensions can vary from about 60 cm×72 cm to about 220 cm×250 cm andgreater. In order to further secure a substrate through variousmanipulations, such fork-type end effectors can be equipped withmechanical gripping and clamping assemblies, or can be designed to usemechanical or vacuum suction.

As previously described for gas enclosure system 500 of FIG. 1, firstload lock chamber 3450 of FIG. 26C can receive a substrate through gate3452. When a substrate is received in load lock chamber 3450, thechamber can be isolated and can be purged with an inert gas, such asnitrogen, any of the noble gases, and any combination thereof, untilreactive atmospheric gases are at a low of level of 100 ppm or lower,for example, at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm orlower. The transport of a substrate from load lock chamber 3450 to firsttransfer module 3400 can be performed by handler 3430, which can place asubstrate, such as substrate 2050 on floatation table 2200 in printingmodule 3500. Floatation table 2200 can be supported by printing systembase 2100, as depicted in FIG. 26C. Substrate 2050 can remain supportedon a substrate floatation table during the printing process, and can bemoved by a Y-axis positioning system relative to printhead assembly2500, which can be mounted to X-axis carriage assembly 2300. Printingsystem 2000 of printing module 3500 can be used to controllably depositone or more film layers on a substrate during OLED device fabrication.Printing module 3500 can also be coupled to an output enclosure region,such as second module 3600 of FIG. 26C. Second module 3600 can havesecond transfer module output gate 3614, and can have a handlerpositioned in second transfer module 3610, as depicted for handler 3430of first module 3400. Floatation table 2200 and a Y-axis positioningsystem can extend along the travel of a substrate in printing module3500, so that a substrate can travel to a position proximal to secondtransfer module printing system gate 3614, and can be readily accessedby a handler positioned in second transfer module 3610 for transfer intosecond module 3600. As described for handler 3430 positioned in firsttransfer module 3410, a handler can be located in second module 3600 toreadily position a substrate into any chamber of second module 3600. Inthat regard, a handler positioned in second transfer chamber 3610 canposition a substrate into buffer 3660 as workflow may demand.

Within first module 3400, printing module 3500, and second module 3600,a substrate can be repositioned as desired for various processes, orduring a single deposition operation. In various embodiments of an OLEDprinting tool, the inert environments within first module 3400, printingmodule 3500, and second module 3600 can be maintained by commonly-sharedenvironmental control systems. For various embodiments of an OLEDprinting tool, the inert environments within first module 3400, printingmodule 3500, and second module 3600 can be maintained by separateenvironmental control systems. Second load lock chamber 3650 can be usedto transfer substrates out of second module 3600 using a handler insecond transfer module 3610, such as after one or more depositionoperations involving printing module 3500, or after other processing.

Printing system 2000 can include at least one printhead assembly havingone or more printhead devices that can have at least one printhead, forexample, for nozzle printing, thermal-jet, nozzle-jet or ink-jet type.The at least one printhead assembly can be mounted to an overheadcarriage, such as configured to deposit one or more film layers on asubstrate in a “face up” configuration. The one or more film layers thatcan be deposited by one or more printheads can include one or more of anelectron injection or transport layer, a hole injection or transportlayer, a blocking layer, or an emission layer, for example. Suchmaterials can provide one or more electrically functional layers. Othermaterials can be deposited using printing techniques, such as a monomeror polymer material, as described in other examples described herein,such as for providing one or more encapsulation layers for a substrate4000 being fabricated.

Though various embodiments of OLED printing tool 4000 can utilizeprinting system 2000 of FIG. 20B, other embodiments of a printing systemcan be readily utilized in OLED printing tool 4000, such as exemplaryprinting system 2001 of FIG. 27. FIG. 27 is a front perspective view ofprinting system 2001, which is shown with cable tray assembly exhaustsystem 2400 mounted on top of bridge 2130 for containing and exhaustingparticulate matter formed by the continual movement of a bundle ofcables. Various embodiments of printing system 2001 can have manyfeatures as previously described for printing system 2000 of FIG. 20Band printing system 2001 of FIG. 27. For example, printing system 2001can be supported by printing system base 2101. Mounted upon printingsystem base 2101 can be first riser 2120 and second riser 2122, uponwhich bridge 2130 can be mounted. For various embodiments of inkjetprinting system 2001, bridge 2130 can support a at least one X,Z-axiscarriage assembly 2300 which can move in an X-axis direction relative tosubstrate support apparatus 2250 through cable carrier run 2401. Invarious embodiments of printing system 2001, a second X,Z-axis carriageassembly can be mounted on bridge 2130. For embodiments of printingsystem 2001 having two X,Z-axis carriage assemblies, either a printheadassembly can be mounted on each X,Z-axis carriage, or various devices,such as, a camera, a UV lamp, and a heat source as described forprinting system 2000 of FIG. 20B can be mounted on the at least one ofthe two X,Z-axis carriage assemblies of printing system 2001. Accordingto various embodiments of printing system 2001, substrate supportapparatus 2250 for supporting substrate 2050 can be a floatation table,similar to substrate floatation table 2200 of printing system 2000 ofFIG. 20B, or it can be a chuck, as previously described for printingsystem 2000 of FIG. 20B. Printing system 2001 of FIG. 27 can have anintrinsically low-particle generating X-axis motion system, in which X,Zcarriage assembly 2300 can be mounted and positioned on bridge 2130using an air bearing linear slider assembly. Various embodiments of anair bearing linear slider assembly can wrap around the entirety ofbridge 2130, allowing frictionless movement of X,Z carriage assembly2300 on bridge 2130, as well providing three point mounting that canpreserve accuracy of travel for X,Z carriage assembly 2300, as well asresisting skew.

The figure sequence from FIG. 28A through FIG. 30C depict variousembodiments of systems and methods for printhead management in a fullyautomated or remote operator-assisted mode with little or nointerruption of an ongoing process, while maintaining an inert,substantially particle-free process environment. Recalling, a printheadassembly can include between about 1 to about 60 printhead devices,where each printhead device can have between about 1 to about 30printheads in each printhead device. Therefore, various embodiments of aprinting system of the present teachings can have between about 1 toabout 1800 printheads. Moreover, a printhead, for example, an industrialinkjet head, can have between about 16 to about 2048 nozzles, which canexpel a droplet volume of between about 0.1 pL to about 200 pL. Thesheer number of printheads can require ongoing measurement andmaintenance procedures be performed on a periodic basis as required.According to various systems and methods of the present teachings,various process steps related to the ongoing management of variouscomponents of a printing system, such as various process steps relatedto ongoing measurement and maintenance procedures, can be performedusing a printhead management system, such as printhead management system2701 of FIG. 20B and FIG. 23 and printhead management system 2701A ofFIG. 24A. Various embodiments of a printhead management system caninclude various subsystems or modules, such as a printhead replacementmodule, a drop measurement module, a printhead purge basin module and ablotter module.

Each subsystem or module can have various parts that are consumable bynature, and require replacement, such as replacing blotter paper, ink,and waste reservoirs. Various consumable parts can be packaged for readyinsertion, for example, in a fully automated mode using a handler. As anon-limiting example, blotter paper can be packaged in a cartridgeformat, which can be readily inserted for use into a blotting module. Byway of another non-limiting example ink can be packaged in a replaceablereservoir, as well as a cartridge format for use in a printing system.Various embodiments of a waste reservoir can be packaged in a cartridgeformat, which can be readily inserted for use into a purge basin module.Additionally, parts of various components of a printing system subjectto on-going use can require periodic replacement. During a printingprocess, expedient management of a printhead assembly, for example, butnot limited by, an exchange of a printhead device or printhead, can bedesirable. A printhead replacement module can have parts, such as aprinthead device or printhead, which can be readily inserted for useinto a printhead assembly. A drop measurement module used for checkingfor nozzle firing, as well as the measurement based on optical detectionof drop volume, velocity and trajectory from every nozzle can have asource and a detector, which can require periodic replacement after use.Various consumable and high-usage parts can be packaged for readyinsertion, for example, in a fully automated mode using a handler.

For various embodiments of systems and methods of the present teachings,for example, by way of a non-limiting example, those represented by FIG.28A through FIG. 30C, a printing system enclosure can be isolated fromvarious embodiments of an auxiliary enclosure. As such, the utilizationof an auxiliary enclosure for the automated or end-user mitigatedexchange of parts of a printing system can ensure that a printingprocess can continue with minimal or no interruption. Variousembodiments of a gas enclosure can have a sealable opening or passagewayallowing access between a printing system enclosure and an auxiliaryenclosure, as well as an opening allowing access between an auxiliaryenclosure and the exterior of a gas enclosure. Accordingly, variousembodiments of an auxiliary enclosure can be isolated from a printingsystem enclosure of a gas enclosure system, so that each volume is aseparately-functioning section. Furthermore, while a printing systemenclosure is isolated from an auxiliary enclosure, an opening between anauxiliary enclosure and the exterior of a gas enclosure can be opened toambient or non-inert air without contaminating a printing systemenclosure.

Various embodiments of a gas enclosure system, an auxiliary enclosurecan be isolated from a printing system enclosure of a gas enclosuresystem using a structural closure for an opening, such as an enclosurepanel opening or passageway, door or window. For various embodiments ofsystems and methods of the present teachings, a structural closure caninclude a variety of sealable coverings for an opening or passageway;such opening or passageway including non-limiting examples of anenclosure panel opening or passageway, a door or a window. According tosystems and methods of the present teachings, a gate can be anystructural closure that can be used to reversibly cover or reversiblysealably close any opening or passageway using pneumatic, hydraulic,electrical, or manual actuation. Various embodiments of an auxiliaryenclosure can be isolated from a printing system enclosure of a gasenclosure system using a dynamic closure, such as a pressure differenceor a gas curtain, between a working volume of a gas enclosure system andan auxiliary enclosure, and combinations of various embodiments of adynamic closure and a structural closure. Additionally, each of aworking volume of a gas enclosure and an auxiliary enclosure can haveseparately controlled environments, providing the capability ofindependent regulation of, for example, but not limited by, temperature,lighting, particle control, and gas purification. As such, thespecification for the thermal control, lighting control, particlecontrol and inert gas environment control for an auxiliary enclosurevolume and a working volume of a gas enclosure can be set to be the sameor to be different for each volume.

FIG. 28A through FIG. 28C depict various embodiments of printing systemsand methods for printhead management in a fully automated or remoteoperator-assisted mode with little or no interruption of an ongoingprocess, while maintaining an inert, substantially particle-free processenvironment in OLED printing tool 4001. In comparison to OLED printingsystem 4000 of FIG. 26A through FIG. 26C, various embodiments of OLEDprinting tool 4001 of FIG. 28A through FIG. 28C can include an auxiliaryenclosure, such as, for example, but not limited by, a transfer chamber,a load lock chamber and an adaptable controlled-environment enclosure.For embodiments of systems and methods of the present teachings OLEDprinting tool 4001 can have an auxiliary enclosure that can bemaintained at specifications for a controlled environment that are thesame as the specifications for the controlled environment of printingmodule 3500. In various embodiments of systems and methods of thepresent teachings, OLED printing tool 4001 can have an auxiliaryenclosure that can be maintained at specifications for a controlledenvironment that are different from the specifications for thecontrolled environment of printing module 3500, while not compromisingthe integrity of the environment of OLED printing tool 4001.

As depicted in FIG. 28A, printing system module 3500 of OLED printingtool 4001 can have third module 3700 coupled to printing systemenclosure assembly 3540. Third module 3700 can be positioned proximal tofirst bridge end 2132 of bridge 2130, where printhead assembly 2500,mounted on X-axis carriage assembly 2300, can be positioned proximal tothird module 3700. Third module 3700 of FIG. 28A can have third transferchamber 3710, which can be an auxiliary enclosure for OLED printing tool4001 useful for carrying out various printhead maintenance procedures.Third module 3700 of FIG. 28A can have third load lock chamber 3750,which can be coupled to third transfer chamber 3710. In variousembodiments of systems and methods of the present teachings, thirdchamber 3700 can be located proximal to second bridge end 2134. Forvarious embodiments of systems and methods of the present teachings,printing system module 3500 can have a module, such as third module 3700of FIG. 28A, proximal to both first bridge end 2132 and second bridgeend 2134. Further, while a single carriage is shown for printing system2000 of OLED printing tool 4001 shown in FIG. 28A, a printing system,such as printing system of FIG. 20B, can have an additional carriage,which can have various devices, such as a printhead assembly, a camera,a UV lamp, and a heat source mounted in the second carriage, aspreviously described for printing system 2000 of FIG. 20B and printingsystem 2001 of FIG. 27.

In FIG. 28A, though no additional chambers are shown associated withthird module 3700, a chamber can be coupled to third transfer chamber3710 on first side 3702, and can be accessible to third transfer chamber3710 via gate 3714. Similarly, a chamber can be coupled third transferchamber 3710 on second side 3704, and can be accessible to thirdtransfer chamber 3710 via gate 3718. Various additional chambers coupledto third transfer chamber 3710 may be useful for various printheadmaintenance procedures. For various embodiments of OLED printing tool4001, third transfer chamber 3710 of third module 3700 can be used tohouse a handler, while additional chambers associated with thirdtransfer module 3710 can be used to store and transfer various parts forsubsystems and modules of various embodiments of a printhead managementsystem of the present teachings. In various embodiments of OLED printingtool 4001, printing system enclosure assembly 3540 can have a volume orarea, such as first printing system enclosure assembly area 3570proximal to first bridge end 2132 and second printing system enclosureassembly area 3572 proximal to second bridge end 2134. According tovarious embodiments of an OLED printing tool of the present teachings,either or both first printing system enclosure assembly area 3570 andsecond printing system enclosure assembly area 3572 can be used to housea printhead management system, such as printhead management system 2701FIG. 20B and FIG. 23 and printhead management system 2701A of FIG. 24A(see also FIG. 26C). In that regard, for example, a handler located inthird transfer module 3710 can move parts between various chambersassociated with third transfer module 3710, such as, but not limited by,load lock chamber 3750, and a printhead maintenance system located inprinting system module 3500.

FIG. 28B is a plan view of OLED printing tool 4001 shown in FIG. 28A,according to various embodiments of the present teachings, in whichthird transfer chamber 3710 is an auxiliary enclosure. Third transferchamber 3710, can have gate 3412, which can provide access to load lockchamber 3750, and can have gate 3416, which can provide access toprinting module 3500. Third load lock chamber 3750 can have gate 3752,which can provide access to third load lock chamber 3750 from theexterior of OLED printing tool 4001. As previously discussed, handler3430 and handler 3630 can have features selected for the task ofsubstrate handling. According to the present teachings, handler 3730 ofFIG. 28B can have features selected for handling various partsassociated with a printhead management system, such as printheadmanagement system 2700. Printhead management system 2700 can be, forexample, but not limited by, a printhead management system such asprinthead management system 2701 FIG. 20B and FIG. 23 and printheadmanagement system 2701A of FIG. 24A. As previously mentioned inreference to the teachings for FIG. 28A, a printhead management systemcan be located in a volume or area such as 3570 or 3752 of printingmodule 3500. As depicted in FIG. 28B, handler 3730 housed within anauxiliary enclosure defined third transfer chamber 3710 can bepositioned so that it can access printing system enclosure assembly area3570, which is proximal to X-axis carriage assembly 2300. Carriageassembly 2300, mounted to bridge 2130, can support printhead assembly2500, which can include a plurality of printhead devices. Variousembodiments of handler 3730 can have various end effectorconfigurations, for example, a fork-type, a blade-type end effector, aclamp-type end effector, and a gripper-type end effector that can beselected for manipulation of various parts of a printhead managementsystem. According to the present teachings, an end effector can includemechanical grasping and clamping, as well as pneumatic orvacuum-assisted assemblies to either actuate portions of the endeffector or otherwise retain various parts of a printhead managementsystem, such as for example, but not limited by, a blotter papercartridge, an ink cartridge, a waste reservoir, a printhead and aprinthead device.

With respect to printhead replacement, according to various embodimentsof the present teachings, handler 3730 of FIG. 28B can, for example,retrieve a part from printhead assembly 2500 mounted on X-axis carriageassembly 2300, such as a printhead or a printhead device, requiringreplacement. In a subsequent step, handler 3730 can retrieve areplacement part from printhead, for example, from management system2700. Once a replacement part has been retrieved, handler 3730 can theninsert a replacement part, such as a printhead device or a printhead,into printhead assembly 2500 to complete a printhead replacementprocedure. Moreover, for various embodiments of OLED printing tool 4001of FIG. 28B, third transfer chamber 3710 of third module 3700 can beused to house a handler, while load lock chamber 3750 can be used tostore and transfer various parts for subsystems and modules of variousembodiments of a printhead management system of the present teachings.Various replacement parts for printhead management system 2700 that arestored in load lock chamber 3750, for example, but not limited by, ablotter paper cartridge, an ink cartridge, a waste reservoir, aprinthead and a printhead device, can be accessed by handler 3730 andmoved to printhead management system 2700. Conversely, parts needingreplacement, for example, but not limited by, a blotter paper cartridge,an ink cartridge, a waste reservoir, a printhead and a printhead device,can be removed from printhead management system 2700 by handler 3730 andplaced in load lock chamber 3750. In various embodiments of printheadmanagement procedures, a part, such as a printhead device or aprinthead, can be removed from load lock chamber 3750 by handler 3730and inserted into printhead assembly 2500. Gate 3752 of load lockchamber 3750 can be opened, while gate 3712 and gate 3716 are closed, sothat retrieval or removed parts from load lock chamber 3750, as well astransfer of replacement parts to load lock chamber 3750 can be done by ahandler or end-user located in ambient air at the exterior of OLEDprinting tool 4001.

After a procedure for the retrieval of parts, the replacement of partsor both has been completed, gate 3752 of load lock chamber 3750 can beclosed, and load lock chamber 3750 can go through a recovery procedureto restore the gas environment of the chamber to a target specification.Given the substantially small volume of load lock chamber 3750 incomparison to the volume of OLED printing tool 4001, the recovery timeis substantially shorter than the recovery time for OLED printing tool4001. All steps associated with a printhead management procedure can bedone to eliminate or minimize the exposure of a printing systemenclosure to contamination, such as air and water vapor and variousorganic vapors, as well as particulate contamination. According tovarious systems and methods of the present teachings, a printing systemenclosure may be introduced to a level of contamination that issufficiently low that a purification system can remove the contaminationbefore it can affect a printing process. In that regard, variousembodiments of OLED printing tool 4001 can provide for fully automatedreplacement of a part in a printhead management system while maintainingan inert, particle-free environment and with little or no interruptionof a printing process. While various printhead management procedures canbe conducted in a fully-automated mode, where a certain degree ofend-user intervention may be indicated during various procedures relatedto the management of a printhead assembly, end-user access can be doneexternally through, for example, the use of gloveports.

Various embodiments of an OLED printing tool, such as OLED printing tool4002, depicted in the plan view in FIG. 28C, can have auxiliaryenclosure 3550, which can be a load lock chamber or an adaptablecontrolled-environment enclosure. Auxiliary enclosure 3550 can havefirst gate 3552 and second gate 3554. Printing system enclosure 3500 canhave a volume or area, such as first and second printing systemenclosure assembly area 3570 and 3572, respectively (see also FIG. 26C).For various embodiments of OLED printing tool 4002, volume or area 3570and 3572 of printing system enclosure 3500 of FIG. 28C, can be used tohouse, for example, a printhead management system, such as printheadmanagement system 2701 FIG. 20B and FIG. 23 and printhead managementsystem 2701A of FIG. 24A. As depicted in FIG. 28C, for variousembodiments of OLED printing tool 4002, volume or area 3570 can be usedto house printhead management system 2700, as well as handler 3530. Forvarious embodiments of FIG. 28C, printhead management system 2700 andhandler 3530 can be positioned, for example, in printing systemenclosure assembly area 3570, proximal to X-axis carriage assembly 2300.Printhead assembly 2500 can be mounted on X-axis carriage assembly 2300(see also FIG. 26C), which is supported on bridge 2130. Printheadassembly 2500 can include a plurality of printhead devices. Variousembodiments of handler 3530 can have various end effectorconfigurations, for example, a fork-type, a blade-type end effector, aclamp-type end effector, and a gripper-type end effector that can beselected for manipulation of various parts of a printhead managementsystem, such as for example, but not limited by, a blotter papercartridge, an ink cartridge, a waste reservoir, a printhead and aprinthead device.

With respect to printhead replacement, for various embodiments of OLEDprinting tool 4002, handler 3530 can, for example, retrieve a part, forexample printhead or a printhead device, requiring replacement fromprinthead assembly 2500 mounted on X-axis carriage assembly 2300. In asubsequent step, handler 3530 can retrieve a replacement part, forexample, from printhead management system 2700. Once a replacement parthas been retrieved, handler 3530 can then insert a replacement part,such as a printhead device or a printhead, into printhead assembly 2500to complete a printhead replacement procedure. Moreover, for variousembodiments of OLED printing tool 4002 of FIG. 28C, auxiliary enclosure3550 can be used to store and transfer various parts for subsystems andmodules of various embodiments of a printhead management system of thepresent teachings. Various replacement parts for printhead managementsystem 2700 that are stored in, auxiliary enclosure 3550, for example,but not limited by, a blotter paper cartridge, an ink cartridge, a wastereservoir, a printhead and a printhead device, can be accessed byhandler 3530 and moved to printhead management system 2700. Conversely,parts needing replacement, for example, but not limited by, a blotterpaper cartridge, an ink cartridge, a waste reservoir, a printhead and aprinthead device, can be removed from printhead management system 2700by handler 3730 and placed in auxiliary enclosure 3550. In variousembodiments of printhead management procedures, a part, such as aprinthead device or a printhead, can be removed from auxiliary enclosure3550 by handler 3530 and inserted into printhead assembly 2500. Gate3552 of, auxiliary enclosure 3550 can be opened, while gate 3554 isclosed, so that retrieval or removed parts from auxiliary enclosure3550, as well as transfer of replacement parts to auxiliary enclosure3550 can be done by a handler or end-user located in ambient air at theexterior of OLED printing tool 4002.

After a procedure for the retrieval of parts, the replacement of partsor both has been completed, gate 3552 of auxiliary enclosure 3550 can beclosed, and auxiliary enclosure 3550 can go through a recovery procedureto restore the gas environment of the auxiliary enclosure to a targetspecification. Given the substantially small volume of auxiliaryenclosure 3550 in comparison to the volume of OLED printing tool 4002,the recovery time is substantially shorter than the recovery time forOLED printing tool 4002. All steps associated with a printheadmanagement procedure can be done to eliminate or minimize the exposureof a printing system enclosure to contamination, such as air and watervapor and various organic vapors, as well as particulate contamination.According to various systems and methods of the present teachings, aprinting system enclosure may be introduced to a level of contaminationthat is sufficiently low that a purification system can remove thecontamination before it can affect a printing process. In that regard,various embodiments of OLED printing tool 4002 can provide for fullyautomated replacement of a part in a printhead management system whilemaintaining an inert, particle-free environment and with little or nointerruption of a printing process. While various printhead managementprocedures can be conducted in a fully-automated mode, where a certaindegree of end-user intervention may be indicated during variousprocedures related to the management of a printhead assembly, end-useraccess can be done externally through, for example, the use ofgloveports.

FIG. 29 through FIG. 29C depict various embodiments of printing systemsand methods for printhead management in a fully automated or remoteoperator-assisted mode with little or no interruption of an ongoingprocess, while maintaining an inert, substantially particle-free processenvironment in printing system enclosure 1102. For various printheadmanagement procedures that can be performed in gas enclosure system 506of FIG. 29A through 29C, auxiliary enclosure 1010 can be maintained atspecifications for a controlled environment that are the same as acontrolled environment as printing system enclosure 1102. Variousembodiments of gas enclosure system 506 of FIG. 29A through 29C can beincorporated into an OLED printing tool, such as OLED printing tool 4000of FIG. 26A and as OLED printing tool 4001 of FIG. 28A.

FIG. 29A through FIG. 29C depict gas enclosure system 506 that caninclude printing system enclosure 1102 and printing system 2002, whichcan have printhead assembly 2500. Printing system enclosure 1102 can beany gas enclosure in which printing system 2002 can be housed andmaintained in a targeted controlled environment. Printing systemenclosure 1102 can have a controlled environment that can include atarget specification for reactive species, such as water vapor andoxygen, as well as for a target specification for particulate matter.Printing system enclosure 1102 can be, for example, but not limited by,any of a gas enclosure assembly as described for FIG. 1, FIG. 3, FIG.15, FIG. 18 and FIG. 19. Printing system 2002 can be any printingsystem, for example, but not limited by, as previously described,including non-limiting examples of FIG. 20B and FIG. 27. Printheadassembly 2500 can have at least one printhead. Printhead managementsystem 2700 can any printhead management system, for example, but notlimited by, as previously described, including non-limiting examples ofprinthead management system 2701 FIG. 20B and FIG. 23 and printheadmanagement system 2701A of FIG. 24A.

Auxiliary enclosure 1010 of FIG. 29A through FIG. 29C can have firstgate 1012 and second gate 1014, which can remained closed during normaloperation. For various embodiments of gas enclosure system 506,auxiliary enclosure 1010 depicted in FIG. 29A through FIG. 29C can be aload lock chamber. In various embodiments of gas enclosure system 506,auxiliary enclosure 1010 depicted in FIG. 29A through FIG. 29C can be ahard wall adaptable controlled-environment enclosure. In still otherembodiments of gas enclosure system 506, auxiliary enclosure 1010depicted in FIG. 29A through FIG. 29C can be a transfer chamber. Forvarious embodiments of gas enclosure assembly 506, a controlledenvironment for an auxiliary enclosure may include a targetspecification for reactive species, such as water vapor and oxygen andvarious organic vapors, as well as for a target specification forparticulate matter. In various embodiments of gas enclosure 506 of FIG.29A through FIG. 29C, auxiliary enclosure 1010 can be maintained to thesame environmental specifications that printing system enclosure 1102 ismaintained. For various embodiments of gas enclosure 506 of FIG. 29Athrough FIG. 29C, auxiliary enclosure 1010 and printing system enclosure1102 can be maintained to different environmental specifications. Gasenclosure system 506 of FIGS. 29A and 29B can have handler 3830positioned for the carrying out tasks associated with a printheadmanagement procedure. Handler 3830 can have end effector 3836 mounted toarm 3834. Various embodiments of an end effector configuration can beused, for example, a blade-type end effector, a clamp-type end effector,and a gripper-type end effector. Various embodiments of an end effectorcan include mechanical grasping and clamping, as well as pneumatic orvacuum-assisted assemblies to either actuate portions of the endeffector or otherwise retain various parts of a printhead managementsystem, such as for example, but not limited by, a blotter papercartridge, an ink cartridge, a waste reservoir, a printhead and aprinthead device.

With respect to printhead replacement, handler 3830 of FIG. 29A can bepositioned proximal to printhead assembly 2500 and printhead managementsystem 2700 of printing system 2002. During a procedure for printheadreplacement, handler 3830 can remove a target part; either a printheador printhead device having at least one printhead, from printheadassembly 2500. In various procedures for printhead replacement for gasenclosure system 506 of FIG. 29A, the removed part can be placed inprinthead management system 2700 for later retrieval. For removing aremoved part from printing system enclosure 1102, second gate 1024 canbe opened while first gate 1012 remains closed, so that handler 3830 canplace the part that has been removed into auxiliary enclosure 1010. In asubsequent step, handler 3830 can retrieve a replacement part fromprinthead management system 2700. Alternatively, handler 3830 canretrieve a replacement part from auxiliary enclosure 1010. Once areplacement part has been retrieved, handler 3830 can then insert areplacement part, such as a printhead device or a printhead, intoprinthead assembly to complete a printhead replacement procedure. Afterthe movement of parts between printing system enclosure 1102 andauxiliary enclosure 1010 is complete, gate 1014 can be closed, so thatprinting system enclosure 1102 can be isolated from auxiliary enclosure1010. Gate 1012 can be opened and the removed part placed in auxiliaryenclosure 1010, can be retrieved by a source, either a handler or anend-user, and an additional functional part, either a replacementprinthead or a replacement printhead device, can be placed intoauxiliary enclosure 1010 for a subsequent printhead exchange procedure.Finally, after gate 1012 is closed, auxiliary enclosure 1010 can gothrough a recovery procedure in order to be brought to a targetspecification for reactive species, such as water vapor and oxygen, aswell as to a target specification for particulate matter, so that asubsequent printhead replacement procedure can be initiated whendesired. In various embodiments of gas enclosure system 506, auxiliaryenclosure 1010 can have the same specifications for a controlledenvironment as printing system enclosure 1102. For various embodimentsof gas enclosure system 506 of FIG. 29A, auxiliary enclosure 1010 canhave different specifications from printing system enclosure 1102 for acontrolled environment.

For gas enclosure system 506 of FIG. 29B, handler 3830 can be positionedin auxiliary enclosure 1010 so that end effector 3836 of handler 3830can readily reach printhead assembly 2500, as well as printheadmanagement system 2700 of printing system.

With respect to a procedure for printhead replacement for gas enclosuresystem 506 of FIG. 29B, second gate 1014 can be opened while gate 1012remains closed so that handler 3830 can remove a target part; eitherprinthead or printhead device having at least one printhead, fromprinthead assembly 2500 of printing system 2002. In various procedurefor printhead replacement of gas enclosure system 506 of FIG. 29B, theremoved part can be placed in printhead management system 2700 for laterretrieval. For removing a removed part from printing system enclosure1102, second gate 1014 can be opened while gate 1012 remains closed, sothat handler 3830 can place the part that has been removed intoauxiliary enclosure 1010. In a subsequent step, handler 3830 canretrieve a replacement part from printhead management system 2700.Alternatively, handler 3830 can retrieve a replacement part fromauxiliary enclosure 1010. Once a replacement part has been retrieved,handler 3830 can then insert a replacement part, such as a printheaddevice or a printhead, into printhead assembly to complete a printheadreplacement procedure. After the removed part is in auxiliary enclosure1010, the replacement part has been inserted into printhead assembly2500 of printing system enclosure 1102 and handler 3830 is withinauxiliary enclosure 1010, gate 1014 can be closed, so that printingsystem enclosure 1102 is isolated from auxiliary enclosure 1010. At anytime after the replacement part has been inserted into a printheadassembly and gate 1014 has been closed, gate 1012 can be opened, andhandler 3830 can place the removed part to a location exterior toauxiliary enclosure 1010 and an additional functional part, either areplacement printhead or a replacement printhead device, can be placedinto auxiliary enclosure 1010 for a subsequent printhead exchangeprocedure. Finally, auxiliary enclosure 1010 can go through a recoveryprocedure in order to be brought to a target specification for reactivespecies, such as water vapor and oxygen, as well as to a targetspecification for particulate matter, so that a subsequent printheadreplacement procedure can be initiated when desired. In variousembodiments of gas enclosure system 506, auxiliary enclosure 1010 canhave the same specifications for a controlled environment as printingsystem enclosure 1102. For various embodiments of gas enclosure system506 of FIG. 29B, auxiliary enclosure 1010 can have differentspecifications from printing system enclosure 1102 for a controlledenvironment.

Moreover, for various embodiments of gas enclosure system 506 of FIG.29A and FIG. 29B, auxiliary enclosure 1010 can be used to store andtransfer various parts for subsystems and modules of various embodimentsof a printhead management system of the present teachings. Variousreplacement parts for printhead management system 2700, for example, butnot limited by, a blotter paper cartridge, an ink cartridge, a wastereservoir, a printhead and a printhead device, that are stored inauxiliary enclosure 1010 can be accessed by handler 3830 and moved toprinthead management system 2700 through gate 1014 while gate 1012 isclosed to maintain gas enclosure system 506 in an inert environment.Conversely, parts needing replacement can be removed from printheadmanagement system 2700 by handler 3830 through gate 1014 while gate 1012is closed and placed in auxiliary enclosure 1010. In a subsequent step,gate 1012 of auxiliary enclosure 1010 can be opened, while gate 1014 isclosed, so that retrieval or removed parts from, auxiliary enclosure3550, as well as transfer of replacement parts to auxiliary enclosure3550 can be done by a handler or end-user located in ambient air at theexterior of gas enclosure system 506 of FIG. 29A and FIG. 29B.

After a procedure for the retrieval of parts, the replacement of partsor both has been completed, gate 1012 of auxiliary enclosure 1010 can beclosed, and auxiliary enclosure 1010 can go through a recovery procedureto restore the gas environment of the auxiliary enclosure to a targetspecification. Given the substantially small volume of auxiliaryenclosure 1010 in comparison to the volume of gas enclosure system 506of FIG. 29A and FIG. 29B, the recovery time is substantially shorterthan the recovery time for gas enclosure system 506 of FIG. 29A and FIG.29B. All steps associated with a printhead management procedure can bedone to eliminate or minimize the exposure of a printing systemenclosure to contamination, such as air and water vapor and variousorganic vapors, as well as particulate contamination. According tovarious systems and methods of the present teachings, a printing systemenclosure may be introduced to a level of contamination that issufficiently low that a purification system can remove the contaminationbefore it can affect a printing process. In that regard, variousembodiments of gas enclosure system 506 of FIG. 29A and FIG. 29B canprovide for fully automated replacement of a part in a printheadmanagement system while maintaining an inert, particle-free environmentand with little or no interruption of a printing process.

Variations of a printhead replacement procedure for various embodimentsof FIG. 29A and FIG. 29B can be made without departing from the spiritof an automated process for maintaining a printhead array. For example,in various embodiments, while gate 1012 of auxiliary enclosure 1010 isclosed and gate 1014 of auxiliary enclosure 1010 is opened, handler 3830of FIG. 29A and FIG. 29B can remove a printhead part, either printheador printhead device with at least one printhead, from printhead assembly2500 and place it in auxiliary enclosure 1010. In a next step, whilegate 1014 of auxiliary enclosure 1010 is closed, gate 1012 can be openedallowing for retrieval of the removed part from auxiliary enclosure 1010and placement of a replacement part into auxiliary enclosure 1010 aspreviously described for FIG. 29A and FIG. 29B. Once the removed parthas been retrieved and the replacement part is within auxiliaryenclosure 1010, gate 1012 can be closed and auxiliary enclosure 1010 cango through a recovery procedure in order to be brought to a targetspecification for reactive species, such as water vapor and oxygen, aswell as to a target specification for particulate matter. Once auxiliaryenclosure 1010 is brought into appropriate controlled environmentalspecifications, gate 1014 can be opened and the replacement part can beinserted into a printhead assembly. When the replacement part has beeninserted into a printhead assembly, gate 1014 can be closed, so thatprinting system enclosure 1102 can be isolated from auxiliary enclosure1010.

In FIG. 29C, for various embodiments of a printhead replacementprocedure as described for FIG. 29A and FIG. 29B, an end-user canremotely perform through the manipulations recited as being performed bya handler remotely through various gloveports. Though two gloveport areshown in FIG. 29C, it can be appreciated that gloveports can be placedin several places for the purpose of providing remote access to variouslocations, for example, as previously shown in FIG. 1 for gas enclosureassembly 100 and as shown in FIG. 24B.

FIG. 30A through FIG. 30C depict various embodiments of printing systemsand methods for printhead management in a fully automated or remoteoperator-assisted mode with little or no interruption of an ongoingprocess, while maintaining an inert, substantially particle-free processenvironment in printing system enclosure 1102. For various printheadmanagement procedures that can be performed in gas enclosure system 507of FIG. 30A through 30C, auxiliary enclosure 1020 can be maintained atspecifications for a controlled environment that are different from acontrolled environment as printing system enclosure 1102, while notcompromising the integrity of the environment of printing systemenclosure 1102. Various embodiments of gas enclosure system 506 of FIG.29A through 29C can be incorporated into an OLED printing tool, such asOLED printing tool 4000 of FIG. 26A and as OLED printing tool 4001 ofFIG. 28A.

FIG. 30A through FIG. 30C depict gas enclosure system 507 that caninclude printing system enclosure 1102 and printing system 2002, whichcan have printhead assembly 2500. Printing system enclosure 1102 can beany gas enclosure in which printing system 2002 can be housed andmaintained in a targeted controlled environment. Printing systemenclosure 1102 can have a controlled environment that can include atarget specification for reactive species, such as water vapor andoxygen, as well as for a target specification for particulate matter.Printing system enclosure 1102 can be, for example, but not limited by,any of a gas enclosure assembly as depicted in FIG. 1, FIG. 3, FIG. 15,FIG. 18 and FIG. 19. Printing system 2002 can be any printing system,for example, but not limited by, as previously described herein,including non-limiting examples of FIG. 20B and FIG. 27. Printheadassembly 2500 can have at least one printhead. Printhead managementsystem 2700 can any printhead management system, for example, but notlimited by, as previously described, including non-limiting examples ofprinthead management system 2701 FIG. 20B and FIG. 23 and printheadmanagement system 2701A of FIG. 24A.

Auxiliary enclosure 1020 of FIG. 30A through FIG. 30C can have opening1022 and gate 1024, as well as conduit 1026, which can be in fluidcommunication with an inert gas source. Gate 1024 of auxiliary enclosure1020 can be maintained in a closed position during normal operation. Forvarious embodiments of gas enclosure system 507, auxiliary enclosure1020 depicted in FIG. 30A through FIG. 30C can be an adaptablecontrolled-environment enclosure of soft wall construction. Variousembodiments of gas enclosure system 507, auxiliary enclosure 1020depicted in FIG. 30A through FIG. 30C can be an adaptablecontrolled-environment enclosure of hard wall construction. In stillother embodiments of gas enclosure system 507, auxiliary enclosure 1020depicted in FIG. 30A through FIG. 30C can be an adaptablecontrolled-environment enclosure of a combination of hard and soft wallconstruction.

For various embodiments of gas enclosure system 507, opening 1022 can bea passageway, for example, but not limited by, a window or door of solidmaterial. In various embodiments in gas enclosure system 507, opening1022 can be a flexible doorway that can be covered, for example, by acurtain of strips of a flexible polymeric sheet material, therebyproviding ready passage into and out of auxiliary enclosure 1020.According to various embodiments of gas enclosure system 507 of FIG. 30Athrough FIG. 30C, various embodiments of a dynamic closure as previouslydiscussed can be used for effectively sealing opening 1022. For variousembodiments of auxiliary enclosure, opening 1022 can be a window, whichcan be covered by a flexible polymeric material thereby providing readypassage of materials into and out of auxiliary enclosure 1020. Invarious embodiments of auxiliary enclosure, opening 1022 can be apassageway, for example, but not limited by, a window or door, which inaddition to being covered by a flexible polymeric material can have agas curtain for isolating auxiliary enclosure from the exterior of gasenclosure system 507. In various embodiments of auxiliary enclosure,opening 1022 can be a passageway, for example, but not limited by, awindow or door, which can have a gas curtain for isolating auxiliaryenclosure from the exterior of gas enclosure system 507. As will bediscussed in more detail subsequently, in addition to a gas curtain,pressure differences between auxiliary enclosure 1020 and printingsystem enclosure 1102 can be utilized for isolating auxiliary enclosure1020 having opening 1022. Gas enclosure system 507 of FIGS. 30A and 30Bcan have handler 3830 positioned for the carrying out tasks associatedwith a printhead management procedure. Handler 3830 can have endeffector 3836 mounted to arm 3834. Various embodiments of an endeffector configuration can be used, for example, a blade-type endeffector, a clamp-type end effector, and a gripper-type end effector.Various embodiments of an end effector can include mechanical graspingand clamping, as well as pneumatic or vacuum-assisted assemblies toeither actuate portions of the end effector or otherwise retain aprinthead device or a printhead from a printhead device.

As indicated in FIG. 30A through FIG. 30C, conduit 1026 of auxiliaryenclosure 1020 can be in fluid communication with an inert gas source,which for various embodiments of gas enclosure system 507 of FIG. 30Acan maintain auxiliary enclosure 1020 to a target specification forreactive species, such as oxygen and water vapor, as well as organicsolvent vapors that is the same as that of printing system enclosure1102. In various embodiments of gas enclosure system 507 of FIG. 30A,the gas environment of auxiliary enclosure 1020 can be maintained at atarget specification for reactive species, such as oxygen and watervapor, as well as organic solvent vapors that is different from printingsystem enclosure 1102. According to various embodiments of gas enclosuresystem 507, the inert gas source can be filtered for particulate matter.Recalling, a gas enclosure assembly can be maintained at a pressureabove atmospheric. It is contemplated that the pressure of auxiliaryenclosure 1020 can be held at a value above atmospheric and below thatof printing system enclosure 1102 to retard or prevent diffusion of gasfrom auxiliary enclosure 1020 to printing system enclosure 1102, forexample, during various process steps of various printhead managementprocedures. In that regard, for various embodiments of gas enclosuresystem 507 of FIG. 30A through FIG. 30C, a target specification forreactive species, such as water vapor and oxygen, as well as for atarget specification for particulate matter for auxiliary enclosure 1020may not be as stringent as those for printing system enclosure 1102.

With respect to printhead replacement, handler 3830 of FIG. 30A can bepositioned proximal to printhead assembly 2500 and printhead managementsystem 2700 of printing system 2002. During a procedure for exchanging aprinthead, handler 3830 can remove a target part; either a printhead orprinthead device having at least one printhead, from printhead assembly2500. In various procedure for printhead replacement of gas enclosuresystem 576 of FIG. 30A, the removed part can be placed in printheadmanagement system 2700 for later retrieval. For removing a removed partfrom printing system enclosure 1102, gate 1024 can be opened, so thathandler 3830 can place the part that has been removed into auxiliaryenclosure 1020. While gate 1024 is opened, opening 1022 can be sealedusing various embodiments of a dynamic closure as previously described.In a subsequent step, handler 3830 can retrieve a replacement part fromprinthead management system 2700. Alternatively, handler 3830 canretrieve a replacement part from auxiliary enclosure 1020. Once areplacement part has been retrieved, handler 3830 can then insert areplacement part, such as a printhead device or a printhead, intoprinthead assembly to complete a printhead replacement procedure Afterthe movement of parts between printing system enclosure 1102 andauxiliary enclosure 1010 is complete, gate 1024 can be closed, so thatprinting system enclosure 1102 is isolated from auxiliary enclosure1020. For various embodiments of gas enclosure system 507, the transittime for the handler moving parts between printing system enclosure 1102and auxiliary enclosure 1010 can be minimized, so that, in conjunctionwith the positive pressure maintained in printing system enclosure 1102relative to the pressure of the inert gas environment of auxiliaryenclosure 1020, any reactive species and particulate matter that maydiffuse into printing system enclosure 1102 during a printheadreplacement procedure can be readily removed by a gas purificationsystem and a gas circulation and filtration system. Additionally, aspreviously discussed, a gas curtain can be used in conjunction withopening 1020 to isolate auxiliary enclosure from the exterior of gasenclosure system 506. The removed part placed in auxiliary enclosure1020, can be retrieved by a source; either a handler or an end-user,externally located to auxiliary enclosure 1020, and an additionalfunctional part, either a replacement printhead or a replacementprinthead device, can be placed into auxiliary enclosure 1020 for asubsequent printhead exchange procedure.

For gas enclosure system 507 of FIG. 30B, handler 3500 can be positionedin auxiliary enclosure 1020 so that end effector 3836 of handler 3830can readily reach printhead assembly 2500, as well as printheadmanagement system 2700 of printing system.

With respect to a procedure for printhead replacement gas enclosuresystem 507 of FIG. 30B, gate 1024 can be opened so that handler 3830 canremove a target part; either printhead or printhead device having atleast one printhead, from printhead assembly 2500 of printing system2002. and place the removed part into auxiliary enclosure 1020. Aspreviously discussed, opening 1024 can be closed using variousembodiments of a structural closure or effectively sealed using variousembodiments of a dynamic closure. Handler 3830 can retrieve areplacement part from auxiliary enclosure 1020, and insert it intoprinthead assembly 2500 of printing system 2002 to complete thereplacement process. As soon as the replacement part has been insertedinto printhead assembly 2500 and handler 3830 is within auxiliaryenclosure 1020, gate 1024 can be closed, so that printing systemenclosure 1102 is isolated from auxiliary enclosure 1020. At any timeafter the replacement procedure has been completed, handler 3830 canposition the removed part to a location exterior to auxiliary enclosure1010 through opening 1022 and an additional functional part, either areplacement printhead or a replacement printhead device, can be placedinto auxiliary enclosure 1020 for a subsequent printhead exchangeprocedure.

Moreover, for various embodiments of gas enclosure system 506 of FIG.30A and FIG. 30B, auxiliary enclosure 1010 can be used to store andtransfer various parts for subsystems and modules of various embodimentsof a printhead management system of the present teachings. Variousreplacement parts for printhead management system 2700, for example, butnot limited by, a blotter paper cartridge, an ink cartridge, a wastereservoir, a printhead and a printhead device, that are stored inauxiliary enclosure 1020 can be accessed by handler 3830 and moved toprinthead management system 2700 through gate 1024 while opening 1022can be closed using various embodiments of a structural enclosure oreffectively sealed using various embodiments of a dynamic closure tomaintain gas enclosure system 507 in an inert environment. Conversely,parts needing replacement can be removed from printhead managementsystem 2700 by handler 3830 through gate 1024 while opening 1022 isclosed using various embodiments of a structural enclosure oreffectively sealed using various embodiments of a dynamic closure andplaced in auxiliary enclosure 1020. In a subsequent step, while gate1024 is closed, retrieval or removed parts from auxiliary enclosure 3550as well as transfer of replacement parts to auxiliary enclosure 3550 canbe done by a handler or end-user located in ambient air at the exteriorof gas enclosure system 506 of FIG. 30A and FIG. 30B. All stepsassociated with a printhead management procedure can be done toeliminate or minimize the exposure of a printing system enclosure tocontamination, such as air and water vapor and various organic vapors,as well as particulate contamination. According to various systems andmethods of the present teachings, a printing system enclosure may beintroduced to a level of contamination that is sufficiently low that apurification system can remove the contamination before it can affect aprinting process. In that regard, various embodiments of gas enclosuresystem 507 of FIG. 30A and FIG. 30B can provide for fully automatedreplacement of a part in a printhead management system while maintainingan inert, particle-free environment and with little or no interruptionof a printing process.

In FIG. 30C, for various embodiments of a printhead replacementprocedure as described for FIG. 30A and FIG. 30B, an end-user canremotely perform through the manipulations recited as being performed bya handler remotely through various gloveports. Though two gloveport areshown in FIG. 30C, it can be appreciated that gloveports can be placedin several places for the purpose of providing remote access to variouslocations, for example, as previously shown in FIG. 1 for gas enclosureassembly 100 and as shown in FIG. 24B.

All publications, patents, and patent applications mentioned in thisspecification are herein incorporated by reference to the same extent asif each individual publication, patent, or patent application wasspecifically and individually indicated to be incorporated by reference.

While embodiments of the present disclosure have been shown anddescribed herein, it will be obvious to those skilled in the art thatsuch embodiments are provided by way of example only. Numerousvariations, changes, and substitutions will now occur to those skilledin the art without departing from the disclosure. It should beunderstood that various alternatives to the embodiments of thedisclosure described herein may be employed in practicing thedisclosure. It is intended that the following claims define the scope ofthe disclosure and that methods and structures within the scope of theseclaims and their equivalents be covered thereby.

What is claimed is:
 1. A method for the automated maintenance of anindustrial printing system, the method comprising: maintaining an inertgas environment in a gas enclosure; said gas enclosure defining a totalenclosure volume, the gas enclosure comprising: a printing systemenclosure defining a first volume of the total gas enclosure volume, theprinting system enclosure housing a printing system, the printing systemcomprising a substrate support apparatus to support a substrate and aprinthead assembly to deposit organic material on a substrate supportedby the substrate support apparatus in the printing system enclosure; anauxiliary enclosure defining a second volume of the total gas enclosurevolume adjacent the printing system enclosure; and a first sealableopening allowing access between the printing system enclosure and theauxiliary enclosure; wherein for maintaining an inert environment in theprinting system enclosure, when the first sealable opening is opened,the auxiliary enclosure is maintained in an inert environment;positioning a handler proximal to the first sealable opening between theprinting system enclosure and the auxiliary enclosure; removing acomponent part of the printhead assembly using the handler; and movingthe removed component part to the auxiliary enclosure using the handler.2. The method of claim 1, further comprising, removing the removedcomponent part from the auxiliary chamber through a second sealableopening between the auxiliary chamber and an environment exterior to thegas enclosure, wherein the first sealable opening between the printingsystem enclosure and the auxiliary enclosure is sealed when theauxiliary enclosure is exposed to a non-inert gas.
 3. The method ofclaim 1, further comprising: retrieving a replacement component part forthe printing system using the handler; and inserting the replacementcomponent part into the printing system using the handler; whereinretrieving and inserting the replacement component part occurs afterremoving the component part from the printing system or after moving theremoved component part to the auxiliary enclosure.
 4. The method ofclaim 2, further comprising: placing a replacement component part forthe printing system into the auxiliary enclosure while the secondsealable opening is opened; closing the second sealable opening; andrecovering the gas environment of the auxiliary enclosure to an inertgas environment; wherein removing the removed component part from theauxiliary enclosure and placing a replacement component part into theauxiliary enclosure can be done in any order.
 5. The method of claim 1,wherein the second volume of the auxiliary enclosure is between about 1%to about 10% of the total volume of the gas enclosure.
 6. The method ofclaim 1, wherein the printing system is configured to print an OLEDsubstrate having a size of between about generation 3.5 to aboutgeneration
 10. 7. The method of claim 1, wherein maintaining the inertgas environment of the gas enclosure comprises using nitrogen.
 8. Themethod of claim 1, wherein maintaining the inert gas environment of thegas enclosure comprises using any of the noble gases, combinationsthereof, and combinations with nitrogen.
 9. The method of claim 1,wherein the inert gas environment of the gas enclosure comprises waterand oxygen each at a level of of 1 ppm or less.
 10. The method of claim1, wherein the inert gas environment of the gas enclosure compriseswater and oxygen each at a level of of 100 ppm or less.
 11. The methodof claim 1, wherein the handler has an end effector.
 12. The method ofclaim 11, wherein the end effector is selected from a blade-type endeffector, a gripper-type end effector and a clamp-type effector.
 13. Themethod of claim 1, wherein positioning the handler proximal to the firstsealable opening is done when the handler is located in the printingsystem enclosure.
 14. The method of claim 1, wherein positioning thehandler proximal to the first sealable opening is done when the handleris located in the auxiliary enclosure.
 15. The method of claim 1,wherein the auxiliary enclosure defining a second volume is an adaptablecontrolled-environment enclosure.
 16. The method of claim 15, whereinthe adaptable controlled-environment enclosure is readily movable. 17.The method of claim 1, wherein the auxiliary enclosure is a transferchamber.
 18. The method of claim 1, wherein the auxiliary enclosure is aload lock chamber.
 19. The method of claim 1, wherein the substratesupport apparatus is a floatation table and the method further comprisessupporting a substrate in the printing system enclosure relative to theprinting system using the floatation table.
 20. The method of claim 19,wherein the substrate has a size of between about generation 3.5 toabout generation
 10. 21. The method of claim 3, wherein the replacementcomponent part is chosen from an ink cartridge and a printhead.
 22. Themethod of claim 1, wherein the component part is chosen from an inkcartridge and a printhead.
 23. The method of claim 1, further comprisingperforming, in the auxiliary enclosure, at least one of a maintenancetask or a measurement task on the printhead assembly.
 24. The method ofclaim 1, further comprising depositing an organic material from theprinting system onto a substrate supported in the printing systemenclosure.
 25. The method of claim 24, wherein the depositing occursbefore the positioning, removing, and moving.
 26. The method of claim24, wherein the organic material is a material used in forming anorganic light emitting diode display.